• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.15-23
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• 2015

Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.

• Analytical Science and Technology
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• v.12 no.2
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• pp.171-175
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• 1999

Carbon paste electrodes, modified with podands containing more than two sulfur atoms, have been employed for the voltammetric determination of Ag(I) ion from aqueous solution. The voltammetric response was characterized with respect to paste composition, preconcentration method, kind of anion, variation of pH, Ag(I) ion concentration, and possible interferences. Linear calibration curves were obtained for Ag(I) ion concentration ranging from $1.0{\times}10^{-6}$ to $9.0{\times}10^{-5}M$, and detection limit was $5.0{\times}10^{-7}M$.

• Analytical Science and Technology
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• v.15 no.1
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• pp.91-95
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• 2002

Carbon paste electrodes, modified with 5,6,14,15-dibenzo-1,4-dioxa-8,12-diazacyclopentadeca-5,14-diene containing different ligating atoms of oxygen and nitrogen, have been employed for the voltammetric determination of Ag(I) ion from aqueous solution. The voltammetric response was characterized with respect to paste composition, preconcentration method, kind of anion, variation of pH, Ag(I) ion concentration, and possible interferences. Linear calibration curves were obtained for Ag(I) ion concentration ranging from $3.0{\times}10^{-6}M$ to $8.0{\times}10^{-5}M$, and detection limit was $8.5{\times}10^{-7}M$.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.42 no.4
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• pp.716-722
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• 2017

In this paper, a fully printed NFC tag operating at 13.56 MHz was designed and fabricated using silver nano-paste and carbon ink. The proposed NFC tag has a printed coil with an inductance of $2.74{\mu}H$ on a PI film for application to an NFC tag IC with an internal capacitance of 50 pF. Screen printing technology used in this paper has advantages such as large area printing for mass production, low cost and eco-friendly process compared to conventional PCB manufacturing process. The proposed structure consists of a circular coil implemented as a single layer using silver nano-paste and carbon ink, a jumper pattern for chip mounting between the outer edge and the center of the coil, and an insulation pattern between the coil and the jumper pattern. In order to verify the performance of the proposed NFC tag, we performed the measurements of the printing line width, thickness, line resistance, adhesion and environmental reliability, and confirmed the suitability of the NFC tag based on the full-printed manufacturing method.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.6
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• pp.539-545
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• 2014

Contact resistivity between silver electrodes and the emitter layer of a silicon solar cell wafer has been measured using either the circular transmission line method or the linear transmission line method. The circular transmission line method has an advantage over the linear transmission line method, in that it does not require an additional process for mesa etching to eliminate the leakage current. In contrast, the linear transmission line method has the advantage that its specimen can be acquired directly from a silicon solar cell. In this study, measured resistance data for the calculation of contact resistivity is compared for these two methods, and the mechanism by which the linear transmission line method can more realistically reflect the impact of the width and thickness of a silver electrode on contact resistivity is investigated.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.68-73
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• 2016

Silver nanoparticles were prepared by chemical reduction-protection method using 1-decanoic acid and tri-n-octylphosphine as surfactants, and using $NaBH_4$ as a reducing agent. The silver nanoparticles were also studied for their formation, structure, morphology and size using UV-Visible spectroscopy, XRD, TEM and SEM. Further the viscosity of the silver paste and the surface resistance of the silver metal film produced by screen coating onto a PET film were investigated. Well dispersed and quasispherical silver nanoparticles with the size of 10-200 nm were obtained under the optimal molar ratio of $NaBH_4/AgNO_3=1:5$. The surface resistance of silver metal film coated on the PET film made with the silver nanoparticles under the optimal molar ratio showed a minal value of $41{\mu}{\Omega}/cm^2$.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.2
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• pp.1-12
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• 2012

In this experiment, we have manufactured thermal-curable silver pastes for direct printing. And to enhance conductivity, printability, adhesion and hardness during polymer direct-gravure prints, we have manufactured Ag pastes by adding variety of filter contents. Then we have investigated characteristics of rheology in paste according to the gravure printability and the properties of printed conductive patterns. Depending on a variety of Ag powder, there was a big difference in sharpness of printed pattern. And also by the use of carbon, there was a big difference in amount of solvent used, conductivity and in hardness. We could improve doctoring and the sharpness of a pattern by adding Ag paste in carbon particle, but as we have used nano-sized particle, there was an increase in the amount of solvent used and also we have found out that it gives a bad effect as adhesive and hardness becomes weaker. Even though Ag particle has the same spherical shape, the surface treatments could differ from one another. And by the appropriate choice and with the suitable combination of Ag powder, excellent printability and conductivity could be obtained.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.35-40
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• 2022

In this study, the average particle size of silver powder was 2㎛, 7㎛, and a mixture of these (50:50wt%), three kinds of silver pastes were prepared. In addition, as a result of examining the viscosity and viscoelasticity of the three silver pastes, TGA measurement, resistance change according to strain, and change in surface structure of the electrode, the following conclusions were obtained. Summarizing these results, it was found that it is most desirable to have a particle size of about 2㎛ in order to minimize the change in resistance due to strain.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1360-1363
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• 2007

The bus electrode is composed of two layers. One is the black matrix(BM) and silver layer is formed on top of black layer. The BM paste is made by mixing $Co_3O_4$ black powder with photosensitive vehicle and rheological additives. In this work we studied the effect of $Co_3O_4$ black powder and glass frit on the rheological property of photosensitive BM paste. We also examined how the size and content of black powder and glass frit affect the transmittance and reflectance of the BM layer after sintering.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.546-546
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• 2012

Traditional screen printing is still a dominant method to print electrodes on c-Si solar cells. In order to achieve higher efficiency for c-Si solar cells, improvement of the electrode material is one of the key approaches. Shadowing loss can be reduced by using high aspect ratio finger electrode with width of finger electrode less than 80um. The rheological properties of Ag paste for applying c-Si solar cells are improved by using Ag nanowires. The printing properties including the aspect ratio of printed electrode can be improved with higher Thixotropic index (T.I.) values.