• 제목/요약/키워드: Slurry particle size

검색결과 174건 처리시간 0.025초

나노입자 혼합 복합슬러리를 이용한 반응소결 SiC 재료의 제조 (Fabrication of Reaction Sintered SiC Materials by Complex Slurry with Nano Size Particles)

  • 이상필
    • 대한기계학회논문집A
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    • 제29권3호
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    • pp.425-431
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    • 2005
  • The efficiency of complex slurry preparation route for developing the high performance SiC matrix of $RS-SiC_{f}/SiC$ composites has been investigated. The green bodies for RS-SiC materials prior to the infiltration of molten silicon were prepared with various C/SiC complex slurries, which associated with both the sizes of starting SiC particles and the blending conditions of starting SiC and C particles. The characterization of Rs-SiC materials was examined by means of SEM, EDS and three point bending test. Based on the mechanical property-microstructure correlation, the process optimization is also discussed. The flexural strength of Rs-SiC materials greatly depended on the content of residual Si. The decrease of starting SiC particle size in the C/SiC complex slurry was effective for improving the flexural strength of RS-SiC materials.

Etching and Polishing Behavior of Cu thin film according to the additive chemicals

  • Ryu, Ju-Suk;Eom, Dae-Hong;Hong, Yi-Koan;Park, Jum-Yong;Park, Jin-Goo
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.274-278
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    • 2002
  • The purpose of this study was to characterize the reaction of Cu surface with Cu slurry and CMP performance as a function of additives in CMP slurry. The polish rate of Cu was dependent on the kind of organic acids added in slurry. It was considered that polish rate of Cu was dependent on the concentration of carboxylates and mean particle size. When the etchant and oxidant were added in slurry, the highest removal rate and lower etch rate were measured at neutral pH. The addition of etchant, oxidant and pH adjustor played key roles of CMP ability in slurry. As the pH increased, polish rate of Cu was increased by the enhanced the mechanical effects due to effective dispersion of slurry particles. Alumina abrasives was more desirable for 1st step slurry because of high removal rate of Cu and high selectivity ratio among TaN and Cu.

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지역냉방을 위한 아이스슬러리의 연속제조 및 배관내 빙충전율 조절 (Continuous Ice Slurry Production and Control of Ice Packing Factor in a Pipe for the District Cooling)

  • 권재성;이윤표;이상훈;유호선;윤석만
    • 설비공학논문집
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    • 제20권12호
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    • pp.825-832
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    • 2008
  • The ice slurry maker which can produce the ice slurry well for the ice particle in-flowing condition was revised. We removed the stagnant region at the top of the ice slurry maker, and IPF 40% could be realized. The IPF controller with 6 mm diameter holes at the bottom was designed. But the IPF controller with only 6 mm diameter holes could not control IPF in a pipe. This is because the ice particles at ice slurry flow exist homogeneously not only at the upper part but also at the bottom part. We changed the hole size of IPF controller surface using fine meshes and then, IPF in a pipe was increased by 70% when the hole size was $80{\mu}m$ and less.

석회석 입도에 따른 습식배연탈황 성능연구 (Effect of Limestone Particle Size on the performance of FGD system)

  • 이경우;황재동;우광제;장길홍
    • 청정기술
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    • 제7권1호
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    • pp.81-88
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    • 2001
  • 발전소의 탈황에 사용되는 습식탈황장치에는 반응제로 석회석이 사용된다. 본 연구에서는 주로 사용되는 325mesh입도의 석회석과 함께, 저렴한 200mesh석회석의 탈황공정 특성에 관하여 조사하였다. 석회석의 용해도에 대해 입도별로 실험한 결과 석회석의 입도가 클수록 용해속도가 떨어지는 것을 알 수 있었다. 그러나 습식탈황 공정에서의 탈황율은 석회석 입도와는 상관없이 L/G비(Liquid/Gas ratio, $L/m^3$) 및 현탁액의 pH에 의해서 증감되었다. 탈황공정에서의 부산물로 발생하는 석고의 경우에는 입도가 작아짐에 따라, 그리고 pH가 낮아짐에 따라 순도는 향상되는 것으로 나타났다. 한편 두 가지 입도의 석회석을 일정분율씩 혼합하여 실험한 결과 그 혼합비에 비례하여 탈황율, 석고 순도, 석회석 이용율 등의 공정특성이 나타났다.

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DSS에서 $CeO_2$ 연마제의 첨가량과 분산시간이 TEOS 막에 미치는 특성연구 (A Study on the effect of TEOS film by Dispel8ion Time and Content of $CeO_2$ Abrasive)

  • 서용진;한상준;박성우;이영균;이성일
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.487-487
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    • 2009
  • One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.

