• Title/Summary/Keyword: Size Inspection

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Ball Grid Array Solder Void Inspection Using Mask R-CNN

  • Kim, Seung Cheol;Jeon, Ho Jeong;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.126-130
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    • 2021
  • The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

Defect Inspection of the Pixels in OLED Type Display Device by Image Processing (화상처리를 이용한 OLED 디스플레이의 픽셀 불량 검사에 관한 연구)

  • Park, Kyoung-Seok;Shin, Dong-Won
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.8 no.2
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    • pp.25-31
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    • 2009
  • The image processing methods are widely used in many industrial fields to detect defections in inspection devices. In this study an image processing method was conducted for the detection of abnormal pixels in a OLED(Organic Light Emitting Diode) type panel which is used for small size displays. The display quality of an OLED device is dependent on the pixel formation quality. So, among the so many pixels, to find out the faulty pixels is very important task in manufacturing processing or inspection division. We used a line scanning type BW(Black & White) camera which has very high resolution characteristics to acquire an image of display pixel patterns. And the various faulty cases in pixel abnormal patterns are considered to detect abnormal pixels. From the results of the research, the normal BW pixel image could be restored to its original color pixel.

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Optimal Inspection Policy in an Economic Production Quantity with Random Defectives (불량품을 갖는 경제적 생산량 모델의 최적 검사 정책에 관한 연구)

  • Jo, Jae-Rip
    • Journal of Korean Society for Quality Management
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    • v.20 no.2
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    • pp.1-10
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    • 1992
  • In this paper, we study a joint lot sizing and inspection policy under an EPQ(Economic Production Quantity) model where a random proportion of units are defectives. Those units can be discovered only through costly inspection. The problem is thus bivariate : both lot size and fraction to inspect are to be chosen. We first analyze a model in which the only penalty for uninspected defectives is financial, and then consider a model where defectives units cannot be used and thus must be replaced by non-defective ones. As a result it can be proved that this inspection policy costs economically and is to be decided effectively for the Economic Production Quantity constraining the fraction to inspect.

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A study on inspection area using neural network for vision systems (비젼 시스템에서 신경 회로망을 이용한 검사 영역에 관한 연구)

  • Oh, Je-Hui;Cha, Young-Youp
    • Journal of Institute of Control, Robotics and Systems
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    • v.4 no.3
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    • pp.378-383
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    • 1998
  • A FOV, that stands for "Field Of View", refers to the maximum area where a camera could be wholly seen. If a FOV of CCD camera cannot the cover overall inspection area, the overall inspection area should be divided into sub-areas of size FOV. In this paper, we propose a new neural network-based FOV generation method by using a newly modified self-organizing map(SOM) which has multiple structure based on a self-organizing map, and uses new training rule that is composed of the movement, creation and deletion terms. Then, experiment results using real PCB indicate the superiority of the method developed in this study to the existing sequential method.al method.

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A Modified Single Sampling Plan for the Inspection of Attribute Quality Characteristics

  • Subramani, J.;Balamurali, S.
    • Industrial Engineering and Management Systems
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    • v.15 no.1
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    • pp.41-48
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    • 2016
  • In this manuscript, a modified single sampling plan is proposed for the inspection of products in which the nonconforming items can be classified in to two categories namely critical and non-critical; and explained with the help of industrial example. The operating procedure of this plan is also proposed and the performance measures such as the probability of acceptance, average sample number, average total inspection and average out going quality are also derived. The optimal parameters are determined which will have minimum sample size. The efficiency of the proposed plan is also discussed over the conventional single sampling plan. The extensive tables for selecting a modified single sampling plan based on AQL and LQL are provided for both Binomial and Poisson distributions and explained with the help of industrial data.

Electric vehicle Pouch battery dimension inspection system (전기자동차 파우치 배터리 치수검사 시스템)

  • Lee, Hyeong-Seok;Kim, Jea-Hee
    • Journal of Korea Multimedia Society
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    • v.24 no.9
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    • pp.1203-1210
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    • 2021
  • In this paper, we developed the inspection system of electric vehicle pouch battery using image processing. Line scan cameras are used for acquiring the all parts of the pouch battery, and several steps of image processing for extracting significant dimensions(User Required Position) of the battery. In image processing, edge lines, node points, dimension lines, etc. were extracted using Preprocessor, Square Edge Detection, and Size Detection algorithms. This is used to measure the dimensions of the location requested by the user on the pouch battery. For verification of the inspection system, the dimensions of three pouch batteries produced in the same process were measured, and the mean and standard deviation were obtained to confirm the precision.

