• 제목/요약/키워드: Silicon crystal

검색결과 674건 처리시간 0.019초

Numerical analysis of steady and transient processes in a directional solidification system

  • Lin, Ting-Kang;Lin, Chung-Hao;Chen, Ching-Yao
    • Coupled systems mechanics
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    • 제5권4호
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    • pp.341-353
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    • 2016
  • Manufactures of multi-crystalline silicon ingots by means of the directional solidification system (DSS) is important to the solar photovoltaic (PV) cell industry. The quality of the ingots, including the grain size and morphology, is highly related to the shape of the crystal-melt interface during the crystal growth process. We performed numerical simulations to analyze the thermo-fluid field and the shape of the crystal-melt interface both for steady conditions and transient processes. The steady simulations are first validated and then applied to improve the hot zone design in the furnace. The numerical results reveal that, an additional guiding plate weakens the strength of vortex and improves the desired profile of the crystal-melt interface. Based on the steady solutions at an early stage, detailed transient processes of crystal growth can be simulated. Accuracy of the results is supported by comparing the evolutions of crystal heights with the experimental measurements. The excellent agreements demonstrate the applicability of the present numerical methods in simulating a practical and complex system of directional solidification system.

MPC Based Feedforward Trajectory for Pulling Speed Tracking Control in the Commercial Czochralski Crystallization Process

  • Lee Kihong;Lee Dongki;Park Jinguk;Lee Moonyong
    • International Journal of Control, Automation, and Systems
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    • 제3권2호
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    • pp.252-257
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    • 2005
  • In this work, we propose a simple but efficient method to design a target temperature trajectory for pulling speed tracking control of the crystal grower in the Czochralski crystallization process. In the suggested method, the model predictive control strategy is used to incorporate the complex dynamic effect of the heater temperature on the pulling speed into the temperature trajectory design quantitatively. The feedforward trajectories designed by the proposed method were implemented on 200 mm and 300 mm silicon crystal growers in the commercial Czochralski process. The application results have demonstrated its excellent and consistent tracking performance of pulling speed along whole bulk crystal growth.

Magnetic field effects on melt convection during crystal growth

  • Kakimoto, Koichi;Ozoe, Hiroyuki
    • 한국결정성장학회:학술대회논문집
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    • 한국결정성장학회 1997년도 Proceedings of the 12th KACG Technical Meeting and the 4th Korea-Japan EMGS (Electronic Materials Growth Symposium)
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    • pp.187-196
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    • 1997
  • Oxygen transfer in silicon melts during crystal growth under vertical magnetic fields is investigated numeriaclly and experimentally. A three-dimensional numerical simulation, including melt convection and oxygen transport, is carried out to understand how oxygen transfers in the melt under magnetic fields. Oxygen concentrations in single silicon crystals grown from the melt under these magnetic fields are experimentally measured by using an infrared absoption technique. The rusults obtained are compared to results from a numerical simualtion. An anomalous increase is observed in the oxygen concentration of the grown crystals under a magnetic field of about 0/03 tesla. The cause of this anomaly is identified as Benard instability, since the temperature at the bottom of the crucible is higher than that at interface. When the temperature at the bottom is decreased, the Benard cell can be removed, and a monotonical decrease in the oxygen concentration in the single crystals can be observed.

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A Low Close-in Phase Noise 2.4 GHz RF Hybrid Oscillator using a Frequency Multiplier

  • 문현원
    • 한국산업정보학회논문지
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    • 제20권1호
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    • pp.49-55
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    • 2015
  • This paper proposes a 2.4 GHz RF oscillator with a very low close-in phase noise performance. This is composed of a low frequency crystal oscillator and three frequency multipliers such as two doubler (X2) and one tripler (X3). The proposed oscillator is implemented as a hybrid type circuit design using a discrete silicon bipolar transistor. The measurement results of the proposed oscillator structure show -115 dBc/Hz close-in phase noise at 10 kHz offset frequency, while only dissipating 5 mW from a 1-V supply. Its close-in phase noise level is very close to that of a low frequency crystal oscillator with little degradation of noise performance. The proposed structure which is consisted of a low frequency crystal oscillator and a frequency multiplier provides new method to implement a low power low close-in phase noise RF local oscillator.

