• 제목/요약/키워드: Simple CU test

검색결과 29건 처리시간 0.026초

Fine-Pitch Solder on Pad Process for Microbump Interconnection

  • Bae, Hyun-Cheol;Lee, Haksun;Choi, Kwang-Seong;Eom, Yong-Sung
    • ETRI Journal
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    • 제35권6호
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    • pp.1152-1155
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    • 2013
  • A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

Chitosan Bead를 이용한 Cd등의 중금속 이온의 흡착제거 (Adsorption of Heavy Metal Ions(Cadmium etc.) using Chitosan Bead)

  • 권성환;김기환;장문석;유재근
    • 환경위생공학
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    • 제11권3호
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    • pp.21-27
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    • 1996
  • Chitosan is a natural polyelectrolytic compound. Researches of adsorption capacity using chitosan have been doing actively. We prepared bead type gel, simple modifier of chitosan, And then experimented adsorption test of heavy metals (Cd etc) using it. According to the result adsorption capacity of chitosan bead was five times higher than chitosan powder. Removal rate of cadmium resulted 90% over in the test that initial concentration of Cd was 100mg/L and bead dosage was 6g/100mL. Adsorption type of heavy metals was similar to general adsorption curve. And optical pH range was 4 - 10 in the adsorption test. In the experiments of other heavy metals (Pb, Zn, Cu, Mn) adsorption types had two stages, highly removal rate-stage at the short time (20minutes) and then slow rate-stage at the after. And removal efficiency at the variable pH ranges revealed relatively good.

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다덕광산 주변지역에서의 독성원소들의 환경오염 및 인체흡수도 (Environmental Contamination and Bioavailability of Toxic Element around the Daduk Mine Area, Korea)

  • 이진수;;;전효택
    • 자원환경지질
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    • 제33권4호
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    • pp.273-282
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    • 2000
  • In order to investigate the extent and degree of arsenic and heavy metal contamination and the bioavailability of toxic elements around the abandoned mine in Korea, an environmental geochemical survey was undertaken in the Daduk mine. After appropriate preparation, tailings, soil, stream sediment, crop plant and fingernail samples were analysed for As, Cd, Cu, Pb and Zn by ICP-AES and ICP-MS. Elevated levels of 8,782 mg/kg As, 8.3 mg/kg Cd, 489 mg/kg Cu, 3,638 mg/kg Pb and 919 mg/kg Zn were found in tailings from the Daduk mine. These significant concentrations can impact on soils and sediments around the tailing ponds. Mean concentrations of As, Cd, Pb, Cu and Zn in soils are significantly higher than those in world average soil, especially for As and Pb. Element concentrations in sediments decrease with distance from the tailing ponds due to a dilution effect by the mixing of uncontaminated sediments. Arsenic and Cd are elevated in rice grains and stalks, and Cu and Zn concentrations in chinese cabbage, sesame and bean leaves are higher than the upper limit values for normal plant. Arsenic concentration in fingernails of farmers are higher than the normal level with a maximum value of 1.5 mg/kg. The post-ingestion bioavailability of toxic heavy metals in some paddy and farmland soils has been also investigated using the SBET (simple bioavailability extract test) method. The method utilises synthetic leaching fluids closelyanalogous to those of the human stomach. The quantities of As, Cd, Cu, Pb and Zn extracted from paddy soils after 1 hour indicated 15.9, 65.4, 46.2, 39.4 and 29.4% bioavailability, respectively and for farmland soils, 12.4, 26.0, 31.2, 29.3 and 19.4% bioavailability, respectively. The results of the SBET indicate that regular ingestion of soils by the local population could pose a potential health threat due to long-term toxic element exposure.

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플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석 (An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages)

  • 신기훈;김형태;장동영
    • 한국공작기계학회논문집
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    • 제16권5호
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    • pp.134-139
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    • 2007
  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

마찰재에 함유된 금속섬유와 마찰 특성의 연관관계 (The Effect of Metal Fibers on the Tribology of Automotive Friction Materials)

  • 고길주;조민형;장호
    • Tribology and Lubricants
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    • 제17권4호
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    • pp.267-275
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    • 2001
  • Friction and wear properties of brake friction materials containing different metal fibers (Al, Cu or Steel fibers) were investigated. Based on a simple experimental formulation, friction materials with the same amount of metal fibers were tested using a pad-on-disk type friction tester. Two different materials (gray cast iron and aluminum metal matrix composite (MMC)) were used for disks rubbing against the friction materials. Results front ambient temperature tests revealed that the friction material containing Cu fibers sliding against gray cast iron disk showed a distinct negative $\mu$-v (friction coefficient vs. sliding velocity) relation implying possible stick-slip generation at low speeds. The negative $\mu$- v relation was not observed when the Cu-containing friction materials were rubbed against the Al-MMC counter surface. Elevated temperature tests showed that the friction level and the intensity of friction force oscillation were strongly affected by the thermal conductivity and melting temperature of metallic ingredients of the friction couple. Friction materials slid against cast iron disks exhibited higher friction coefficients than Al-MMC (metal matrix composite) disks during high temperature tests. On the other hand, high temperature test results suggested that copper fibers in the friction material improved fade resistance and that steel fibers were not compatible with Al-MMC disks showing severe material transfer and erratic friction behavior during sliding at elevated temperatures.

