• Title/Summary/Keyword: Simple CU test

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Fine-Pitch Solder on Pad Process for Microbump Interconnection

  • Bae, Hyun-Cheol;Lee, Haksun;Choi, Kwang-Seong;Eom, Yong-Sung
    • ETRI Journal
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    • v.35 no.6
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    • pp.1152-1155
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    • 2013
  • A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

Adsorption of Heavy Metal Ions(Cadmium etc.) using Chitosan Bead (Chitosan Bead를 이용한 Cd등의 중금속 이온의 흡착제거)

  • 권성환;김기환;장문석;유재근
    • Journal of environmental and Sanitary engineering
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    • v.11 no.3
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    • pp.21-27
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    • 1996
  • Chitosan is a natural polyelectrolytic compound. Researches of adsorption capacity using chitosan have been doing actively. We prepared bead type gel, simple modifier of chitosan, And then experimented adsorption test of heavy metals (Cd etc) using it. According to the result adsorption capacity of chitosan bead was five times higher than chitosan powder. Removal rate of cadmium resulted 90% over in the test that initial concentration of Cd was 100mg/L and bead dosage was 6g/100mL. Adsorption type of heavy metals was similar to general adsorption curve. And optical pH range was 4 - 10 in the adsorption test. In the experiments of other heavy metals (Pb, Zn, Cu, Mn) adsorption types had two stages, highly removal rate-stage at the short time (20minutes) and then slow rate-stage at the after. And removal efficiency at the variable pH ranges revealed relatively good.

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Environmental Contamination and Bioavailability of Toxic Element around the Daduk Mine Area, Korea (다덕광산 주변지역에서의 독성원소들의 환경오염 및 인체흡수도)

  • ;Ben A Klinck;Yvette Moore
    • Economic and Environmental Geology
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    • v.33 no.4
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    • pp.273-282
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    • 2000
  • In order to investigate the extent and degree of arsenic and heavy metal contamination and the bioavailability of toxic elements around the abandoned mine in Korea, an environmental geochemical survey was undertaken in the Daduk mine. After appropriate preparation, tailings, soil, stream sediment, crop plant and fingernail samples were analysed for As, Cd, Cu, Pb and Zn by ICP-AES and ICP-MS. Elevated levels of 8,782 mg/kg As, 8.3 mg/kg Cd, 489 mg/kg Cu, 3,638 mg/kg Pb and 919 mg/kg Zn were found in tailings from the Daduk mine. These significant concentrations can impact on soils and sediments around the tailing ponds. Mean concentrations of As, Cd, Pb, Cu and Zn in soils are significantly higher than those in world average soil, especially for As and Pb. Element concentrations in sediments decrease with distance from the tailing ponds due to a dilution effect by the mixing of uncontaminated sediments. Arsenic and Cd are elevated in rice grains and stalks, and Cu and Zn concentrations in chinese cabbage, sesame and bean leaves are higher than the upper limit values for normal plant. Arsenic concentration in fingernails of farmers are higher than the normal level with a maximum value of 1.5 mg/kg. The post-ingestion bioavailability of toxic heavy metals in some paddy and farmland soils has been also investigated using the SBET (simple bioavailability extract test) method. The method utilises synthetic leaching fluids closelyanalogous to those of the human stomach. The quantities of As, Cd, Cu, Pb and Zn extracted from paddy soils after 1 hour indicated 15.9, 65.4, 46.2, 39.4 and 29.4% bioavailability, respectively and for farmland soils, 12.4, 26.0, 31.2, 29.3 and 19.4% bioavailability, respectively. The results of the SBET indicate that regular ingestion of soils by the local population could pose a potential health threat due to long-term toxic element exposure.

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An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages (플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석)

  • Shin, Ki-Hoon;Kim, Hyoung-Tae;Jang, Dong-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.134-139
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    • 2007
  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

The Effect of Metal Fibers on the Tribology of Automotive Friction Materials (마찰재에 함유된 금속섬유와 마찰 특성의 연관관계)

