• Title/Summary/Keyword: Silicon Shield

Search Result 23, Processing Time 0.018 seconds

Evaluation of Surface Radiation Dose Reduction and Radiograph Artifact Images in Computed Tomography on the Radiation Convergence Shield by Using Sea-Shells (전산화단층영상장비에서 패각을 이용한 방사선 융합차폐체의 표면 방사선량 감소율과 방사선 인공물 영상 평가)

  • Seoung, Youl-Hun
    • Journal of the Korea Convergence Society
    • /
    • v.8 no.2
    • /
    • pp.113-120
    • /
    • 2017
  • The purpose of this present study was to evaluate the surface radiation dose reduction and radiograph artifact images in computed tomography (CT) for the manufactured radiation shields by using sea-shells. The radiation convergence shields were made from silicons, sea-shells, barium powders, producted circle types of diameter 50 mm, thickness 3.5 mm for 5 kinds (only silicon shield, only barium shield, mixed sea-shells with silicon shield, mixed barium with silicon shield, mixed sea-shells with barium and silicon shield). Radiation generation and acquisition were used 4-channel multi-detector CT. The results of this study showed that mixed sea-shells with silicon shields could reduce the surface dose of 5.3% without radiograph artifact images. In the future, we will expect the radiation convergence shield as environmentally friendly materials by using the recycling of sea-shells with the advantages of silicon which can make various shapes.

Practical Silicon-Surface-Protection Method using Metal Layer

  • Yi, Kyungsuk;Park, Minsu;Kim, Seungjoo
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.16 no.4
    • /
    • pp.470-480
    • /
    • 2016
  • The reversal of a silicon chip to find out its security structure is common and possible at the present time. Thanks to reversing, it is possible to use a probing attack to obtain useful information such as personal information or a cryptographic key. For this reason, security-related blocks such as DES (Data Encryption Standard), AES (Advanced Encryption Standard), and RSA (Rivest Shamir Adleman) engines should be located in the lower layer of the chip to guard against a probing attack; in this regard, the addition of a silicon-surface-protection layer onto the chip surface is a crucial protective measure. But, for manufacturers, the implementation of an additional silicon layer is burdensome, because the addition of just one layer to a chip significantly increases the overall production cost; furthermore, the chip size is increased due to the bulk of the secure logic part and routing area of the silicon protection layer. To resolve this issue, this paper proposes a practical silicon-surface-protection method using a metal layer that increases the security level of the chip while minimizing its size and cost. The proposed method uses a shift register for the alternation and variation of the metal-layer data, and the inter-connection area is removed to minimize the size and cost of the chip in a more extensive manner than related methods.

Development of Radiation Shield with Environmentally-Friendly Materials ; Ⅰ: Comparison and Evaluation of Fiber, Rubber, Silicon in the Radiation Shielding Sheet (친환경 소재의 의료 방사선 차폐 시트 개발 ; I: 섬유, 고무, 실리콘 소재 차폐 시트의 성능 비교평가)

  • Kim, Seon-Chil;Park, Myeong-Hwan
    • Journal of radiological science and technology
    • /
    • v.33 no.2
    • /
    • pp.121-126
    • /
    • 2010
  • Traditionally, lead has been primarily used to shield the radiation in the hospital, because of its soft texture, durability and cost effectiveness. However, lead can be dangerous because of its toxicity when exposed to the human body, and it is classified as a heavy metal like cadmium, mercury, and arsenic etc. In order to compensate its noxious properties on the human body, researchers are trying to develop a radiation shield which has similar shielding efficiency and can also be manufactured in any form. In this study, sulfuric acid barium was mixed with fiber, rubber, and silicon all of which are harmless to the human body, tested, and evaluated for its ability of medical radiation shield. The result of this study showed that the sheet containing silicon and barium has the strongest shielding abilities.

Development and Performance Comparison of Silicon Mixed Shielding Material (실리콘 혼합 차폐체의 개발과 성능비교)

  • Hoi-Woun Jeong;Jung-Whan Min
    • Journal of radiological science and technology
    • /
    • v.46 no.3
    • /
    • pp.187-195
    • /
    • 2023
  • A shield was made by mixing materials such as bismuth(Bi) and barium(Ba) with silicon to evaluate its shielding ability. Bismuth was made into a shield by mixing a bismuth oxide(Bi2O3) colloidal solution and a silicon base and applied to a fibrous fabric, and barium was made by mixing lead oxide(PbO) and barium sulfate(BaSO4) with a silicon curing agent and solidifying it to make a shield. The test was conducted according to the lead equivalent test method for X-ray protective products of the Korean Industrial Standard. The experiment was conducted by increasing the shielding body one by one from the test condition of 60 kVp, 200 mA, 0.1sec and 100 kVp, 200 mA, 0.1 sec. At 60 kVp, 2 lead oxide-barium sulfate shields, 2 bismuth oxide 1.5 mm shields, and 5 bismuth oxide 0.3 mm shields showed shielding ability equal to or higher than that of lead 0.5 mm. At 100 kVp, 2 lead oxide-barium sulfate shields and 2 bismuth oxide 1.5 mm shields showed shielding ability equal to or higher than that of lead 0.5 mm. It was confirmed that when using 2 pieces of lead oxide-barium sulfate and 1.5 mm of bismuth oxide, respectively, it has shielding ability equivalent to that of lead. Bismuth oxide and lead oxide-barium sulfate are lightweight and have excellent shielding ability, thus they have excellent properties to be used as an apron for radiation protection or other shielding materials.