Vision Based Tire Mold Defect Inspection and Printing System (비전기반 타이어 몰드 불량 검사 및 검사서 출력 시스템)

  • Lee, Si-Woong;Kang, Hyun-Soo
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.25 no.6
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    • pp.849-852
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    • 2021
  • This paper presents a vision based tire mold inspection system where mold defects are inspected and the sizes of specific parts of the mold are measured. There are a lot of challenging issues as letters and pictures of intaglio are engraved on a bright surface of the tire mold. To solve the issues, we carefully selected a line-scan camera and a line light. In addition, we used PLC to control the mechanical parts. The developed system provides inspection of misspelled and deformed letters as well as a variety of the functions such as size measurement of engraved regions and inspection report file creation.

A Study on the Crack Inspection Model of Old Buildings Based on Image Classification (이미지 분류 기반 노후 건축물 균열 검사 모델 연구)

  • Chae, Jong-Taek;Lee, Ung-Kyun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2023.05a
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    • pp.331-332
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    • 2023
  • With the aging of buildings, the number and importance of regular inspections of buildings are increasing. The current safety inspection goes through a procedure in which a skilled technician visits an old building, visually checks it, takes a photo, and finally organizes and judges it at the office. For this, field personnel and analysis and review personnel are required. Since the inspection procedure includes taking pictures, a huge amount of data has been accumulated from the time digital photos were used to the present. When a model that can check cracks outside a building is developed using these data, manpower and time required can be greatly reduced. Therefore, this study aims to create a model for classifying cracks that occur outside the building through the artificial intelligence method. The created model can be used as a basic model for determining cracks only by external photography in the future, and furthermore, it can be used as basic data for calculating the size and width of cracks.

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Analysis of the Process Capability Index According to the Sample Size of Multi-Measurement (다측정 표본크기에 대한 공정능력지수 분석)

  • Lee, Do-Kyung
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.42 no.1
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    • pp.151-157
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    • 2019
  • This study is about the process capability index (PCI). In this study, we introduce several indices including the index $C_{PR}$ and present the characteristics of the $C_{PR}$ as well as its validity. The difference between the other indices and the $C_{PR}$ is the way we use to estimate the standard deviation. Calculating the index, most indices use sample standard deviation while the index $C_{PR}$ uses range R. The sample standard deviation is generally a better estimator than the range R. But in the case of the panel process, the $C_{PR}$ has more consistency than the other indices at the point of non-conforming ratio which is an important term in quality control. The reason why the $C_{PR}$ using the range has better consistency is explained by introducing the concept of 'flatness ratio'. At least one million cells are present in one panel, so we can't inspect all of them. In estimating the PCI, it is necessary to consider the inspection cost together with the consistency. Even though we want smaller sample size at the point of inspection cost, the small sample size makes the PCI unreliable. There is 'trade off' between the inspection cost and the accuracy of the PCI. Therefore, we should obtain as large a sample size as possible under the allowed inspection cost. In order for $C_{PR}$ to be used throughout the industry, it is necessary to analyze the characteristics of the $C_{PR}$. Because the $C_{PR}$ is a kind of index including subgroup concept, the analysis should be done at the point of sample size of the subgroup. We present numerical analysis results of $C_{PR}$ by the data from the random number generating method. In this study, we also show the difference between the $C_{PR}$ using the range and the $C_P$ which is a representative index using the sample standard deviation. Regression analysis was used for the numerical analysis of the sample data. In addition, residual analysis and equal variance analysis was also conducted.

Determination of Cage Size in Case of Non-Standard Well Size in Lift Industry (승강기 산업의 비표준 승강로에 대응하는 승강기 크기 결정 방법 연구)

  • Ko, Young-joon;Kim, Byoung-ik;Han, Kwan Hee
    • Journal of Convergence for Information Technology
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    • v.9 no.2
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    • pp.85-93
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    • 2019
  • There is currently no recognized standard for the size of lifts. Each elevator manufacturer sets the maximum allowable floor area that meets the capacity calculation standard of the elevator using the maximum used car floor area, which is defined by EN-CODE and the domestic inspection standard, and determines the elevator size based on their own standards. In this paper, we propose a method to more easily determine the elevator size. To do this, we implemented a program that calculates the size of the elevator by inputting the dimensions of the hoistway. This program will be useful method for quick decision making and elevator installation considering the elevator factors according to the already determined hoistway size of the building and calculating the EN-CODE currently used and the size of the elevator according to domestic inspection standards.