황복(Takifugu obscurus)에 대한 중금속, 유기주석화합물 및 다환방향족탄화수소(PAHs)의 급성 독성 (Acute Toxicity of Dissolved Inorganic Metals, Organotins and Polycyclic Aromatic Hydrocarbons to Puffer Fish, Takifugu obscurus)

  • 이정석;이규태;김동훈;김진형;한경남
    • Environmental Analysis Health and Toxicology
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    • 제19권2호
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    • pp.141-151
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    • 2004
  • We exposed juvenile puffer fish, Takifugu obscurus(30 days after hatching) to various aqueous pollutants including 4 kinds of inorganic metals (Ag, Cd, Cu and Hg), 2 organotin compound.; (tributyltin [TBT] and triphenyltin[TPhT]) and 5 polycyclic aromatic hydrocarbon (PAH) compounds (chrysene, fluoranthene, naphthalene, phenanthrene and pyrene) to estimate median lethal concentrations (LC50s) of each pollutant after the 96-hour acute exposure. Among the inorganic metals, Hg (52 $\mu\textrm{g}$/L; 96-h LC50) was most toxic to test animals and followed by Ag (164 $\mu\textrm{g}$/L), Cu (440 $\mu\textrm{g}$/L) and Cd (1180 $\mu\textrm{g}$/L). Aqueous TBT was more toxic between the two organotins; the 96-h LC50 for TBT (5.1 $\mu\textrm{g}$/L) was 3 times lower than that of TPhT (17.3 $\mu\textrm{g}$/L). The acute toxicity of PAH compounds was highest for chrysene (1.5 $\mu\textrm{g}$/L; 96-h LC50) and decreased in the order of pyrene (65 $\mu\textrm{g}$/L) > fluoranthene (158 $\mu\textrm{g}$/L) > phenanthrene (432 $\mu\textrm{g}$/L) > naphthalene (8690 $\mu\textrm{g}$/L). The toxicity of PAH compounds wat closely related to their physico-chemical characteristics such as $K_{ow}$ and water solubility, and well explained by simple QSAR relationship. The sensitivity of puffer fish to various inorganic and organic pollutants was generally comparable to various fish species widely used as standard test species in previous studies and further evaluation should be conducted to develop adequate testing procedure for T. obscurus when used in various toxicity tests.

이종재료를 사용한 다층 박막에서의 잔류응력 평가 (Evaluation of the Residual Stress on the Multi-layer Thin Film made of Different Materials)

  • 심재준;한근조;김태형;안성찬;한동섭;이성욱
    • 한국정밀공학회지
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    • 제20권9호
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    • pp.135-141
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    • 2003
  • MEMS structures generally have been fabricated using surface-machining method, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to the residual stress inducing by the applied the various loads. And the very important physical property in the heated environment is the linear coefficient of thermal expansion. Therefore this paper studied the residual stress caused the thermal loads in the thin film and introduced the simple method to measure the trend of the residual stress by the indentation. Specimens were made of materials such as Al, Au and Cu and thermal load was applied repeatedly. The residual stress was measured by nano-indentation using AFM and FEA. The existence of the residual stress due to thermal load was verified by the experimental results. The indentation length of the thermal loaded specimens increased minimum 11.8% comparing with the virgin thin film caused by tensile residual stress. The finite element analysis results are similar to indentation test.

비정질 합금의 소성 2: 불균일변형 (Plasticity of Amorphous Alloys: 2. Inhomogeneous Deformation)

  • 박경원;이창면;이재철
    • 대한금속재료학회지
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    • 제47권11호
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    • pp.773-785
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    • 2009
  • Studies of a number of Cu-Zr amorphous alloys have demonstrated that those exhibiting greater plastic strain during homogeneous deformation at room temperature show lower global plasticity associated with inhomogeneous deformation in a typical compression test. Using a combination of experiments and molecular dynamics simulations, we clarify this seeming paradox between the homogeneous and inhomogeneous deformation by exploring the microstructural aspects in view of the structural disordering, disorder-induced softening, and shear localization and relate these findings to the global plasticity of bulk amorphous alloys. Additional analyses were conducted to derive a simple structural parameter that allows the prediction of the global plasticity of bulk amorphous alloys.

