• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2019년도 추계 학술논문 발표대회
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• pp.222-223
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• 2019

Waterproofing techniques used in underground structures do not reflect material and construction environments, but rely only on material properties, which inevitably lead to their limits in durable life. In particular, the government intends to investigate the current underground water treatment method and analyze the problems in order to prevent serious corrosion and aging of structures caused by underground water leaks and poor construction.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.293-294
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• 2009

We proposed a novel single gap transflective liquid crystal display (LCD) using liquid crystal with negative dielectric anisotropy. We designed cell structure driven by fringe electric field in the transmissive (T) part and vertical electric field in the reflective (R) part. In the device, high surface pretilt angle of the LC in the R-part is achieved through polymerization of an UV curable reactive mesogen (RM) monomer at surfaces. By optimizing the parameters, a newly developed transflective display has characteristics such as single gap and single gamma curve.

• 한국전기전자재료학회논문지
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• 제23권12호
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• pp.973-977
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• 2010

The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [$^{\circ}C$] to 85 [$^{\circ}C$], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [$^{\circ}C$] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [$^{\circ}C$] in ambient temperature.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.851-855
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• 2005

We investigated the unbalanced characteristics of the superconducting fault current limiters (SFCLs) based on YBCO thin films with a single line-to-ground fault. When a single line-to-ground fault occurred, the short circuit current of a fault phase increased about 6 times of transport currents after the fault onset but was effectively limited to the designed current level within 2 ms by the resistance development of the SFCL. The fault currents of the sound phases almost did not change because of their direct grounding system. The unbalanced rates of a fault phase were distributed from 6.4 to 1.4. It was found that the unbalanced rates of currents were noticeably improved within one cycle after the fault onset. We calculated the zero phase currents for a single line-to-ground fault using the balanced component analysis. The positive sequence resistance was reduced remarkably right after the fault onset but eventually approached the balanced positive resistance component prior to the system fault. This means that the system reaches almost the three-phase balanced state in about 60 ms after the fault onset at the three-phase system.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.180-181
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• 2006

As a rule, high temperature superconducting coated conductors have multi-layered buffers consisting of seed, diffusion barrier and cap layers. Multi-buffer layer deposition requires longer fabrication time. This is one of main reasons which increases fabrication cost Thus, single buffer layer deposition seems to be important for practical coated conductor process. In this study, a single layered buffer deposition of $CeO_2$ for low cost coated conductors has been tried using thermal evaporation technique 100nm-thick $CeO_2$ layers deposited by thermal evaporation were found to act as a diffusion layer. $0.4{\mu}m$-thick SmBCO superconducting layers were deposited by thermal co-evaporation on the $CeO_2$ buffered Ni-W substrate. Critical current of 118A/$cm^2$ was obtained for the SmBCO coated conductors.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.57-60
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• 2004

This paper presents multibit Sigma-Delta ADC using Leslie-Singh Structure to Improve nonlinearity of feedback loop. 4-bit flash ADC for multibit Quantization in Sigma Delta modulator offers the following advantages such as lower quantization noise, more accurate white-noise level and more stability over single quantization. For the feedback paths consisting of DAC, the DAC element should have a high matching requirement in order to maintain the linearity performance which can be obtained by the modulator with a multibit quantizer. Thus a Sigma-Delta ADC usually adds the dynamic element matching digital circuit within feedback loop. It occurs complexity of Sigma-Delta Circuit and increase of power dissipation. In this paper using the Leslie-Singh Structure for improving nonliearity of ADC. This structure operate at low oversampling ratio but is difficult to achieve high resolution. So in this paper propose improving loop filter for single-bit feedback multi-bit quantization Sigma-Delta ADC. It obtained 94.3dB signal to noise ratio over 615kHz bandwidth, and 62mW power dissipation at a sampling frequency of 19.6MHz. This Sigma Delta ADC is fabricated in 0.25um CMOS technology with 2.5V supply voltage.

• 한국전기전자재료학회논문지
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• 제30권2호
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• pp.101-105
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• 2017

In this paper, the magnetization characteristics and the stored energy of magnetically coupled superconducting fault current limiter (SFCL)s using single and double high-Tc superconducting (HTSC) elements were compared. To analyze the magnetization characteristics and the stored energy, the magnetizing current and the flux linkage, which were derived from the electrical equivalent circuit of the SFCL using single and double HTSC elements, were calculated from the voltages and the current measured in the short-circuit tests. Through the comparative analysis on the magnetization characteristics and the stored energy for SFCL using sing and double HTSC elements, the magnetically coupled SFCL using double HTSC elements was shown to be more effective than the SFCL using single HTSC element from the point of view of the magnetic saturation.

• 한국정밀공학회지
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• 제29권3호
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• pp.247-252
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• 2012

This study has been focused on application of ELID mirror-surface grinding technology for manufacturing single crystal optic sapphire. Single crystal sapphire is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. Mirror-surface machining technology is necessary to use sapphire as optic parts. The ELID grinding system has been set up for machining of the sapphire material. According to the ELID experimental results, it shows that the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.

• 한국전기전자재료학회논문지
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• 제16권1호
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• pp.77-82
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• 2003

The ac loss is an important issue in the design of high-Tc superconducting power devices such as transformers and cables. In these devices many Bi-2223 tapes are closely stacked together and exposed to alternating magnetic fields that can have different orientations with respect to a tape. In such arrangement the magnetization loss is influenced by the screening current induced in adjacent tapes and thus different from that in a single tape. This stacking effect was experimentally investigated by measuring the magnetization loss in a stack, which consists of a number of tapes. First the magnetization loss in the single tape was measured in order to confirm the reliability of the loss data measured in the stack. The results for the single tape coincide well will the loss characteristics described in other previous works. For the stack In parallel and longitudinal magnetic fields the measured loss is Independent of both the number of tapes and stacking type. The longitudinal magnetization loss Is well explained rather by the slab model for decoupled filaments. For the tall stack in perpendicular field the measured loss at low fields is greatly decreased, compared to the loss of the single tape. However the loss at high fields is unaffected. These loss behaviors in the tall stack are well described by the slab model for full coupling.