• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.53-58
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• 2004

To facilitate the observation of the electromigration of 63Sn-37Pb eutectic solder, strip-type samples were fabricated by solder evaporation. The electromigration test for the 63Sn-37Pb solder strip was conducted at temperatures of $80{\sim}150^{\circ}C$ and the current densities of $1{\times}10^4{\sim}1{\times}10^5\;A/cm^2$. With increasing temperature and the current density, mean-time-to-failure(MTTF) decreased due to the formation of hillock and void in the solder strip. The activation energy for the electromigration in the 63Sn-37Pb solder strip was analyzed as $0.16{\sim}0.5\;eV$ using Black's equation.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.43-47
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• 2001

Sn-3Ag-8Bi-5In was developed for the intermediate melting point solder. Although In-contained solder is expensive, its melting point is lower than these of Sn-Ag-Cu alloys. Sn-3Ag-8Bi-5In solder used for this research has a melting range of 188~$204^{\circ}C$. On this study wetting characteristics of Sn-3Ag-8Bi-5In were evaluated in order to investigate its availability as a Pb-free solder. Wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-3Ag-8Bi-5In. Experimental results showed that the zero-cross-time and wetting time at $240^{\circ}C$ for the Sn-3Ag-8Bi-5In were 1.1 and 2.2 second respectively. These values are a little better than these of Sn-37Pb and Sn-3.5Ag solders. The equilibrium wetting farce of the Sn-3Ag-8Bi-5In was 5.8 mN at $240^{\circ}C$, and it was tuned out to be a little higher than that of Sn-3.5Ag and lower than that of Sn-37Pb.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.83-85
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• 2003

This paper is investigated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which would be surely applicable to the electronic packages. As a result, in case of Max. shear strength, Sn-4Ag-0.5Cu has the highest value and Sn-37Pb has the lowest value on every condition of experiment temperature. Also, In case of Pb-free solder joint specimens, it was found that Pb-free solder alloys have higher value of shear strength than eutectic Sn-Pb solder alloy and Sn-4Ag-0.5Cu has the highest value.

• Journal of Food Hygiene and Safety
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• v.14 no.1
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• pp.115-121
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• 1999

The effect of storage temperature and time on the contents of metal (Pb, Sn and Fe), vitamin C, color and pH was studied for canned pineapple juice (PJ) and pineapple slice (PS) which were stored for 120 hours at 5 and 2$0^{\circ}C$ and analyzed at 24 hours intervals. The results are as follows; 1. The metal contents of PJ and PS were in the rank of 24<48<72<96<120 hours by storage time at 5 and 2$0^{\circ}C$. These contents were increased to 44.1%/24 hrs of Ph, 18.0%/24 hrs of Sn, 34.6%/24 hrs of Fe but decreased to 6.0%/24 hrs of vitamin C in PJ and PS during 120 hrs. Storage times were correlation to contents of metal and pH but was not correlation to vitamin C contents. These were increased to 37.7%/24 hrs of Pb, 18.8%/24 hrs of Sn, 34.6%/24 hrs of Fe, but decreased to 6.0%/24 hrs of vitamin C. 2. These were increased to 10.6% of Pb, 3.7% of Sn, 11.3% of Fe in PJ and to 33.7% of Pb, 4.8% of Sn, 37.6% of Fe in PS at 2$0^{\circ}C$ than 5$^{\circ}C$ but vitamin C contents were decreased to 8.2% in PJ and 2.7% in PS at 2$0^{\circ}C$ than 5$^{\circ}C$. This fact suggests that more attention be paid in handling canned PJ and PS after opening in order to avoid the decreasing vitamin C and the hazard from Pb, Sn, Fe. 3. Changing factors in Pb, Sn, Fe and vatiamin C content were in the rank of storage temperature$0^{\circ}C$.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.1
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.47-52
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• 2005