MCM/PCB 회로패턴 검사에서 SEM의 전자빔을 이용한 측정방법 (Characterization Method for Testing Circuit Patterns on MCM/PCB Modules with Electron Beams of a Scanning Electron Microscope)

  • 김준일;신준균;지용
    • 전자공학회논문지D
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    • 제35D권9호
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    • pp.26-34
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    • 1998
  • 본 논문은 주사전자현미경(SEM)의 전자총을 이용하여 MCM 또는 PCB 회로기판의 신호연결선에서 전압차를 유도시켜 개방/단락 등의 결함을 측정 검사하는 방법을 제시한다. 본 실험에서는 주사전자현미경의 구조를 변형시키지 알고 회로기판의 개방/단락 검사를 실시할 수 있는 이중전위전자빔(Dual Potential) 검사방법을 사용한다. 이중전위전자빔(Dual Potential) 측정검사 방법은 이차전자수율 값 δ의 차이를 유기시키는 δ < 1 인 충전 전자빔과 δ > 1 인 읽기 전자빔을 사용하여 한 개의 전자총이 각각 다른 가속전압에 의해 생성된 두 개의 전자빔으로 측정하는 방법으로 특정 회로네트에 대한 개방/단락 등의 측정 검사가 가능하다. 또한 읽기 전자빔을 이용할 경우 검사한 회로 네트를 방전시킬 수 있어 기판 도체에 유기된 전압차를 없앨 수 있는 방전시험도 실시할 수 있어, 많은 수의 회로네트를 지닌 회로 기판에 대해 측정 검사할 때 충전되어 있는 회로네트에 대한 측정오류를 줄일 수 있다. 측정검사를 실시한 결과 glass-epoxy 회로기판 위에 실장된 구리(Cu) 신호연결선은 7KeV의 충전 전자빔으로 충전시키고 10초 이내에 주사전자현미경을 읽기 모드로 바꾸어 2KeV의 읽기 전자빔으로 구리표면에서의 명암 밝기 차이를 읽어 개방/단락 상태를 검사할 수 있었다. 또한 IC 칩의 Au 패드와 BGA의 Au 도금된 Cu 회로패드를 검사한 결과도 7KeV 충전 전자빔과 2KeV 읽기 전자빔으로 IC칩 내부회로에서의 개방 단락 상태를 쉽게 검사할 수 있었다. 이 검사방법은 주사전자현미경에 있는 한 개의 전자총으로 비파괴적으로 회로 기판의 신호 연결선의 개방/단락 상태를 측정 검사할 수 있음을 보여 주었다.

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파래의 포자형성률을 이용한 해양생태독성시험 방법에 관한 연구 (Development of Marine Ecotoxicological Standard Methods for Ulva Sporulation Test)

  • 한태준;한영석;박경수;이승민
    • 한국해양학회지:바다
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    • 제13권2호
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    • pp.121-128
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    • 2008
  • 해조류를 이용한 수생태독성시험법으로 대형 녹조 구멍갈파래(Ulva pertusa)의 포자형성률을 endpoint로 사용하는 독성시험법이 개발되었다. 생태독성시험을 위한 최적 조건은 광조사량 $100\;{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$, 수소이온농도(pH) $7{\sim}9$, 염분 $25{\sim}35\;psu$ 그리고 수온 $15{\sim}20^{\circ}C$이다. 본 시험법의 민감도는 표준중금속(Cd, Cu, Pb, Zn)을 가지고 확인하였고, 오염 시료에 적용 가능성은 9 지역의 산업폐수 또는 생활하수 오니 용출액(elutriate)을 이용하여 이루어졌다. 네 종의 중금속에 대한 포자형성률 억제 반응의 $EC_{50}$ 값을 산출한 결과, 구리($0.062\;{mg}{\cdot}L^{-1}$) > 카드뮴($0.208\;mg{\cdot}L^{-1}$) >납($0.718\;mg{\cdot}L^{-1}$) > 아연($0.776\;mg{\cdot}L^{-1}$) 순으로 민감하게 나타났는데, 이러한 결과는 US EPA에서 제공하는 ECOTOX DB에 탑재되어 있는 국제적으로 공인된 수생태 독성시험법 결과와 비교해 볼 때, 더 높은 중금속 민감성을 보였다. 현장시료에 대한 포자형성률 억제 반응의 $EC_{50}$ 값을 살펴보면 산업폐수오니($EC_{50}=6.78%$)에서 가장 높고 정수장오니($EC_{50}=15.00%$)에서 가장 낮은 독성 반응을 보이는 것으로 나타났다. 산업폐수 또는 생활하수오니 용출액내에 함유된 독성원 농도와 산출된 $EC_{50}$ 값 사이에 상관성을 밝히기 위해 Spearman rank correlation test를 실시한 결과, 구리, 카드뮴, 납 그리고 아연이 구멍갈파래의 포자형성 저해 반응과 밀접한 상관관계가 있는 것으로 확인되었다. 본 시험법은 독성 민감성이 높고, 사용이 간편하고, 경제적이고, 해석이 용이하며, 대량의 시험재료 확보가 상시 가능하고, 배양이 어렵지 않아 매우 편리한 시스템이라고 할 수 있다. 특히, 파래의 포자형성 과정이 파래 집단의 성쇠와 밀접한 관련이 있으므로 생태적인 의미까지 포함하기에 보다 다양한 독성물질을 대상으로 독성민감성이 확인될 경우, 수서 생태독성을 진단하는데 유용한 프로토콜로 사용될 수 있을 것으로 사료된다. 또한, 파래류는 넓은 지리적 분포와 속 수준에서 포자형성 과정의 유사성 때문에 전 세계적으로 광역적 적용이 가능할 것으로 기대된다.