• 한국정보과학회:학술대회논문집
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• 한국정보과학회 2003년도 가을 학술발표논문집 Vol.30 No.2 (1)
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• pp.196-198
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• 2003

Virtually every digital signal processors(DSPs) support on-chip multi- memory banks that allow the processor to access multiple words of data from memory in a single instruction cycle. Also, all existing fixed-point DSPs have irregular architecture of heterogeneous register which contains multiple register files that are distributed and dedicated to different sets of instructions. Although there have been several studies conducted to efficiently assign data to multi-memory banks, most of them assumed processors with relatively simple, homogeneous general-purpose resisters. Therefore, several vendor-provided compilers fer DSPs were unable to efficiently assign data to multiple data memory banks. thereby often failing to generate highly optimized code fer their machines. This paper presents an algorithm that helps the compiler to efficiently assign data to multi- memory banks. Our algorithm differs from previous work in that it assigns variables to memory banks in separate, decoupled code generation phases, instead of a single, tightly-coupled phase. The experimental results have revealed that our decoupled algorithm greatly simplifies our code generation process; thus our compiler runs extremely fast, yet generates target code that is comparable In quality to the code generated by a coupled approach

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2006년도 춘계종합학술대회
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• pp.894-897
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• 2006

Spatial distribution of injected electrons and holes is evaluated by using single-junction charge pumping technique in SONOS(Poly-silicon/Oxide/Nitride/Oxide/Silicon) memory cells. Injected electron are limited to length of ONO(Oxide/Nitride/oxide) region in locally ONO stacked cell, while are spread widely along with channel in fully ONO stacked cell. Hot-holes are trapped into the oxide as well as the ONO stack in locally ONO stacked cell.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2000년도 춘계학술대회 논문집
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• pp.250-257
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• 2000

A Helmholtz free energy for a martensitic transformation of a single crystalline shape-memory alloy is obtained by a micromechanical approach, 24 variants of the single crystal are taken into account. In the framework of irreversible thermodynamics, a kinetic relation, a martensitic nucleation criterion and the reorientation criterion of martensitic variants are obtained. These relations are valid for a three-dimensional proportional or non-proportional mechanical loading or a combination of mechanical and thermal loading. Reorientation behavior of a single crystalline shape-memory alloy CuZnAl is simulated. When a tensile load is applied to a thermally-induced martensite, 24 self-accommodated martensitic variants are reoriented to the most favorable variant. In the following unloading, the most favorable variant in the tensile load is reoriented to the most favorable variant in this loading condition.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.453-456
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• 1999

The Si-SiO$_2$interface trap and nitride bulk trap distribution of SONOSFET(polysilicon-oxide-nitride-oxide-semiconductor)NVSM(nonvolatile semiconductor memory) cell were investigated by single charge pumping method. The used device was fabricated by 0.35 7m standard logic fabrication including the ONO cell process. This ONO dielectric thickness is tunnel oxide 24 $\AA$, nitride 74 $\AA$, blocking oxide 25 $\AA$, respectively. Keeping the pulse base level in accumulation and pulsing the surface into inversion with increasing amplitudes, the charge pumping current flow from the single junction. Using the obtained I$_{cp}$-V$_{h}$ curve, the local V$_{t}$ distribution, doping concentration, lateral interface trap distribution and lateral memory trap distribution were extracted. The maximum N$_{it}$($\chi$) of 1.62$\times$10$^{19}$ /cm$^2$were determined.mined.d.

• 한국전기전자재료학회논문지
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• 제13권10호
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• pp.822-827
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• 2000

The Si-SiO$_2$interface trap and nitride bulk trap distribution of SONOSFET(polysilicon-oxide-nitride-oxide-semiconductor field effect transistor) NVSM (nonvolatile semiconductor memory) cell is investigated by single junction charge pumping method. The device was fabricated by 0.35㎛ standard logic fabrication process including the ONO stack dielectrics. The thickness of ONO dielectricis are 24$\AA$ for tunnel oxide, 74 $\AA$ for nitride and 25 $\AA$ for blocking oxide, respectively. By the use of single junction charge pumping method, the lateral profiles of both interface and memory traps can be calculated directly from experimental charge pumping results without complex numerical simulation. The interface traps were almost uniformly distributed over the whole channel region and its maximum value was 7.97$\times$10$\^$10/㎠. The memory traps were uniformly distributed in the nitride layer and its maximum value was 1.04$\times$10$\^$19/㎤. The degradation characteristics of SONOSFET with write/erase cycling also were investigated.