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CeO2 슬러리 분쇄와 옥살산 침전을 이용한 Ce0.8Gd0.2O1.9 분말의 합성 (Preparation of Ce0.8Gd0.2O1.9 Powder by Milling of CeO2 Slurry and Oxalate Precipitation)

  • 심수만
    • 한국세라믹학회지
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    • 제47권2호
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    • pp.183-188
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    • 2010
  • $Ce_{0.8}Gd_{0.2}O_{1.9}$(GDC20) powder was synthesized by milling of $CeO_2$ slurry and Gd oxalate precipitation. The mixture of $CeO_2$ powder and Gd precipitates calcined at $600^{\circ}C$ for 2 h showed the particle size distribution similar to that of $CeO_2$ powder, which had been milled during the synthesis process. Attrition milling of the calcined powder with an average particle size of $0.36\;{\mu}m$ for 2 h resulted in a decrease in the particle size to $0.24\;{\mu}m$. Although the milled powder consisted of small particles(<$1\;{\mu}m$), a small amount of fine platy $Gd_2O_3$ particles, which had been survived in the milling process, was observed. Sintering of the powder compacts for 4 h showed relative densities of 80.7% at $1300^{\circ}C$ and 97% at $1400^{\circ}C$, respectively. Densification was found to almost complete at $1500^{\circ}C$, resulting in a dense and homogeneous microstructure with a relative density of 99.5%.

천연 수활석의 이산화황 흡수성능에 대한 수열처리 효과 (Effect of Hydrothermal Treatment on Sulfur Dioxide Absorption Efficiency of Natural Brucite)

  • 김잔배;강성구;김헌창
    • 청정기술
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    • 제16권4호
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    • pp.254-257
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    • 2010
  • 중국 Liaoning에서 산출된 천연 수활석(brucite)을 원료로 $Mg(OH)_2$ slurry를 제조하고, 그 탈황 성능을 조사하였다. 수활석의 입도분포의 차이 및 수열처리에 의한 활성화 효과를 검토하였다. 80 mesh 이하의 수활석 시료에 비해 입자의 크기가 작고 입도분포가 좁은 1000 mesh 이하의 사료가 de-$SO_2$ 효율이 더 높은 것을 확인할 수 있었다. 한편, 80 mesh 이하의 수활석 시료를 비교적 낮은 온도인 363 K에서 3 h 동안 수열 처리하여 매우 높은 de-$SO_2$ 성능 개선 효과를 얻을 수 있었다.

Bimodal 입도분포를 보이는 AlN 분말의 테이프캐스팅 성형을 위한 분산효과 (Effect of Dispersion on Tape Casted Green Sheet Prepared from Bimodal-Type AlN Powders)

  • 최홍수;이상진
    • 한국세라믹학회지
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    • 제47권6호
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    • pp.566-571
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    • 2010
  • Dispersion behavior of the slurries consisted of bimodal-type AlN powders was examined in non-aqueous solvent system. Azotropic solvent system and copolymer acidic dispersant were applied to the slurries. Measurements of the sedimentation height and the viscosity of the each slurry, and the test of particle size distribution of the each powder sample were conducted as examinations for the dispersion behavior at the various dispersant contents. The bimodal-type particle size distribution was continued after addition of the dispersant and small particle portions were increased as the dispersant content increases. The density of the green sheet was also increased as the dispersant content increases and a green density of $2.114\;g/cm^3$ was obtained at the sample prepared from 2.4 wt% dispersant content. The increase of large particle portions resulted in the surface defects of the green sheets.

산화막 CMP 공정에서 슬러리 온도 변화에 따른 연마 특성 (Polishing Properties by Change of Slurry Temperature in Oxide CMP)

  • 고필주;박성우;김남훈;서용진;이우선
    • 한국전기전자재료학회논문지
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    • 제18권3호
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    • pp.219-225
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    • 2005
  • To investigate the effects of slurry temperature on the chemical mechanical polishing(CMP) performance of oxide film with silica and ceria slurries, we have studied slurry properties as a function of different slurry temperature. Also, the effects of each input parameter of slurry on the oxide CMP characteristics were investigated. The pH showed a slight tendency of decrease, the conductivity in slurries showed an increased tendency, the mean particle size in slurry decreased, and the zeta potential of slurry decreased with temperature. The removal rates significantly increased and maintained at the specific levels over 4$0^{\circ}C$. The better surface morphology of oxide films could be obtained at 40 $^{\circ}C$ of silica slurry and at 90 $^{\circ}C$ of ceria slurry. It is found that the CMP performance of oxide film could be significantly improved or controlled by change of slurry temperature.

무기계 균열주입재의 품질평가에 관한 연구 (Properties of Quality Evaluation for Inorganic Crack Injection Materials)

  • 이종열;유재상;정연식;이웅종;양승규
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2001년도 가을 학술발표회 논문집
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    • pp.227-232
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    • 2001
  • In this research we made cement particle with the average size of 4 ${\mu}{\textrm}{m}$ which can penetrate even minor cracks based on the theory of J. K. Michel who reported particles can penetrate the crack of width up to 3 times of maximum particle size. The inorganic crack injection materials were produced by adding superplasticizer. Physical properties of hardened slurry with JIS molds were also tested at 3, 7 and 28 days and the adhesion properties of the slurry in various process conditions were also tested at 3, 7 and 28 days. The cracked specimens which were repaired with slurries produced at various conditions were tested after 3, 7 and 28 days curing in the air and split tensile strength properties were characterized.

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