Evaluation of Mechanical Backside Damage of Silicon Wafer by Minority Carrier Recombination Lifetime and Photo-Acoustic Displacement Method

  • Park, Chi-Young;Cho, Sang-Hee
    • 한국결정성장학회:학술대회논문집
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    • 한국결정성장학회 1997년도 Proceedings of the 13th KACG Technical Meeting `97 Industrial Crystallization Symposium(ICS)-Doosan Resort, Chunchon, October 30-31, 1997
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    • pp.155-159
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    • 1997
  • We investigated the effect of mechanical backside damage in Czochralski silicon wafer. The intensity of mechanical damage were evaluated by minority carrier recombination lifetime by a laser excitation/microwave reflection photoconductance decay method, photo-acoustic displacement method, X-ray section topography, and wet oxidation/preferential etch methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the photoacoustic displacement values are also increased proportionally.

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The Effect of Pyrazine on TMAH:IPA Single-crystal Silicon Anisotropic Etching Properties

  • Gwiy-Sang Chung;Tae-Song Kim
    • Transactions on Electrical and Electronic Materials
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    • 제2권2호
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    • pp.21-25
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    • 2001
  • This paper presents the effect of pyrazine on tetramethylammonium hydroxide (TMAH):isopropyl alcohol (IPA) single-crystal silicon anisotropic etching properties. With the addition of IPA to TMAH solutions, etching characteristics are exhibited an improvement in flatness on the etching front and a reduction in undercutting, but the etch rate on (100) silicon is decreased. The (100) silicon etch rate is improved by the addition of pyrazine. An etch rate on (100) silicon of 0.8 ${\mu}{\textrm}{m}$/min, which is faster by 13% than a 20 wt.% solution of pure TMAH, is obtained using 20 wt.% TMAH: 0.5 g/100 ml pyrazine solutions, but the etch rate on (100) silicon is decreased when more pyrazine is added. With the addition of pyrazine to a 25 wt.% TMAH solution, variations in flatness on the etching front are not observed and the undercutting ratio is reduced by 30~50%. These results indicate that anisotropic etching technology using TMAH:IPA:pyrazine solutions provides a powerful and versatile method for realizing of microelectromechanical systems.

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웨이퍼 그라인딩 공정으로 생성된 스크래치 마크를 갖는 실리콘 칩들에서의 벽개 파괴현상 (Cleavage Fracture Phenomenon in Silicon Chips with Wafer Grinding-Induced Scratch Marks)

  • 이동기;이태규;이성민
    • 대한금속재료학회지
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    • 제49권9호
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    • pp.726-731
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    • 2011
  • The present work shows how the flexural displacement-induced fracture strength of silicon devices, whose back surfaces have wafer grinding-induced scratch marks, depends on the crystallographic orientation. Experimental results indicate that silicon devices with scratch marks parallel to their lateral direction (i.e. reference axis in this work) are very susceptible to flexural fracture, as compared to devices with marks which deviated from the direction. The 3-point bending test shows that the fracture strength of silicon devices having marks which are oriented away from the reference axis is 2.6 times higher than that of devices with marks parallel to the axis. It was particularly interesting to see that silicon devices with identical preferred marks even reveal different fracture strengths, depending on whether the marks are involved in specific crystal planes such as {111} or {011}, called cleavage planes. This work demonstrates that silicon devices with the reference axis-aligned scratch marks not existing on such cleavage planes can have higher fracture strength approximately 20% higher than those existing on the planes.

다공질규소에 전착된 CdTe 화합물 박막의 특성과 효과 (The properties and effects of the electrodeposited CdTe compound film on the porous silicon)

  • 김영유;이춘우;류지욱;홍사용;박대규;육근철
    • 한국결정성장학회지
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    • 제9권1호
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    • pp.89-93
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    • 1999
  • 나노 구조를 갖는 다공질 규소의 표면과 투명하고 전도성을 갖는 접촉방법을 얻기 위해 다공질 규소 표면에 CdTe 화합물 박막을 전착시키는 방법을 시도하였다. CdTe 화합물 박막은 1 M의 $CdSO_4$와 1mM의 $TeO_4$가 혼합된 전해액 속에서 전착 전위 2-2.3V(vs. Ag/AgCl)로 다공질규소의 표면에 전착시켰다. X선 회절 측정결과 다공질규소 표면에 CdTe 화합물 박막이 생성되었음이 확인되었고, AES 분석결과 표면에서 약 80nm 깊이까지 Cd 및 Te 원소가 균일하게 존재하였다. 그리고 CdTe 화합물 박막이 전착된 다공질규소의 PL 특성은 발광의 세기는 약간 검소하였고 최대파장값은 고에너지 쪽으로 이동하였다. 이 결과로 보아 CdTe 전착 박막이 나노 구조를 갖는 다공질규소와 투명하고 전도성을 갖는 접촉물질로 이용될 수 있음이 밝혀졌다.

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