• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.969-972
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• 1997

Ultrasonic machining technology has been developed over recent years for he manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile application. The past decade has seen a tremendous in the use of ceramic in structural application. The excellent thermal, chemical and wear resistance of these material can be realized because of recent improvement in the overall strength and uniformity of advanced ceramics. Ultrasonic machining, in which abrasive particles in slurry with water are presented to the work surface in the presence of an ultrasonic-vibrating tool, is process which should be of considerable interest, as its potential is not limited by he electrical or chemical characteristics of the work material, making it suitable for application to ceramics. In order to improve the currently used ultrasonic machining using ultrasonic energy, technical accumulation is needed steadily through development of exciting device of ultrasonic machine composed of piezoelectric vibrator and horn. This paper intends to further the understanding of the basic mechanism of ultrasonic machining for brittle material and ultrasonic machining of ceramics based in the fracture-mechanic concept has been analyzed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.565-566
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• 2006

Slurry used in metal chemical mechanical polishing normally consists of an oxidizer, a complexing agent, a corrosion inhibitor and an abrasive. This paper investigates effects of citric acid as a complexing agent for Cu CMP with $H_2O_2$ as an oxidizer. In order to study chemical effects of a citric acid, x-ray photoelectron spectroscopy were performed on Cu sample after Cu etching test. XPS results reveal that CuO, $Cu(OH)_2$ layer decrease but Cu/$Cu_2O$ layer increase on Cu sample surface. To investigate nanomechanical properties of Cu sample surface, nanoindentation was performed on Cu sample. Results of nanoindentation indicate wear resistance of Cu Surface decrease. According to decrease of wear resistance on Cu surface, removal rate increases from $285\;{\AA}/min$ to $8645\;{\AA}/min$ in Cu CMP.

• 한국결정성장학회지
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• 제21권6호
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• pp.225-229
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• 2011

현재 결정질 태양전지에서 웨이퍼 가공은 대부분 슬러리 분사 방식의 다중 와이어를 이용한 방법이 사용되고 있다. 이와 같은 슬러리 분사 방식의 웨이퍼 가공은 가공속도가 낮아 생산성이 떨어지는 단점이 있을 뿐만 아니라 금속 재질의 와이어와 실리콘 블록의 직접적인 마찰에 의하여 웨이퍼 표면의 금속 불순물에 의한 오염이 발생되는 단점이 있다. 뿐만 아니라 와이어와 실리콘 블록간의 직접적인 마찰로 인하여 와이어가 빨리 마모되며, 이로 인하여 일회성의 와이어를 사용하게 되면서 제조원가는 상승하게 된다. 반면에 다이아몬드 입자가 코팅된 와이어를 이용하여 실리콘 웨이퍼를 가공하게 되면, 가공속도가 기존 슬러리 분사방식보다 빠르며, 공정진행에 따른 와이어의 마모율이 적어 와이어의 재사용에 의한 제조원가 절감이 가능하다. 따라서 이와 같은 다이아몬드 입자가 코팅된 와이어를 이용하여 가공하는 기술은 슬러리 분사방식에 비하여 더 효율적이라 할 수 있다. 본 연구에서는 슬러리 분사방식으로 가공된 웨이퍼와 다이아몬드 코팅된 와이어로 가공된 웨이퍼의 표면특성에 대하여 분석하고 셀 공정에 영향을 미치는 것에 대하여 설명하고자 한다. 또한, 다이아몬드 와이어로 가공된 웨이퍼를 활용하기 위한 셀 공정의 개선방향에 대하여 제안하고자 한다.

• 소성∙가공
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• 제9권4호
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• pp.389-394
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• 2000

The studies on gram size refinement for rheocast processing of hypereutectic Al-18%Si alloys have been investigated in the present study. To increase the efficiency of mechanical stirring, sieve type stirrer are newly designed and implemented for rheocasting of hypereutectic Al-18%Si alloy. Mechanical stirring of semi-solid slurry by using sieve type mechanical stirrer results in morphological changes of the primary Si particles, from angular rod shape to near spherical shape and uniform distribution of proeutectic Si. The remarkable spheroidization of Primary Si Particles and distributional uniformity of proeutectic Si show well the efficiency of sieve type mechanical stirring method which can accelerate the coalescence-fracture-wear of the individual particles by strong turbulent flow between lattices during rotation of sieve type stirrer.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.239-239
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• 2004

