• Korean Journal of Agricultural Science
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• v.49 no.4
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• pp.909-921
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• 2022

Eggs are considered an excellent complete food because they contain many major energy sources, including protein. Eggs are one of the most widely consumed foods worldwide, and egg consumption is steadily increasing. Eggs are generally classified according to their quality and weight. Various characteristics of eggs must be considered for the design and effective utilization of equipment used for the transport, processing, packaging, and storage of eggs. In this study, egg surface area, volume, density, etc. were measured according to the grade of the egg. The values of several geometrical properties that were measured tended to increase with increasing egg grade. The smallest grade eggs had the lowest shell thickness and density. The electrical conductivity of the eggshell and its contents was measured with a self-made electrode and equipment. The egg shell showed properties similar to insulators, and as the thickness increased, the electrical conductivity tended to increase. The electrical conductivity of the egg yolk showed almost constant values under all conditions. The electrical conductivity of the egg white and mixture was particularly low at 0.1 kHz. Fouling and electrode corrosion occurred in a low frequency region due to the egg white. In this study, various geometric and electrical characteristics of eggs were measured, and based on this, factors that could serve as new indicators for egg processed production were analyzed and investigated.

• The Journal of Korean Institute of Information Technology
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• v.17 no.6
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• pp.9-16
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• 2019

Companies that want to improve their manufacturing processes have recently introduced the smart factory, which is particularly noticeable. The ultimate goal is to maximize the area of the smart factory that performs the process of the production facility completely with minimal manual control and to minimize errors of reasoning. This research is a part of a project for unmanned production, management, packaging, and delivery management and the detection of the start point of rebars to perform the automatic calibration of the rollers through the tracking of the automated facilities of unmanned production. It must meet the requirement to accurately track the position from the start point to the end point. In order to improve the tracking performance, it is important to set the accurate start point. However, the probability of tracking errors is high depending on environments such as illumination and dust through the conventional time-based detection method. In this paper, we propose a starting point detection method using the average brightness change of high speed IR camera to reduce the errors according to the environments, As a result, its performance is improved by more than 15%.

• International journal of advanced smart convergence
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• v.8 no.3
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• pp.39-45
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• 2019

This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.1-12
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• 2023

In the current era of the global mobile smart device revolution, electronic devices are required in all spaces that people interact with. The establishment of the internet of things (IoT) among smart devices has been recognized as a crucial objective to advance towards creating a comfortable and sustainable future society. In-mold electronic (IME) processes have gained significant industrial significance due to their ability to utilize conventional high-volume methods, which involve printing functional inks on 2D substrates, thermoforming them into 3D shapes, and injection-molded, manufacturing low-cost, lightweight, and functional components or devices. In this article, we provide an overview of IME and its latest advances in application. We review biomimetic nanomaterials for constructing self-supporting biosensor electronic materials on the body, energy storage devices, self-powered devices, and bio-monitoring technology from the perspective of in-mold electronic devices. We anticipate that IME device technology will play a critical role in establishing a human-machine interface (HMI) by converging with the rapidly growing flexible printed electronics technology, which is an integral component of the fourth industrial revolution.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.47-52
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• 2017

Recently, a great attention has been paid to the mechanical behavior of ITO (Indium Tin Oxide) film, which is widely used in current smart devices due to its excellent electrical properties and transparency. In this study, the reliability of ITO thin films on flexible substrates was investigated using bending test and bending fatigue test. According to the relative position of ITO and substrate, the experiment was conducted on both outer and inner bending conditions. Inner bending condition exhibited superior electrical stability compared to outer bending test. The electrical resistance during outer bending fatigue test significantly increased compared to that in the inner bending fatigue. The crack nucleation and propagation differs according to the stress state and they have a great influence on the electrical resistance. The crack morphologies were observed by scanning electron microscopy.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.57-65
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• 2017

