• Title/Summary/Keyword: Sn/3.5%Ag

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A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints (자동차 전장부품 무연솔더 접합부의 파괴모드 특성에 관한 연구)

  • Jeon, Yu-Jae;Kim, Do-Seok;Shin, Young-Eui
    • Transactions of the Korean Society of Automotive Engineers
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    • v.19 no.6
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    • pp.90-96
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    • 2011
  • In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

Solder Joints Fatigue Life of BGA Package with OSP and ENIG Surface Finish (OSP와 ENIG 표면처리에 따른 BGA 패키지의 무연솔더 접합부 피로수명)

  • Oh, Chulmin;Park, Nochang;Hong, Wonsik
    • Korean Journal of Metals and Materials
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    • v.46 no.2
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    • pp.80-87
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    • 2008
  • Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

Bronze Production Technology in the Early Iron Age: A comparative study of bronze artifacts recovered from the Hoam-dong site in Chungju and Chongsong-ri in Buyeo (초기철기시대 청동기의 제작기술 - 충주 호암동유적과 부여 청송리유적 출토 청동기의 비교 연구-)

  • Han, Woorim;Hwang, Jinju;Kim, Sojin
    • Korean Journal of Heritage: History & Science
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    • v.51 no.4
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    • pp.224-233
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    • 2018
  • Thirty-three Early Iron Age bronzes at the sites of Hoam-dong in Chungju and Cheongsong-ri in Buyeo were investigated in order to study the manufacturing technique and the provenance of lead. Chemical analysis using X-ray fluorescence showed that 33 bronzes consist of copper(Cu), tin(Sn) and lead(Pb) served as major elements. Major and minor elemental analyses by EPMA were performed on two mirrors and 2 weapons of the bronzes investigated. The results shows that bronze mirrors from Chungju and Buyeo were high-tin bronzes(> 30 wt%). And 20% of tin and 5% of lead were founded in bronze weapons. Iron, zinc, arsenic, silver, nickel, sulfur and cobalt detected in four bronzes as minor and trace elements. The four bronzes were alloyed considering their function and were not heat treated after casting due to their high tin content. Lead isotope analysis using TIMS indicates that thirty-three bronzes were distributed southern Korea peninsula except Zone 1. As a result, lead raw materials came from various regions in Korean Peninsula not from Gyeongsang-do regions. The manufacturing techniques of bronze ware generalized at this age, and bronze was produced in various sites using raw materials from various sources.

The Proteinase Distributed in the Intestinal Organs of Fish 2. Characterization of the Three Alkaline Proteinases from the Pyloric Caeca of Mackerel, Scomber japonicus (어류의 장기조직에 분포하는 단백질분해효소에 관한 연구 2. 고등어 유문수조직중에 분포하는 3종 알칼리성 단백질분해효소의 특성)

  • KIM Hyeung-Rak;PYEUN Jae-Hyeung
    • Korean Journal of Fisheries and Aquatic Sciences
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    • v.19 no.6
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    • pp.547-557
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    • 1986
  • The characteristics of the three alkaline proteinases, Enz. A, B and C, from the pyloric caeca of mackerel have been investigated. The optimum condition for the activity of the Enz. A, B and C was pH 9.4, 9.8 and 9.8 at $45^{\circ}C$ for $2\%$ casein solution, and was pH 9.2 10.2 and 9.8 at $45^{\circ}C$ for $5\%$ hemoglobin denatured by urea, respectively. Enz. A, B and C by heat treatment at $50^{\circ}C$ for 5 min were inactivated 90, 33 and $37\%$, respectively, over the original activity. The reaction rate of the three alkaline proteinases was constant to the reaction time to 40 min in the reaction condition of $2{\mu}g/ml$ of enzyme concentration and $2\%$ casein solution. The reaction rate equation and Km value against casein substrate determined by the method of Lineweaver and Burk were: Enz. A, Y=3.6X and $Km=5.0{\times}10^{-3}\%$; Enz. B, Y=6.0X and $Km=1.0{\times}10^{-3}\%$; Enz. C, Y=4.2X and $Km=3.6{\times}10^{-3}\%$. The three alkaline proteinases were inactivated by $Ag^+$ and $Hg^{2+}$, but activated by $Mn^{2+},\;Sn^{2+}\;and\;Pb^{2+}$, Enz. B and C were remarkably inhibited by the soybean trypsin inhibitor. Molecular weight of Enz. A, B and C determined by SDS-polyacrylamide gel electrophoresis and Sephadex G-100 gel filtration was in the range of $27,500{\pm}2,500,\;20,500{\pm}1,500\;and\;15,250{\pm}250$, respectively.

