• 한국결정성장학회지
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• 제9권5호
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• pp.454-458
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• 1999

Hydrodynamic Thermal Capilary Model developed previously has been modified to study the transport phenomena in the Czochralski process. Our analysis is focused on the heat transfer in the system, convection in the melt phase, and the meniscus and interface shape. Four major forces drive melt flow in the crucible, which include thermal buoyancy force in the melt, thermocapillary force along the curved meniscus, crucible rotation and crystal rotation. Individual flow mechanism due to each driving force has been examined to determine its interaction with the meniscus and interface shape. A nominal 4-inch-diameter silicon crystal growth process is chosen as a subject for analysis. Heater temperature profile for constant diameter crystal is also present as a function of crystal height or fraction solidified.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1103-1107
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• 2005

Single-crystal silicon thin films on glass (SOG) and on fused-quartz (SOQ) were prepared using wafer bonding and hydrogen-induced layer transfer. Thinfilm transistors (TFTs) were subsequently fabricated. The high-temperature processed SOQ TFTs show better device performance than the low-temperature processed SOG TFTs. Tensile and compressive strain was measured respectively on SOQ and SOG. Consistent with the tensile strain, enhanced electron effective mobility was measured on the SOQ TFTs.

• 대한금속재료학회지
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• 제50권2호
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• pp.146-151
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• 2012

The present article shows how the fracture strength of single crystal silicon chips, which are generally used as semiconductor devices, is influenced by loading rate variation during a 3-point bending test. It was found that the fracture strength of the silicon chips slightly increases up to 4% with increasing loading rate for loading rates lower than 20 mm/min. Meanwhile, the fracture strength of the chips hardly increases with increase of loading rate to levels higher than 40 mm/min. However, there was an abrupt transition in the fracture strength within a loading rate range of 20 mm/min to 40 mm/min. This work explains through microscopic examination of the fracture surface of all test chips that such a big transition is related to the deflection of crack propagation direction from the (011) [${\bar{1}}00$] system to the (111) [${\bar{2}}11$] system in a particular loading rate (i.e. from 20 mm/min to 40 mm/min).

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.494-496
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• 1996

The purpose of this study is to investigate the effect of process conditions on pore distribution in porous silicon layer prepared by electrochemical reaction. Porous silicon layers formed on p-type silicon wafer show the network structure of fine porse whose diameters are less than 100${\AA}$. In n-type porous silicon, selective growth was found on the pore surface by wet etching process after PR patterning. And numerical method showed high current density on the pore tip. With this result we confirmed that pore formation has two steps. First step is the initial attack on the surface and second step is the directional growth on the pore tip.

• The Korean Journal of Ceramics
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• 제3권1호
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• pp.13-17
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• 1997

It is identified that the diamond films grown o bias-treated (100) silicon showed different surface morphologies and film textures according to the initial applied dc bias voltage at the same growth condition. The highly oriented diamond film (HODF) was successfully grown on -200 V bias-treated silicon substrate in which the heteroepitaxial relation of $(100)_{dimond}//(100)_{si}\; and\; [110]_{diamond}//[110]_{si}$ was identified. On the contrary, the heteroepitaxial relation was considerably disturbed in the samples bias-voltage was a key factor in growing the highly oriented diamond film on (100) silicon substrate. Considering the experimental results, we proposed a new model about heteroepitaxial diamond growth on silicon, in which 9 diamond unit cell are matched with 4 silicon cells and the bond covalency of both atoms is satisfied via the intermediate layer at the interface as well.

• 한국표면공학회지
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• 제28권3호
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• pp.174-181
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• 1995

Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin film processes and epitaxial layer growth and silicon wet etching techniques. We investigated silicon etch rate in 1-3-10 etchant as functions of doping concentration, surface mechanical stress and crystal defects. The experimental results indicate that silicon etch rate in 1-3-10 etchant is strong functions of doping concentration and crystal defect density rather than surface mechanical stress. We suggested the new fabrication processes of multilayered silicon cantilever beams.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.62-66
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• 2002