화학적 기계연마 공정(CMP)은 반도체 웨이퍼를 수 천$\AA$m/min의 MRR로 2$\mu\textrm{m}$ 이내의 W(Total Thickness Variable) 조건을 만족시키는 초정밀 광역 평탄화 기술이다. 일반적인 CMP 방법은 서로 다른 회전 중심을 갖고 동일한 방향으로 회전하는 웨이퍼와 다공성 패드 사이에 연마액인 슬러리를 넣어 연마하는 것이다. CMP 공정기술은 1990년 대 중반에 개발되었으나, 아직까지 연마 메커니즘이 완벽하게 밝혀지지 않았다. 따라서 장비를 최적화하기 위해 실험에 의존적일 수밖에 없으나, 이러한 방법은 막대한 자금과 노력뿐만 아니라 상당한 시간을 필요로 하기 때문에, 앞으로 가속될 연마대상 재료의 변화 및 다양한 속도에 발맞출 수 없다.(중략)

• 접착 및 계면
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• 제3권1호
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• pp.30-36
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• 2002

In this paper, some idea about the use of Metal and ceramic filled epoxy adhesive, Anaerobic adhesive and RTV silicone in the assembly, maintain and repair of machinery and equipment is given. Many examples which have been successfully used in Chinese industry are introduced: ${\bullet}$ Wear, Abrasion, Corrosion/Erosion Resistance and Metal Rebuilding Worn shafts, Scored Hydraulic Ram, Bearing Housings, Slurry Pumps (Bodies & Impellers), Slide-ways, Heat Exchangers, Cracked Castings and Molds. Leaking Pipes and Tanks. ${\bullet}$ Locking and Retaining Thread, Bearing, Keyways, Bolts, Nuts, Studs, Gears, Collars, Motors. ${\bullet}$ Scaling and Gasketing Flanges, Pipe Joints, Machined surfaces.

• Advances in materials Research
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• 제1권2호
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• pp.129-146
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• 2012

Polycrystalline diamond is an ideal material for parts with micro-holes and has been widely used as dies and cutting tools in automotive, aerospace and woodworking industries due to its superior wear and corrosion resistance. In this research paper, the modeling and simultaneous optimization of multiple performance characteristics such as material removal rate and surface roughness of polycrystalline diamond (PCD) with ultrasonic machining process has been presented. The fuzzy logic and taguchi's quality loss function has been used. In recent years, fuzzy logic has been used in manufacturing engineering for modeling and monitoring. Also the effect of controllable machining parameters like type of abrasive slurry, their size and concentration, nature of tool material and the power rating of the machine has been determined by applying the single objective and multi-objective optimization techniques. The analysis of results has been done using the MATLAB 7.5 software and results obtained are validated by conducting the confirmation experiments. The results show the considerable improvement in S/N ratio as compared to initial cutting conditions. The surface roughness of machined surface has been measured by using the Perthometer (M4Pi, Mahr Germany).

• Tribology and Lubricants
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• 제34권3호
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• 한국주조공학회지
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• 제15권5호
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• pp.483-493
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• 1995

The microstructural changes during semi-solid state processing of hypereutectic Al-Si alloy has been investigated in the present study. Stirring of semi-solid slurry results in the morphological changes of the primary Si particles, i.e. from angular rod shape to near-spherical shape. Besides the spherodization of primary Si particles, the average particle size increases, especially, at much higher rate in the final stage than that in the early stage of stirring. Various microstructure characterization techniques, such as anisotropic etching, SEM imaging and ECP analysis, reveal that the spherodization of primary Si particles occurs by the combinations of the mechanisms of coalescence, fracture, and wear of the individual particles. Isothermal shearing of hypereutectic Al-Si at $580^{\circ}C$ shows that spherical ${\alpha}-Al$ particles are formed by the dissociation of Al-Si eutectic structure at the early stage of isothermal shearing. The spherical ${\alpha}-Al$ particles gradually grow by the mechanisms of Ostwald ripening and coalescence of the particles.

• 소성∙가공
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• 제13권3호
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• pp.262-267
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• 2004

Ultrasonic machining has been known as one of the conventional machining methods in the glass fabrication processes. In ultrasonic machining, typically, glass is removed by the impulse energy of the abrasive generated by the ultrasonic power. However, when the machining feature decrease under hundreds of micrometers, as conventional ultrasonic machining uses only the impulse energy of the abrasive, the speed of ultrasonic machining decreases significantly and the surface roughness becomes deteriorated. To overcome this size effect, the chemicals which can erode glasses, such as HF, XF, etc, are added to the slurry. The chemical-assisted ultrasonic machining method, so called, is another alternating effective way for micro machining of glasses. In previous work, we used the hydrofluoric acid (HF) as an additive chemical. But, as the HF solution is too poisonous to be used as a ultrasonic process additive, it is needed to be substituted by other safe chemicals. As results of the machinability comparison of several chemicals, the GST-500F was selected to replace the HF. The GST-500F (pH $4.0{\pm}1.0$) is non-volatile, odorless. During experimental works, it was shown that the machining rate increases 1.5 times faster than the conventional ultrasonic machining. The machining load also decreases. However, the enlargement of the hole diameter and significant tool wear are still the problems to be solved.