Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures |
Ferri, Matteo
(Institute of Microelectronics and Microsystems (IMM), National Research Council of Italy)
Mancarella, Fulvio (Institute of Microelectronics and Microsystems (IMM), National Research Council of Italy) Seshia, Ashwin (Department of Engineering, University of Cambridge) Ransley, James (Department of Engineering, University of Cambridge) Soga, Kenichi (Department of Engineering, University of Cambridge) Zalesky, Jan (Czech Technical University in Prague, Faculty of Civil Engineering) Roncaglia, Alberto (Institute of Microelectronics and Microsystems (IMM), National Research Council of Italy) |
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