• Journal of the Korean institute of surface engineering
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• v.22 no.4
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• pp.168-178
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• 1989

The compositions and microstructures of Pb-Sn alloy electrodeposits were investigated in terms of the electrolysis conditions conditions by using fluoborate bath. The Pb content of alloy deposit decreased with increasing dreasing current density until the limting content was obtained. The proferred orientation of Pb-phase in the alloy changed in the sequence of (110)longrightarrow(100)longrightarrow(100)+(110)(311)longrightarrowrandom distribution of crystals with increasing cathode overpotential, while that of $\beta$-Sn phase was (110)(301)(211)n mixed texture. The smooth surface with granular crystallites was obtained below medium current desity, while the rough surface texture was formed at high current density.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.1-6
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• 1995

Sn-Pb계 솔더는 용접, 접합성, 가격등과, 작업성이 양호하기 때문에 전자기기 실장에 사용되어 왔고, 모든 실장장치도 Sn-Pb 솔더용으로 만들어져 있다. 그러나 솔더중의 Pb는 사용할 수 없다는 분위기가 점차 확산되고 있다. 이것은 Pb가 인체에 들어가면 중추신경을 손상시킨다고 알고 있기 때문이다. Pb의 사용 규제 조치에 대해 서는 10년전 부터 미국 국회에 몇번이나 상정된 바가 있지만, Pb피해에 대해서 입증 할 수 없다는 이유로 입안이 되지 않았지만, 실제는 대체합금이 없기 때문에 입안이 되지 않은 것으로 알려져 있다. 그러나 앞으로 5년 이내에 유예기간을 두고 2000년 이후 부터 사용을 규제할 것으로 알려져 있다. 또한 북유럽에는 Pb 솔더 금지법이 의회에 제출되어 있는 것으로 알려져 있고, 곧 OECD에서도 상정될 예정이다. 결국 지구상의 환경보호 차원에서 앞으로 Pb사용이 규제될 것임은 틀립이 없다. 따라서 Pb 가 함유되어 있지 않은 솔더의 개발은 각나라 마다 핫 이슈임에 틀림이 없다. 미국 AT&T 등에서 이미 Pb Free 솔더와 공정개발에 들어가 특허화하고 있고, 특히 유럽은 연구 개발이 왕성하여 Pb Free 솔더로서 실장한 핸더폰을 생산하는 실적까지 있다. 일본도 이미 대학, 연구소, 회사로 구성된 Pb Free 솔더 연구회가 구성되어 솔더개발 에 박차를 가하고 있다. 국내에 기업체, 연구소, 학교 등에서는 이러한 긴박감을 느 끼지 못하는 것으로 사료된다. 본 해설에서는 Sn-Pb 공정계 대체 솔더인 Pb Free 솔더 의 개발 방향과 문제점을 정리하여 기술하고자 한다.

• Proceedings of the KWS Conference
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• 1992.04a
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• pp.67-68
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• 1992

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.251-254
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.17-18
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• 1992

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.61-62
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• 1999

• Proceedings of the KWS Conference
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• 1992.10a
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• pp.144-146
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• 1992

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.81-86
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• 2000

To evaluate the possibility of the partial melting soldering. wettability of partial melted solders was measured using wetting balance. Off eutectic Sn-Pb allows are wettable in their partial melting zone. Especially, Pb rich alloys showed excellent wettability while wettability of Sn rich alloys were adequate or poor. It is found that wettability increases over $200^{\circ}C$ regardless of composition liquid fraction and phases of the original alloy Sn-7Ag alloy showed good wettability in their partial melting zone, while Sn-65Bi alloy was non-wettable under their melting points.

• Journal of Welding and Joining
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• v.18 no.6
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.