• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.1-6
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• 1995

Polycrystalline Si films have been used in many applications such as thin film transistors(TFT), image sensors and LSI applications. In this research deposition of Si films at low temperatures with remote plasma enhanced CVD from Si2H6-SiF4-H2 on SiO2 was studied and their crystallinity was investigated. It was condluded that growth of crystalline Si films was favorable with (1) low Si2H6 flow rates, (2) moderate plasma power, (3) moderate SiF4 flow rates, (4) moderate substrate temperature, and (5) suitable method of surface cleaning.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.1
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• pp.1-5
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• 2004

Carbon nanofilaments were formed on silicon substrate via microwave plasma-enhanced chemical vapor deposition method. The structure of carbon nanofilaments was identified as the carbon nanofibers. The extent of carbon nanofibers growth and the diameters of carbon nanofibers increased with increasing the total pressure. The growth direction of carbon nanofibers was horizontal to the substrate. Laterally grown carbon nanofibers showed the semiconductor electrical characteristics.

• Journal of the Korean Ceramic Society
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• v.40 no.12
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• pp.1150-1153
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• 2003

Carbon nanofilaments were formed on silicon substrate using microwave plasma-enhanced chemical vapor deposition method. The structures of carbon nanofilaments were identified as carbon nanotubes or carbon nanofibers. The formation of bamboo-like carbon nanotubes was initiated by the application of the bias voltage during the plasma reaction. The growth kinetics of bamboo-like carbon nanotubes increased with increasing the bias voltage. The growth direction of bamboo-like carbon nanotubes was vertical to the substrate.

• Proceedings of the Korean Vacuum Society Conference
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• 2004.08a
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• pp.169-169
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• 2004

• Proceedings of the Korean Vacuum Society Conference
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• 1995.06a
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• pp.144-144
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• 1995

• Proceedings of the Korean Vacuum Society Conference
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• 2007.08a
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• pp.344-344
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• 2007

• Journal of the Korean institute of surface engineering
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• v.31 no.3
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• pp.165-170
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• 1998

Deposition of diamond on silicon substrates has been performed by RF HPCVD (Helicon Plasma Chemical Vapor Deposition) from methane-hydrogen gas mixture. Growth properties and deposition condition conditions have been studies as functions of substrate temperature ($750^{\circ}C$~$850^{\circ}C$). Si p-type (100) wafers were used as a substrate. The chharecterizations of the gaind thin films by SEM, AFM and Raman seattring are diamond crystallites which include disordered graphit.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.19-19
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• 2007

Recently, we have developed p-i-n hydrogenated amorphous silicon (a-Si:H) single junction (SJ) thin film solar cells with RF (13,56MHz) plasma enhanced chemical vapor deposition (PECVD) systems, and also successfully fabricated the mini-modules (>300$cm^2$), using laser scribing technique to form an integrated series connection, The efficiency of a mini-module was 7.4% (Area=305$cm^2$, $I_{SC}$=0.25A, $V_{OC}$=14.74V, FF=62%).

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.151-152
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• 2012

라만(Raman) 분광법은 실리콘의 결정화도를 분석하는데 가장 유용하게 쓰이는 기법이다. 본 논문에서는 상압 플라즈마 화학기상증착법 (atmospheric pressure plasma-enhanced chemical vapor deposition, AP-PECVD)에 의해 형성된 실리콘 박막의 결정화도를 라만 분광법에 의해 분석하였다. 라만 분석 시, 조사하는 레이져의 파장에 따라서 실리콘 박막 내로의 침투깊이가 결정된다. 또한 레이져의 파워가 임계점을 넘게 되면, 레이져에 의한 실리콘의 결정화가 진행되는 것을 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.83-87
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• 2002

Plasma enhanced chemical vapor deposited (PECVD) silicon nitride ($SiN_X$) is widely used as a gate dielectric material for the hydrogenated amorphous silicon(a-Si:H) thin film transistors (TFT's). We investigated $SiN_X$ films were deposited PECVD at low temperature ($300^{\circ}C$). The reaction gases were used pure nitrogen and a helium diluted of silane gas(20% $SiH_4$, 80% He). Experimental investigations were carried out with the variation of $N_2/SiH_4$ flow ratios from 3 to 50 and the rf power of 200 W. This article presents the $SiN_X$ gate dielectric studies in terms of deposition rate, hydrogen content, etch rate and C-V, leakage current density characteristics for the gate dielectric layer of thin film transistor applications. Electrical properties were analyzed through high frequency (1MHz) C-V and current-voltage (I-V) measurements. The thickness and the refractive index on the films were measured by ellipsometry and chemical bonds were determined by using an FT-IR equipment.