Optimization of 'Patterned Ground Shield' of Spiral Inductor using Taguchi's Method (다구찌 실험 계획법을 이용한 나선형 인덕터의 패턴드 그라운드 쉴드 최적 설계 연구)

  • Ko, Jae-Hyeong;Oh, Sang-Bae;Kim, Dong-Hun;Kim, Hyeong-Seok
    • 한국정보통신설비학회:학술대회논문집
    • /
    • 2007.08a
    • /
    • pp.436-439
    • /
    • 2007
  • This paper describes the optimization of PGS(Patterned Ground Shield) of 5.5 turns rectangular spiral inductor using Taguchi's method. PGS is decrease method of parasite component by silicon substrate among dielectric loss reduction method. By using the taguchi's method, each parameter is fixed upon that PGS high poison(A), slot spacing(B), strip width(C) and overlap turn number(D) of PGS design parameter. Then we verified that percentage contribution and design sensitivity analysis of each parameter and level by signal to noise ratio of larger-the-better type. We consider percentage contribution and design sensitivity of each parameter and level, and then verify that model of optimization for PGS is lower inductance decreasing ratio and higher Q-factor increasing ratio by EM simulation.

  • PDF

Microfabrication of Microwave Transceivers for On-Chip Near-Field Electromagnetic Shielding Characterization of Electroplated Copper Layers (극소형 전자기파 송수신기의 제작 및 전기도금된 구리박막의 칩단위 근접 전자기장 차폐효과 분석)

  • Gang, Tae-Gu;Jo, Yeong-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.25 no.6
    • /
    • pp.959-964
    • /
    • 2001
  • An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.

Electrochemical Etching of Silicon in Porous Silicon Layer Transfer Process for Thin Film Solar Cell Fabrication (초박형 태양전지의 Porous Si Layer Transfer 기술 적용을 위한 전기화학적 실리콘 에칭)

  • Lee, Ju-Young;Han, Wone-Keun;Lee, Jae-Ho
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.16 no.4
    • /
    • pp.55-60
    • /
    • 2009
  • Porous silicon film is fabricated by electrochemical etching in a chemical mixture of HF and ethanol. Effects of Si type, Si resistivity, ultrasonic frequency, current density and etching time on surface morphology of PS film were studied. Electrochemical etching in ultrasonic bath promotes the uniformity of porous layer of Si. Frequency of ultrasonic was increased from 40 kHz to 130 kHz to obtain uniform pores on the Si surface. When current density was higher, the sizes of pores were larger. The new etching cell using back contact metal and current shield help to overcome nonhomogeneity and current crowding effect, and then leads to fabricate uniform pores on the Si surface. The distribution of pore size shows no notable tendency with etching time.

  • PDF

Development of Gas-mask Spectacles (방독면 안경 개발)

  • Lee, Jeung-Young;Parkm Jeong-Sik;Jang, Woo-Yeong
    • Journal of Korean Ophthalmic Optics Society
    • /
    • v.13 no.4
    • /
    • pp.9-12
    • /
    • 2008
  • Purpose: Current gas-mask is very uncomfortable structure for spectacles wearer. Improving this problem can aid military men and firemen to protect themselves and rescue other person. Methods: we changed the structure from dual type of outward lens and inward lens into a single type structure. we attached acrylic frame to gas-mask instead of outward lens and protected the gas inflow by shutting the gab of lens and frame using silicon shield, and made the frame "S" style for removing astigmatism and maintaining of vertex distance. Results: It was possible to correct visual acuity and gas shield, and could changed the lens like a common spectacles. The new type of gas-mask spectacles could remove 0.53D~1.78D astigmatism occurred from the slant of eyesight and lens surface, 0.07D~0.66D overcorrection occurred from short vertex distance, and 0.1D~0.3D astigmatism occurred from pantoscopic angle. Conclusion: Because new type of gas-mask spectacles had clear visual field, it was expected to improve fighting power and rescue ability.

  • PDF

Transmission Line Characteristics of Silicon Based Interconnections with Patterned Ground Shields and its Implication for RF/Microwave ICs (실리콘 공정에서 패턴으로 삭각된 접지(PGS)를 이용한 인터컨넥션의 전송선 특성분석 및 RF/초고주파 집적회로에의 응용)

  • Gwak, Huk-Yong;Lee, Sang-Gug;Cho, Yun-Seok
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.37 no.6
    • /
    • pp.50-56
    • /
    • 2000
  • The integrated circuit interconnection lines are experimented with patterned ground shields (PGS) at microwave frequencies. Measurement results demonstrate that the PGS can significantly reduce the power loss through the interconnect lines over wide frequency ranges as the PGS shields the lossy silicon substrate. The transmission line characteristics of the PGS interconnect lines are analyzed and identified that the PGS reduces the wave length of the interconnect line.

  • PDF

Public Diplomacy Arguments and Taiwan

  • Thomas A. Hollihan;Patricia Riley
    • Journal of Public Diplomacy
    • /
    • v.3 no.1
    • /
    • pp.14-36
    • /
    • 2023
  • Taiwan has been threatened by the People's Republic of China since the communists came to power in 1949. Although it has counted on military assistance from the United States to deter its more powerful neighbor, the United States has not signed a formal treaty pledging to defend the island. In fact, the relationship between the United States and Taiwan is by intention both ambiguous and complex. This paper explores the public diplomacy arguments and symbolic gestures that define this relationship and considers Taiwan's use of soft power given the size differential in the two entities' military forces and economies. The paper discusses the specific cases of the COVID pandemic, competition for cutting edge silicon chips, the war in Ukraine, and heightened tensions between the United States and China.