• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1991.10a
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• pp.68-72
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• 1991

In this study, to improve temperature stability 0.05 Pb(Sn$\_$$\frac{1}{2}$/Sb$\_$$\frac{1}{2}$/O$_3$ - 0.35PbTiO$_3$ - 0.60PbZrO$_3$ + 0.4[wt%]MnO$_2$ piezoelctric oeramics of low dielectric constant and large mechanical quality factor were manufactured with the addition of Cr$_2$O$_3$by Hot Press method. And the SAW delay line was fabricated and the propagation characteristics of SAW was investigated, and the SAW filter was fabricated on C4 added by 0.2[wt%] Cr$_2$O$_3$and its frequency characteristics was investigated. The specimen, whose propagation characteristics of surface acoustic wave were the best, was C4 added by 0.2[wt%] Cr$_2$O$_3$, and its electromechanical coupling factor(ks$^2$) was 3.11[%] and its temperature coefficient of the center frequency (C$\_$fo/) was -21.27[ppm/$^{\circ}C$]. The 31[MHz] SAW IF filter of C4 scarcely had diffraction phenomena and its group delay time was 1.4673 ${\pm}$40[ns] in the pass band, and the insertion loss was -24.419[dB] on no impedance matching.

• Korean Journal of Food Science and Technology
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• v.35 no.4
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• pp.561-567
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• 2003

This study was conducted to estimate the heavy metal contents in various foods (n=696). The contents of lead (Pb), cadmium (Cd) and tin (Sn) were determined using and ICP (inductively coupled plasma spectrometer). The content of mercury (Hg) was determined using a mercury analyzer. The values of heavy metals in canned foods were as follows [minimum-maximum (mean), mg/kg]; Pb 0.001${\sim}$0.36 (0.10), Cd 0.001${\sim}$0.10 (0.04), Sn 0.01${\sim}$24.75 (2.60). The mean values of Pb and Cd in animal foods were 0.40 mg/kg and 0.03 mg/kg. Also, the mean values of heavy metals in vegetables and potatoes were 0.03 mg/kg for Pb, 0.02 mg/kg for Cd, 0.001 mg/kg for Hg, respectively. The mean values of Hg in fishes and canned fishes were 0.08 mg/kg and 0.04 mg/kg. Our results showed that heavy metal contents in various foods available on markets were similar to those reported in other countries.

• Progress in Superconductivity
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• v.14 no.1
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• pp.1-10
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• 2012

We fabricated a closed coils by using resistive-joint method and the joint resistance of the coils were estimated by field decay technique in liquid nitrogen. We used the Runge-kutta method for the numerical analysis to calculate the decay properties. The closed coil was wound by $(Bi,Pb)_2Sr_2Ca_2Cu_3O_x$/Ag tape. Both ends the tape were overlapped and soldered to each other. The current was induced in a closed coils by external magnetic flux density. Its decay characteristic was observed by means of measuring the magnetic flux density generated by induced current at the center of the closed coil with hall sensor. The joint resistance was calculated as the ratio of the inductance of the loop to the time constants. The joint resistances were evaluated as a function of critical current of loop, contact length, sweep time, and external magnetic flux density in a contact length of 7 cm. It was observed that joint resistance was dependent on contact length of a closed coil, but independent of critical current, sweep time, and external magnetic flux density. The joint resistance was measured to be higher for a standard four-probe method, compared with that for the field decay technique. This implies that noise of measurement in a standard four-probe method is larger than that of field decay technique. It was estimated that joint resistance was $8.0{\times}10^{-9}{\Omega}$ to $11.4{\times}10^{-9}{\Omega}$ for coils of contact length for 7 cm. It was found that 40Pb/60Sn solder are unsuitable for persistent mode.

• Membrane Journal
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• v.19 no.4
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• pp.333-340
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• 2009

This paper is designed with the purpose of improving the efficiency of the sulfonic acid ion exchange membranes by radiation induced graft polymerization. It has been shown that the porous hollow fiber membranes could cause permeability blocking between pores and ion exchanged graft chains. Addition of crosslinker such as N-ethylene glycol dimethacrylate will permit to increase the permeation flux. In this research, the ethylene glycol dimethacrylate (EDMA) and diethylene glycol dimethacrylate (DDMA) with different length are used as crosslinkers. The ion exchanged cross-linked membrane (EDMA, DDMA) containing sulfonic acid group by radiation induced grafted polymerization are sn died for adsorb metal ions (Pb). It has been shown that adsorbed metal ions ($Pb^{2+}$) for the EDMA and DDMA membranes with the density of sulfonic acid groups, 1.40 mmol/g and 2.14 mmol/g, respectively are 13.82 mg/g, 17.37 mg/g, accordingly.

