• 센서학회지
• /
• 제32권5호
• /
• pp.328-333
• /
• 2023

This study experimentally verified the etch rate of the SiO₂ sacrificial layer etching process with a single etch hole using vapor-phase hydrogen fluoride (VHF) etching. To fabricate small-sized polysilicon etch holes, both circular and triangular pattern masks were employed. Etch holes were fabricated in the polysilicon thin film on the SiO₂ sacrificial layer, and VHF etching was performed to release the polysilicon thin film. The lateral etch rate was measured for varying etch hole sizes and sacrificial layer thicknesses. Based on the measured results, we obtained an approximate equation for the etch rate as a function of the etch hole size and sacrificial layer thickness. The etch rates obtained in this study can be utilized to minimize structural damage caused by incomplete or excessive etching in sacrificial layer processes. In addition, the results of this study provide insights for optimizing sacrificial layer etching and properly designing the size and spacing of the etch holes. In the future, further research will be conducted to explore the formation of structures using chemical vapor deposition (CVD) processes to simultaneously seal etch hole and prevent adhesion owing to polysilicon film vibration.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2001년도 하계학술대회 논문집 C
• /
• pp.1924-1926
• /
• 2001

A novel wet release process ($\mu$ CARP - Micro Channel Assisted Release Process) for releasing an extreme large-area plate structure without etching hole is proposed and experimented. Etching holes in conventional process reduce a effective area and degrade an optical characteristics by a diffraction. In addition, as the area of a released structure increases, the stietion becomes more serious. The proposed process resolves these problems by the introduction of a micro fluidic channel beneath the structure which will be released. In this paper, a 5 mm${\times}$5mm-single crystal silicon plate structure was released by the proposed $\mu$CARP without etch holes on the structure. The variation in etching time with respect to the of the introduced micro channel is also examined. This process is expected to be beneficial for the actuator of a nano-scale data storage and the scanning mirror.

• 한국결정성장학회지
• /
• 제4권1호
• /
• pp.83-91
• /
• 1994

직경 2인치 갈륨비소 단결정을 위한 수직온도구배냉각 결정성장치를 제작하여 크롬과 인듐이 함께 도핑된 반절연 갈륨비소 단결정을 성장하였다. 함께 도핑된 결정에 대해서,불순물의 편석계수는 크롬 또는 인듐만을 도핑한 결정에서 편석계수와 비교할 때 변하지 않고 같은 값을 갖는다. 크롬과 인듐의 농도는 결정의 종자부분 부터 꼬리부분까지 각각 $2{\Times}10^{16}~3{\Times}10^{17} cm^{-3}$과 $2{\Times}10^{19}~3{\Times}10^{20} cm^{-3}$의 범위내에서 분포되었다. 평균 전위밀도는 결정의 전 영역에 걸쳐 약 $8000cm^{-2}$ 미만으로 관측되었다. 또한 인듐농도가 증가함에 따라 전위 밀도가 $1000m^{-2}$ 미만으로 감소하는 격자강화의 효과도 관찰할 수 있었다. 갈륨비소의 결정성장 방향에 따라 캐리어의 농도는 $10^{16}$에서 $10^8cm^{-3}$로 감소한 반면 비저항 값은 $10^{-2}$에서 $10^8$ Ohm-cm로 급격하게 증가하였다. 반절연의 특성은 크롬농도 약 $6{\Times}10^{16}cm^{-3}$의 농도이상에서 얻을 수 있었다. 성장된 단결정 내의 깊은 준위는 두 개의 전자덫인 $E_C-0.81eV, E_C-0.35eV$와 두 개의 정공덫인$E_V+0.89eV, E_V+0.65eV$이다.