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Properties of an Extracellular 5-Fluorocytosine Deaminase (세포외 5-Fluorocytosine Deaminase의 특성)

  • Yeeh, Yeehn;Jun, Hong-Ki;Yoon, Yong-Kyun
    • Microbiology and Biotechnology Letters
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    • v.20 no.2
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    • pp.150-155
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    • 1992
  • - Some properties of an extracellular cytosine deaminase excreted from an isolate from soil samples were examined after 20~80%' ammonium sulfate fractionation. The enzyme catalyzed the conversion of cytosine and 5-fluorocytosine into uracil and 5-fluorouracil by substrate specificity, respectively. The optimum temperature and storage time on the stability of the enzvme preparation were below $50^{\circ}C$ keeping above 90% of the residual activity and near 4 days keeping above 80% of the residual one in Tris-HCI buffer. The maximum activity was also obtained at 8.0 in pH and 37'C in temperature. The pHs and temperatures for enzyme activity ranged from 8.0~8.5 and from 37~$45^{\circ}C$. respectively. The presence of $Ag^-,Hg^{2-}, Zn^{2-}, Cu^{2-}, Sn^{2-}, \; or\; Pb^{2-}$ in the reaction mixture resulted in the marked inhibition in enzyme activity, but 1 mM of $K^+, Fe^[3+}, Mg^{2+}, \; or \; Na^+$. slightly increased the activity. The enzyme preparation was heavily affected by most of inhibitors tested such as 1 mM of EIITA, NaCN and pentachlorophenol, and completely inactivated by p-CMB and TCA of 1 mM, or 10 mM.

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A STUDY ON THE MICROSTRUCTURES OF THE AMALGAM ALLOYS AND AMALGAMS (치과용 아말감합금 및 아말감의 마세구조에 관한 연구)

  • Yeon, Sang-Heum;Lee, Chung-Sik;Lee, Myung-Jong;Um, Chung-Moon
    • Restorative Dentistry and Endodontics
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    • v.21 no.1
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    • pp.87-105
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    • 1996
  • The purpose of this study is to investigate the characteristics of the compositions and phases of amalgam alloys and amalgams by using EMPA and X-ray diffractometer. Each specimen was made from Caulk Fine Cut Clow copper lathe cut amalgam), Caulk Spherical (low copper spherical amalgam), Tytin (high copper unicorn position amalgam), Dispersally (high copper admixed amalgam) and Valiant (Palladium enriched amalgam). For preparing amalgam alloys, Tytin and Valiant were used as powder forms and the others were used as tablet forms after being polished with polishing machine. For preparing amalgams, each amalgam alloy and Hg were measured, and triturated by mechanical amalgamater according to user's instructions. After triturating, the triturated mass was inserted to cylindrical metal mold and simultaneously adapted by cylindrical condenser with same diameter and condensed by Instron universal testing machine with 80kg pressure & 1mm/min speed. Each specimen was removed from the metal mold and stored at room temperature for a week. The specimen was polished with the same polishing machine for amalgam alloy. For observation of microstructure and analysis of composition of amalgam alloys and amalgams, EMPA was used to get secondary electron images, backscattered images and characteristic X-ray images of Ag, Sn, Cu, Zn, Hg. To analyze compositions of amalgam alloys and amalgams, X-ray diffractometer was used. Amalgam alloys were scanned at the range of 2${\theta}$ of 30-$85^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line and amalgams were scanned at the range of 2${\theta}$ of 28-$44^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line. By comparing obtained d(distance between surfaces) and d of expected phases and atoms in amalgam alloys and amalgams in ASTM card, phases and atoms were identified. The results were as follows, 1. In Caulk Fine Cut amalgam alloy typical ${\gamma}$ phase was shown, and in amalgam, ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phases were observed. 2. In Caulk Spherical amalgam alloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, ${\gamma}_2$ and $\eta$ phases were observed. 3. In Tytin amalgam alloy ${\gamma}$, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 4. In Dispersalloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 5. In Valiant alloy ${\gamma}$, Cu and e phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed.

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Corrosion mitigation of photovoltaic ribbon using a sacrificial anode (희생양극을 이용한 태양광 리본의 부식 저감)

  • Oh, Wonwook;Chan, Sung-Il
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.3
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    • pp.681-686
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    • 2017
  • Degradation is commonly observed in field-aged PV modules due to corrosion of the photovoltaic ribbon. The reduced performance is caused by a loss of fill factor due to the high series resistance in the PV ribbon. This study aimed to mitigate the degradation by corrosion using five sacrificial anodes - Al, Zn and their alloys - to identify the most effective material to mitigate the corrosion of the PV ribbon. The corrosion behavior of the five sacrificial anode materials were examined by open circuit potential measurements, potentiodynamic polarization tests, and galvanic current density and potential measurements using a zero resistance ammeter. Immersion tests for 120 hours were also conducted using materials and damp heat test tests were performed for 1500 hours using 4 cell mini modules. The Al-3Mg and Al-3Zn-1Mg sacrificial anodes had a low corrosion rate and reduced drop in power, making then suitable for long-term use.

Fabrication Of Ultraviolet LED Light Source Module Of Current Limiting Diode Circuit By Using Flip Chip Micro Soldering (마이크로솔더링을 이용한 정전류다이오드 회로 자외선 LED 광원모듈 제작)

  • Park, Jong-Min;Yu, Soon Jae;Kawan, Anil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.4
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    • pp.237-240
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    • 2016
  • The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods (다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구)

  • Song, Chun-Sam;Ji, Hyun-Sik;Kim, Joo-Han;Kim, Jong-Hyeong;Ahn, Hyo-Sok
    • Journal of Welding and Joining
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    • v.26 no.3
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    • pp.30-36
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    • 2008
  • A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

Validation of sequence test method of Pb-free solder joint for automotive electronics (자동차 전장품용 무연솔더 접합부의 시리즈 시험 유효성)

  • Kim, A Young;Oh, Chul Min;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.33 no.3
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    • pp.25-31
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    • 2015
  • Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.