• 한국통신학회논문지
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• 제21권1호
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• pp.224-240
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• 1996

It is common sense for at least one or more levels of cache memory to be used in these day's computer systems. In this paper, the impact of the internal cache memory organization on the performance of the computer is investigated by using a simulator program, which is wirtten by authors and run on SUN SPARC workstation, with several real execution, with several real execution trace files. 280 cache organizations have been simulated using n-way set associative mapping and LRU(Least Recently Used) replacement algorithm with write allocation policy. As a result, 16-way setassociative cache is the best configuration, and when we select 256KB cache memory and 64 byte line size, the bus traffic ratio was decreased compared to that of the noncache system so that a single bus could support almost 7 processors without any delay and degradationof high ratio(hit ratio was 99.21%). The smaller the line size we choose, the little lower hit ratio we can get, but the more processors can be supported by a single bus(maximum 18 processors). Therefore, using a proper cache memory organization can make a single bus structure be able to support multiple processors without any performance degradation.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.55-58
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• 2000

This paper describes a single transistor type ferroelectric field effect transistor (1T FeFET) memory celt scheme which can select one unit memory cell and program/read it. To solve the selection problem of 1T FeEET memory cell array, the row direction common well is electrically isolated from different adjacent row direction column. So, we can control voltage of common well line. By applying bias voltage to Gate and Well, respectively, we can implant IT FeEET memory cell scheme which no interface problem and can bit operation. The results of HSPICE simulations showed the successful operations of the proposed cell scheme.

• 전기학회논문지
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• 제59권2호
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• pp.417-422
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• 2010

When memory devices are exposed to space environments, they suffer various effects such as SEU(Single Event Upset). Memory systems for space applications are generally equipped with error detection and correction(EDAC) logics against SEUs. In this paper, several error detection and correction codes - RS(10,8) code, (7,4) Hamming code and (16,8) code - are analyzed and compared with each other. Each code is implemented using VHDL and its performances(encoding/decoding speed, required memory size) are compared. Also the failure probability equation of each EDAC code is derived, and the probability value is analyzed for various occurrence rates of SEUs which the STSAT-3 possibly suffers. Finally, the EDAC algorithm for STSAT-3 is determined based on the comparison results.

• Journal of Astronomy and Space Sciences
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• 제29권3호
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• pp.315-320
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• 2012

We developed a mass-memory chip by staking 1 Gbit double data rate 2 (DDR2) synchronous dynamic random access memory (SDRAM) memory core up to 4 Gbit storage for future satellite missions which require large storage for data collected during the mission execution. To investigate the resistance of the chip to the space radiation environment, we have performed heavy-ion-driven single event experiments using Heavy Ion Medical Accelerator in Chiba medium energy beam line. The radiation characteristics are presented for the DDR2 SDRAM (K4T1G164QE) fabricated in 56 nm technology. The statistical analyses and comparisons of the characteristics of chips fabricated with previous technologies are presented. The cross-section values for various single event categories were derived up to ~80 $MeVcm^2/mg$. Our comparison of the DDR2 SDRAM, which was fabricated in 56 nm technology node, with previous technologies, implies that the increased degree of integration causes the memory chip to become vulnerable to single-event functional interrupt, but resistant to single-event latch-up.

• 사물인터넷융복합논문지
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• 제9권3호
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• pp.81-86
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• 2023

플래시 메모리 기반 저장장치인 SSD(solid state disk)는 높은 집적도와 빠른 데이터 처리가 가능한 장점을 가지고 있다. 따라서 급격하게 증가하고 있는 빅데이터를 관리하는 고용량 데이터 저장 시스템의 저장장치로 활용되고 있다. 그러나 저장 미디어인 플래시 메모리에 일정 횟수 이상 반복해서 쓰기/지우기 동작을 반복하면 셀이 마모되어 사용하지 못하는 물리적 한계가 있다. 본 논문에서는 플래시 메모리의 불량률을 줄이고 수명을 연장하기 위해 불량이 발생한 다중 비트 셀을 단일 비트 셀로 변환하여 사용하는 방법을 제안한다. 제안하는 아이디어는 물리적 특징이 다르지만 동일하게 불량으로 처리되고 있는 다중 비트 셀과 단일 비트 셀의 불량 및 처리 방법을 구분하였다. 그리고 불량이 예상되는 다중 비트 셀을 단일 비트 셀로 변환하여 불량률을 개선하고 전체적인 수명을 연장하였다. 마지막으로 시뮬레이션을 통해 SSD의 증가한 수명을 측정하여 제안하는 아이디어의 효과를 증명하였다.