The electronic components in mobile device are composed of electronic chips and various other materials. These components become extremely thin and the constituent materials have different coefficient of thermal expansion, so that considerable warpages occurs easily due to temperature change or external load. Shadow $moir{\acute{e}}$ is non-contact, whole field technique for measuring out-of-plane displacement, but the measurement sensitivity is not less than $50{\mu}m/fringe$, which is not suitable for measuring the warpage of the electronic components. In this paper, we implemented a measurement method with enhanced sensitivity of $25{\mu}m/fringe$ by investigating and optimizing various experimental conditions of the shadow $moir{\acute{e}}$. In addition, four $moir{\acute{e}}$ fringe patterns recorded by the phase shift are processes to obtain a $moir{\acute{e}}$ fringe patterns with a sensitivity four times higher. The measurement technique is applied to small electronic components of a smart phone for measuring warpage with a high sensitivity of $5{\mu}m/fringe$ at room temperature and at the temperature of $100^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.43-47
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• 2018

In this study, we fabricated transparent resistive strain sensor by embedding silver nanowire in polydimethylsiloxane (PDMS) substrate to sense the finger bending motion electrically. Using bluetooth as wireless data transfer system, strain data was transferred to computer and smart phone application enabling near field communication. Additionally, we made a program translating resistance change by finger motion strain to save images and confirmed that it worked at application and computer.

• Smart Structures and Systems
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• v.6 no.3
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• pp.225-238
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• 2010

We report on the development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process which includes a gap narrowing procedure suitable to fabricate sensors with low motional resistance. In order to employ these sensors for crack monitoring, techniques suited for bonding the MEMS sensors on a steel surface ensuring good strain transfer from steel to silicon and a packaging technique for the bonded sensors are proposed, conceived for realizing a low-power crackmeter for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with a resolution of $10{\mu}m$ and very low power consumption requirements (potentially suitable for wireless operation) is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in underground tunnel test sections.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.17-33
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• 2022

Ti₃C₂T_X MXene, first reported by Naguib et al. in 2011, has attracted tremendous attention due to its excellent hydrophilicity, electrical conductivity, and mechanical/chemical stability. Since MXene is a two-dimensional material with a thickness of few nanometers, which ensure its flexibility. In last few years, due to these properties many researchers used Ti₃C₂T_X MXene into various fields such as flexible smart sensors, energy harvesting/storage devices, supercapacitors and electromagnetic interference shielding systems. In this review article, we have briefly discussed the various synthesis processes and characteristics of Ti₃C₂T_X MXene. Moreover, we reviewed the latest development of Ti₃C₂T_X MXene as flexible electrode material to be used into different applications.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.21-29
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• 2016

In this paper, we developed a flexible transparent capacitive pressure sensor which can recognize X and Y coordinates and the size of force simultaneously by sensing a change in electrical capacitance. The flexible transparent capacitive pressure sensor was composed of 3 layers which were top electrode, pressure sensing layer, and bottom electrode. Silver nanowire(Ag NW)/poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) hybrid film was used for top and bottom flexible transparent electrode. The fabricated capacitive pressure sensor had a total size of 5 inch, and was composed of 11 driving line and 19 sensing line channels. The electrical, optical properties of the Ag NW/PEDOT:PSS and capacitive pressure sensor were investigated respectively. The mechanical flexibility was also investigated by bending tests. Ag NW/PEDOT:PSS exhibited the sheet resistance of $44.1{\Omega}/square$, transmittance of 91.1%, and haze of 1.35%. Notably, the Ag NW/PEDOT:PSS hybrid electrode had a constant resistance change within a bending radius of 3 mm. The bending fatigue tests showed that the Ag NW/PEDOT:PSS could withstand 200,000 bending cycles which indicated the superior flexibility and durability of the hybrid electrode. The flexible transparent capacitive pressure sensor showed the transmittance of 84.1%, and haze of 3.56%. When the capacitive pressure sensor was pressed with the multiple 2 mm-diameter tips, it can well detect the force depending on the applied pressure. This indicated that the capacitive pressure sensor is a promising scheme for next generation flexible transparent touch screens which can provide multi-tasking capabilities through simultaneous multi-touch and multi-force sensing.