• Journal of Food Hygiene and Safety
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• v.14 no.3
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• pp.305-318
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• 1999

This study were conducted to estimate the values of the heavy metal in the fresh water fish and shellfish collected from fish market. The levels of the heavy metal were determined in a total of 319 samples of 11 species of the fresh water fish and 14 species of the shellfish by mercury analyzer and atomic absorption spectrophotometer. The results of this study were summerized as follows; The average contents of the heavy metal in the fresh water fish were Pb 0.075, Hg 0.05:3, Cd 0.002, Cr 0.135, Fe 8.695, Mn 1.078, Zn 9A91, Cu 0.548 mg/ kg. The average contents of the heavy metal in the shellfish were Pb 0.059. Hg 0.007, Cd 0.146, Cr 0.147, Fe 40.808, Mn 7.738, Zn 13.943, Cu 2.7:31 mg/kg. Being compared the average contents of the heavy metal of the fresh water fish with those of shellfish, the average contents of Cd, Fe, Mn, Cu in the shellfish were significantly higher than in the fresh water fish(P<0.001). Depending on the sampling areas, the average contents of the heavy metal were different by districts. The contents of the heavy metal were changed with the seasons(P<0.05).

• Korean Journal of Food Science and Technology
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• v.27 no.5
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• pp.748-752
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• 1995

Canned and bottled orange juices currently sold in Korean market were stored for 24 weeks at 20, 30, 40 and $50^{\circ}C$ and analyzed after opening at 4 week intervals. Activation energy, $Q_{10}$ values and shelf-life at respective temperatures were calculated from the data on various quality indexes. Proposed indexes were lead, tin, iron and vitamin C contents in canned juices and vitamin C content and browning index in bottled juices and $Q_{10}$ values for these parameters were in the range of $1.3{\sim}2.0$. Shelf-life calculated for canned juices at 10, 20 and $30^{\circ}C$ were 10, 6 and 3 months and that in bottled juices, 24, 12 and 6 months, respectively. When the distribution temperature of juices in Korea is assumed to be $15^{\circ}C$ average, the optimum shelf-life was estimated to be 8 months in canned juices and 18 months in bottled juices. In order to ascertain the safety of canned orange juices, efforts are needed to re-examine the recommended distribution period, legal limit for lead and improvement of container materials.

• Conservation Science in Museum
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• v.1
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• pp.61-74
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• 1999

Elemental analysis of 40 glass samples from the Northern Tomb and the Southern Tomb of Hwangnam-daech'ong No. 98 was performed. Fourteen compositions of each sample were analyzed quantitatively by SEM-EDS and glass samples were classified by multivariate analysis such as PCA. All of 40 samples were confirmed to be Na₂O-CaO-SiO₂ system with about 20% of Na₂O. Samples were classified into two groups by doing PCA on concentrations of 5 major elements(SiO₂, Al₂O₃, Na₂O, CaO and K₂O). Samples included in group I showed the concentration of Al₂O₃ is about 9.7% and that of CaO, about 2.2%. In group II, concentration of Al₂O₃ is about 3.2% and that of CaO, about 4.9%. Especially yellow grains embedded in sample No. 12 were shown to be PbSnO₃ by micro XRD, which was the first coloring material ever found in Korea. Lead isotope ratios of samples No. 12 and No. 17 which contained lead were measured by TIMS. The origin of lead was traced by means of multivariate analysis such as SLDA. The result showed that lead from southern China and southern Korea had been used for making glass.

• Journal of Welding and Joining
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• v.27 no.1
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• pp.85-89
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• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• Korean Journal of Veterinary Service
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• v.33 no.3
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• pp.213-221
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• 2010

The results from a total of 412 blood samples consisted of 187 samples from regular visiting group (RV), 94 samples from first visiting group (FV), 52 samples from abandoned group (A), 54 samples from special breeder group (SB), and 25 samples from preliminary breeder group (PB) showed that RV(94.7%) and SB(88.9%) groups had the higher levels of protective antibody, but PB (36.0%) group revealed the lowest level. Among 96 blood samples with lower protective antibody levels, 14 samples (14.6%), 72 samples (75.0%) and 10 samples (10.4%) were below the protective antibody levels to distemper/parvo-virus, distemper only and parvovirus only, respectively. These results implied that antibody to parvovirus was well generated than that to distemper. Eighty six samples (20.9%) showed the protective antibody titer under 1:96 to distemper and 24 samples (5.8%), the protective antibody titer under 1:40 to parvovirus.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.