  • Ko, Kil-Ju;Cho, Min-Hyung;Jang, Ho
    • Tribology and Lubricants
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    • v.17 no.4
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    • pp.267-275
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    • 2001
  • Friction and wear properties of brake friction materials containing different metal fibers (Al, Cu or Steel fibers) were investigated. Based on a simple experimental formulation, friction materials with the same amount of metal fibers were tested using a pad-on-disk type friction tester. Two different materials (gray cast iron and aluminum metal matrix composite (MMC)) were used for disks rubbing against the friction materials. Results front ambient temperature tests revealed that the friction material containing Cu fibers sliding against gray cast iron disk showed a distinct negative $\mu$-v (friction coefficient vs. sliding velocity) relation implying possible stick-slip generation at low speeds. The negative $\mu$- v relation was not observed when the Cu-containing friction materials were rubbed against the Al-MMC counter surface. Elevated temperature tests showed that the friction level and the intensity of friction force oscillation were strongly affected by the thermal conductivity and melting temperature of metallic ingredients of the friction couple. Friction materials slid against cast iron disks exhibited higher friction coefficients than Al-MMC (metal matrix composite) disks during high temperature tests. On the other hand, high temperature test results suggested that copper fibers in the friction material improved fade resistance and that steel fibers were not compatible with Al-MMC disks showing severe material transfer and erratic friction behavior during sliding at elevated temperatures.

Acute Toxicity of Dissolved Inorganic Metals, Organotins and Polycyclic Aromatic Hydrocarbons to Puffer Fish, Takifugu obscurus (황복(Takifugu obscurus)에 대한 중금속, 유기주석화합물 및 다환방향족탄화수소(PAHs)의 급성 독성)

  • Lee Jung-Suk;Lee Kyu-Tae;Kim Dong-Hoon;Kim Jin-Hyeong;Han Kyung-Nam
    • Environmental Analysis Health and Toxicology
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    • v.19 no.2
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    • pp.141-151
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    • 2004
  • We exposed juvenile puffer fish, Takifugu obscurus(30 days after hatching) to various aqueous pollutants including 4 kinds of inorganic metals (Ag, Cd, Cu and Hg), 2 organotin compound.; (tributyltin [TBT] and triphenyltin[TPhT]) and 5 polycyclic aromatic hydrocarbon (PAH) compounds (chrysene, fluoranthene, naphthalene, phenanthrene and pyrene) to estimate median lethal concentrations (LC50s) of each pollutant after the 96-hour acute exposure. Among the inorganic metals, Hg (52 $\mu\textrm{g}$/L; 96-h LC50) was most toxic to test animals and followed by Ag (164 $\mu\textrm{g}$/L), Cu (440 $\mu\textrm{g}$/L) and Cd (1180 $\mu\textrm{g}$/L). Aqueous TBT was more toxic between the two organotins; the 96-h LC50 for TBT (5.1 $\mu\textrm{g}$/L) was 3 times lower than that of TPhT (17.3 $\mu\textrm{g}$/L). The acute toxicity of PAH compounds was highest for chrysene (1.5 $\mu\textrm{g}$/L; 96-h LC50) and decreased in the order of pyrene (65 $\mu\textrm{g}$/L) > fluoranthene (158 $\mu\textrm{g}$/L) > phenanthrene (432 $\mu\textrm{g}$/L) > naphthalene (8690 $\mu\textrm{g}$/L). The toxicity of PAH compounds wat closely related to their physico-chemical characteristics such as $K_{ow}$ and water solubility, and well explained by simple QSAR relationship. The sensitivity of puffer fish to various inorganic and organic pollutants was generally comparable to various fish species widely used as standard test species in previous studies and further evaluation should be conducted to develop adequate testing procedure for T. obscurus when used in various toxicity tests.

Evaluation of the Residual Stress on the Multi-layer Thin Film made of Different Materials (이종재료를 사용한 다층 박막에서의 잔류응력 평가)

  • 심재준;한근조;김태형;안성찬;한동섭;이성욱
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.9
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    • pp.135-141
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    • 2003
  • MEMS structures generally have been fabricated using surface-machining method, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to the residual stress inducing by the applied the various loads. And the very important physical property in the heated environment is the linear coefficient of thermal expansion. Therefore this paper studied the residual stress caused the thermal loads in the thin film and introduced the simple method to measure the trend of the residual stress by the indentation. Specimens were made of materials such as Al, Au and Cu and thermal load was applied repeatedly. The residual stress was measured by nano-indentation using AFM and FEA. The existence of the residual stress due to thermal load was verified by the experimental results. The indentation length of the thermal loaded specimens increased minimum 11.8% comparing with the virgin thin film caused by tensile residual stress. The finite element analysis results are similar to indentation test.

