• Journal of the Korean Applied Science and Technology
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• v.25 no.4
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• pp.518-524
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• 2008

In this study, positive plates of lead acid battery of Pb-Ca alloy and Pb-Ca-Sn alloy were fabricated and the mechanical characteristics of positive plates were measured. This study observed how the changes of content of Ca & Sn affect interface corrosion which is located in between grid & active materials and lead acid batteries as well. The mechanical characteristics of grid alloy is better when Ca is 0.05 wt.% then 0.1 wt.%. This study said that the corrosion rate between the active material based on the charge/discharge cycle of lead acid battery and grid interface is much faster than a grid which contains Sn. And furthermore, according to the study the rate 30 of Sn/Ca which is added to grid shows the best performance.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• Journal of Conservation Science
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• v.35 no.4
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• pp.309-316
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• 2019

This study intends to identify manufacturing techniques, including casting and alloy composition, of nine metal Buddha statues excavated from archaeological sites in Bagan, Myanmar. Two Buddha statues from Pyu city state(2^nd to 9^th century) contain Cu-Sn alloy(including <1 wt% Fe), with different relatively high percentages of Sn(16 wt% and 25 wt%) identified from each Buddha statue, and no Pb detected. Five Buddha statues from the Bagan dynasty contain various alloy ratios of Cu-Sn(including <1 wt% Pb), Cu-Sn-Pb, and Cu-Sn-Zn-Pb. All Buddha statues appear to be fabricated by casting, as there is no evidence of other heat treatments. The silver Buddha statue manufactured in the 18^th century includes >1% Cu besides silver with no additional metallic components identified. The bronze Buddha statue manufactured in the Konbaung dynasty(18^th century) is of Cu-Sn-Pb alloy. The Buddha statues of Pyu was alloy of Cu-Sn without Pb including ahigh percentage of The Buddha statues of both the Bagan and Konbaung dynasties are comprised of ternary Cu-Sn-Pb alloys, with a heterogeneous distribution of lead and tin. Some of Buddha statues of the Bagan dynasty have similar alloy ratios as those of Pyu, suggesting that similar manufacturing techniques were used.

• Journal of Korea Foundry Society
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• v.12 no.3
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• pp.210-219
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• 1992

The measurement of the apparent and tap density for Al-Pb-X(Sn,Sn-Si) powders produced by centrifugal atomizer showed that the larger theoretically calculated densities the larger those densities. And tap densities were not over 50% of the theoretical densities. The nip angle of Al-5wt%Pb alloy powders produced with 38000 r.p.m. of disk rotation was $3^{\circ}$ degree larger than that of Al-8.5wt%Pb-3wt%Sn(-4wt%Si, 8wt%Si) with 50000 r.p.m. The effects of roll gap and rolling speed on thickness and density of the single strips by rolling were that rolling speed increasing the thickness and density of strip decreased and roll gap increasing, the thickness of strip increased but the density decresed. The compactibility of Al-Pb-X with Al by rerolling showed that the coarse powder-strips were better than fine powder-strips. From the SEM study with EDX analysis on the sintered strips, it was found that Pb and Sn were segregated with maximum size $5{\mu}m$, and Si existed surrounding the segregation zone. After sintering the clad strips at $500^{\circ}C$, the pores, which were spherical with $5{\mu}m$ of mean diameter, partly remained around the particles of alloy powders area, while completely disappeared at clad interface. The hardness of strips of alloy powders decreased linearly with increasing sintering temperature.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.25-30
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• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.147-163
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• 2003

European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.74-76
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• 1989

x Pb($Sb_{1/2}Sn_{1/2}O_3-PbTiO_3-PbZrO_30.05{\leq}x{\leq}0.25$) ternary compound ceramics were fabricated by the mixed oxide method. The sintering temperature and time were 1200-1270[$^{\circ}C$], 2 hour, respectively. Increasing the PSS contents, the transition temperatures were decreased. The relative dielectric constant and Curie temperature of the 0.25 PSS-0.25 PT-0.5 PZ specimens were 450, 220[$^{\circ}C$]. The Pyroelectric coefficient of the 0.25PSS-0.25PT-0.50 PZ specimen was $5.20{\times}10^4$[C$\textrm{cm}^2$K].

• Electrical & Electronic Materials
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• v.4 no.3
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• pp.220-228
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• 1991

본 연구에서는 핫프레스법으로 제작된 0.05Pb(Sn$_{1}$2/Sb$_{1}$2/)O$_{3}$-0.60PbZrO$_{3}$-0.35PbTiO$_{3}$+x[wt%]MnO$_{2}$ 세라믹스에 대해 구조적, 전기적 특성 및 탄성 표면파 특성을 조사하였다. x가 0.4인 조성을 1150[.deg.C]에서 45분간 소성한 시편의 경우 탄성표명파의 전기 기계 결합 계수 k$_{s}$ $^{2}$가 2.8[%], 기계적 품질 계수 Q$_{m}$ 이 1976으로 탄성 표면파 소자용 기판으로서 응용 가능함을 보였다.