Worldwide movement for prohibition of Pb usage drives imminent implementation of Pb-free solders in microelectronic packaging industry. Reliability information of Pb-free solders has not been completely constructed yet. One of the potential reliability concerns of Pb-free solders is allotropic transformation of Sn known as tin pest. Volume increase during the formation of tin pest could deteriorate the reliability of solder joints. It was also reported that the addition of soluble elements (i.e. Pb, Bi, and Sb) into Sn can effectively suppress the tin pest. However, the mechanical properties of the tin pest resistant alloys have not been studied in detail. In this study, lap shear creep test was conducted with Sn and Sn-0.7Cu based solder alloys doped with minor amount of Bi or Sb. Shear strain rates of the alloy were generally higher than those of Sn-3.5Ag based alloys. Rupture strains and corresponding Monkman- Grant products were largest for Sn-0.5Bi alloy and smallest for Sn-0.7Cu-0.5Sb alloy. Rupture surface Sn-0.5Bi alloy showed highly elongated $\beta$-Sn globules necked to rupture by shear stresses, while elongation of $\beta$-Sn globules of Sn-0.7Cu-0.5Sb alloy was relatively smaller.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.217-220
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• 2014

We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in the contact angle of the liquid Sn-Pb solder and an increase in the surface energy of the solid/vapor on the curved Cu surface. We suggest a new ribbon's design where the Cu wire's cross-section is a semi-ellipse. These semi-ellipse ribbons can decrease the use of Sn-Pb solder to 64% and increase the photovoltaic efficiency, by reducing the contact area between the ribbon and cell, to 84%. We also see an improvement of reflectivity in the curved surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.05a
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• pp.5-8
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• 1995

The crystal structure and dielectric propoerties of $(Pb_{1-x}Ca_x)(Zr_{1-y}Sn_y)O_3$ Ceramics were investigated. Sn substitution reduced the volitility of PbO due to the decrease of the unit cell. The crystal structure of $(Pb_{1-x}Ca_x)(Zr_{1-y}Sn_y)O_3$ Ceramics was refined based on Orthorhombic Cmmm space group, More than two types of phase transition were observed, These phase transitons make the posicitve and negative temperature coefficient of dielectric constant of $(Pb_{1-x}Ca_x)(Zr_{1-y}Sn_y)O_3$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.105-110
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• 2004

방사선 투시조영 촬영 시 사용되는 방호복의 차폐효율 증가와 경량화는 오랜 시간 연구 대상이 되었다. 이러한 방호복의 질적 향상을 위하여 연구한 결과는 다음과 같다. Apron의 규격인 납 당량 0.25mm에 해당하는 투과선량은 5.2%로 나타났으며, 시료 Sn, Ni, Ti, Cu의 방사선 차폐 효율은 Sn이 가장 높게 나타났다. 증착시료 Sn+Pb 방법에서는 Sn 0.18mm와 Pb 0.1mm, Pb+Sn 방법에서는 Pb 0.1mm와 Sn 0.36mm에서 Apron의 규격인 납 0.25mm 두께로 나타났다. 증착시료 Sn+Pb는 Apron의 규격인 0.25mm 납 당량보다 차폐효율이 높고, 면적당 무게가 가벼워 방호복 물질로 적합한 것으로 사료된다.

• Journal of the Korean Ceramic Society
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• v.26 no.6
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• pp.755-762
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• 1989

A pyroelectric ceramic material based on Pb(Sn1/2Sb1/2)O3 modified PZT system is studied as a function of the amount of Pb(Sn1/2Sb1/2)O3 and PbTiO3. With increasing the Pb(Sn1/2Sb1/2)O3 amount the dielectric constant increases up to 10mol% and then decreases, but the pyroelectric coefficient decreases and as the PbTiO3 contents increase in the 10mol% added PZT system, the dielectric constant increases but the infrared sensitivity decreases. The good pyroelectric material has low dielectric constant and no pyrochlore phase, but does not depend in the amount of remanent dipole, and its composition sites around ferroelectric-to-antiferroelectric phase boundary.