Plasticity of Amorphous Alloys: 2. Inhomogeneous Deformation (비정질 합금의 소성 2: 불균일변형)

  • Park, Kyoung-Won;Lee, Chang-Myeon;Lee, Jae-Chul
    • Korean Journal of Metals and Materials
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    • v.47 no.11
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    • pp.773-785
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    • 2009
  • Studies of a number of Cu-Zr amorphous alloys have demonstrated that those exhibiting greater plastic strain during homogeneous deformation at room temperature show lower global plasticity associated with inhomogeneous deformation in a typical compression test. Using a combination of experiments and molecular dynamics simulations, we clarify this seeming paradox between the homogeneous and inhomogeneous deformation by exploring the microstructural aspects in view of the structural disordering, disorder-induced softening, and shear localization and relate these findings to the global plasticity of bulk amorphous alloys. Additional analyses were conducted to derive a simple structural parameter that allows the prediction of the global plasticity of bulk amorphous alloys.

Characterization Method for Testing Circuit Patterns on MCM/PCB Modules with Electron Beams of a Scanning Electron Microscope (MCM/PCB 회로패턴 검사에서 SEM의 전자빔을 이용한 측정방법)

  • Kim, Joon-Il;Shin, Joon-Kyun;Jee, Yong
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.9
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    • pp.26-34
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    • 1998
  • This paper presents a characterization method for faults of circuit patterns on MCM(Multichip Module) or PCB(Printed Circuit Board) substrates with electron beams of a SEM(Scanning Electron Microscope) by inducing voltage contrast on the signal line. The experimentation employes dual potential electron beams for the fault characterization of circuit patterns with a commercial SEM without modifying its structure. The testing procedure utilizes only one electron gun for the generation of dual potential electron beams by two different accelerating voltages, one for charging electron beam which introduces the yield of secondary electron $\delta$ < 1 and the other for reading beam which introduces $\delta$ > 1. Reading beam can read open's/short's of a specific net among many test nets, simultaneously discharging during the reading process for the next step, by removing its voltage contrast. The experimental results of testing the copper signal lines on glass-epoxy substrates showed that the state of open's/short's had generated the brightness contrast due to the voltage contrast on the surface of copper conductor line, when the net had charged with charging electron beams of 7KV accelerating voltages and then read with scanning reading electron beams of 2KV accelerating voltages in 10 seconds. The experimental results with Au pads of a IC die and Au plated Cu pads of BGA substrates provided the simple test method of circuit lines with 7KV charging electron beam and 2KV reading beam. Thus the characterization method showed that we can test open and short circuits of the net nondestructively by using dual potential electron beams with one SEM gun.

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Development of Marine Ecotoxicological Standard Methods for Ulva Sporulation Test (파래의 포자형성률을 이용한 해양생태독성시험 방법에 관한 연구)

  • Han, Tae-Jun;Han, Young-Seok;Park, Gyung-Soo;Lee, Seung-Min
    • The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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    • v.13 no.2
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    • pp.121-128
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    • 2008
  • As an aquatic ecotoxicity test method, a bioassay using the inhibition of sporualtion of the green macroalga, Ulva pertusa, has been developed. Optimal test conditions determined for photon irradiance, pH, salinity and temperature were $100\;{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$, $7{\sim}9$, $25{\sim}35\;psu$ and $15{\sim}20^{\circ}C$, respectively. The validity of the test endpoint was evaluated by assessing the toxicity of four metals (Cd, Cu, Pb, Zn) and elutriates of sewage or waste sludge collected from 9 different locations. When the metals were assayed, the $EC_{50}$ values indicated the following toxicity rankings: Cu ($0.062\;mg{\cdot}L^{-1}$) > Cd ($0.208\;mg{\cdot}L^{-1}$) > Pb ($0.718\;mg{\cdot}L^{-1}$) > Zn ($0.776\;mg{\cdot}L^{-1}$). When compared with other commonly used bioassays of metal pollution listed on US ECOTOX database, the sporualtion test proved to be the most sensitive. Ulva sporulation was significantly inhibited in all elutriates with the greatest and least effects observed in elutriates of sludge from industrial waste ($EC_{50}=6.78%$) and filtration bed ($EC_{50}=15.0%$), respectively. The results of the Spearman rank correlation analysis for $EC_{50}$ data versus the concentrations of toxicants in the sludge presented a significant correlation between toxicity and four heavy metals(Cd, Cu, Pb, Zn). The method described here is sensitive to toxicants, simple to use, easy to interpret and economical. It is also easy to procure samples and maintain cultures. The present method would therefore probably make a useful assessment of aquatic toxicity of a wide range of toxicants. In addition, the genus Ulva has a wide geographical distribution and species have similar reproductive processes, so the test method would have a potential application worldwide.