The conventional floating zone(FZ) crystal and Czochralski(CZ) silicon crystal have resistivity variations longitudinally as well as radially The resistivity variations of the conventional FZ and CZ crystal are not conformed to requirement of dopant distribution for power devices and thyristors. These resistivity variations in conventional cystals limits the reverse breakdown voltage that could be achieved and forced designers of high power diodes and thyristors to compromise the desired current-voltage characteristics. So to produce high Power diodes and thyristors, Neutron Transmutation Doping(NTD) technique is the one method just because NTD silicon provides very homogeneous distribution of doping concentration. This procedure involves the nuclear transmutation of silicon to phosphorus by bombardment of neutron to the crystal according to the reaction $^{30}$ Si(n,${\gamma}$)longrightarrow$^{31}$ Silongrightarrow(2.6 hr)$^{31}$ P+$\beta$$^{[-10]}$ . The radioactive isotope $^{31}$ Si is formed by $^{31}$ Si capturing a neutron, which then decays into the stable $^{31}$ P isotope (i.e., the donor atom), whose distribution is not dependent on the crystal growth parameters. In this research, neutron was irradiated on FZ silicon wafers which had high resistivity(1000~2000 Ω cm), for 26 and 8.3hours for samples of HTS-1 and HTS-2, and 13, 3.2, 2.0 hours for samples of IP-1, IP-2 and IP-3, respectively, to compare resistivity changes due to time differences. The designed resistivities were approached, which were 2.l Ωcm for HTS-1, 7.21 Ω cm for HTS-2, 1.792cm for IP-1, 6.83 Ωcm for IP-2, 9.23 Ωcm for IP-3, respectively. Point defects were investigated with Deep Level Transient Spectroscopy(DLTS). Four different defects were observed at 80K, 125K, 230K, and above 300K.

• 한국결정성장학회지
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• 제10권2호
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• pp.91-95
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• 2000

8인치 쵸크랄스키 실리콘 단결성 성장에 있어서, 계면에서의 온도기울기, 산소, 농도 및, 반경방향의 산소농도 분포에 미치는 아르곤 가스 유동의 영향을 조사하였다. 아르곤의 유입량을 증가시킴에 따라 계면 근처 결정내 온도기울기가 증가하였으며. 결정내 산소농도는 감소하였다. 한편, 반경방향의 산소농도 균일성은 악화됨이 관찰되었다. 실험 결과를 종합하여 볼 때, 아르곤 유동이 산소 농도 및 균일 분포성 등의 결정 특성에 중요한 영향을 미치는 성장 공정변수임을 확인할 수 있었다.

• 대한기계학회논문집
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• 제19권5호
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• pp.1308-1318
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• 1995

The influence of varying rotation speed of both crystal and crucible was numerically investigated for the Czochralski silicon-crystal growth. Based on a simplified model assuming flatness of free surfrae, the Navier-Stokes Boussinesq equations were employed to identify the flow pattern, temperature distribution as well as the shape of the melt/crystal interface. The present results showed that the interface shape was relatively convex with respect to the melt at lower pulling rate and tended to be concave as the pulling rate increased. In particular, the experimentally observed gull-winged shape of the interface was qualitatively in agreement with the predicted shape. The rotation of crystal alone little affected the growth system. When the rotation speed of the crucible was increased, there occurred inversion of the interface shape from convex to concave pattern. At rapid rotation of the crucible, an interesting channel formation was predictied primarily due to the assumption of laminar flow.

• 한국결정성장학회지
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• 제9권2호
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• pp.173-179
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• 1999

본 연구에서는 비정질 규소 박막의 결정화를 촉진시키기 위하여 표면 활성화 처리의 영향을 관찰하였다. 표면 활성화 방법으로는 습식 연마법(Wet Blasting)과 Nd:YAG 레이저의 빔을 사용하였고, 700~$800^{\circ}C$에서 관상로 열처리를 행하여 고살 결정화에 미치는 영향을 보았다. 결정화 정도의 기준으로는 XRD 분석을 통해 얻은 (111) 피크강도를 이용하였으며, 결정의 품질을 분석하기 위해 Raman 분석을 행하였다. 결정화의 표면 형상에 대한 관찰은 주사전자 현미경(SEM)을 사용하였다. 본 실험 결과 표면 활성화 처리는 비정질 규소박막의 결정화를 촉진하고, 결정의 품질을 향상시키는 것으로 확인되었다. 습식 연마법(Wet Blasting)의 경루 2 Kgf/$\textrm{cm}^2$의 압력이 가장 효과적이었고, 레이저의 에너지는 100~200mJ/$\textrm{cm}^2$가 효과적이었다. 이것은 표면활성화처리를 통하여 비정질 실리콘 박막의 표면에 strain energy가 형성되어 결정화에 필요한 엔탈피에 영향을 미친 효과 때문으로 예상된다.