• Title/Summary/Keyword: Silicon Micromachining

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Optimization of Laser Process Parameters for Realizing Optimal Via Holes for MEMS Devices (MEMS 소자의 비아 홀에 대한 레이저 공정변수의 최적화)

  • Park, Si-Beom;Lee, Chul-Jae;Kwon, Hui-June;Jun, Chan-Bong;Kang, Jung-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.11
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    • pp.1765-1771
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    • 2010
  • In the case of micro.electro-mechanical system (MEMS) devices, the quality of punched via hole is one of the most important factors governing the performance of the device. The common features that affect the laser micromachining of via holes drilled by using Nd:$YVO_4$ laser are described, and efficient optimization methods to measure them are presented. The analysis methods involving an orthogonal array, analysis of variance (ANOVA), and response surface optimization are employed to determine the main effects and to determine the optimal laser process parameters. The significant laser process parameters were identified and their effects on the quality of via holes were studied. Finally, an experiment in which the optimal levels of the laser process parameters were used was carried out to demonstrate the effectiveness of the optimization method.

Development of silicon based flexible tactile sensor array mounted on flexible PCB (연성회로기판에 실장된 실리콘 기반의 유연 촉각센서 어레이 제작 및 평가)

  • Kim, K.N.;Kim, Y.K.;Lee, K.R.;Cho, W.S.;Lee, D.S.;Cho, N.K.;Kim, W.H.;Park, J.H.;Kim, S.W.;Ju, B.K.
    • Journal of Sensor Science and Technology
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    • v.15 no.4
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    • pp.277-283
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    • 2006
  • We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.

CPW Phase Shifter and Shunt Stub with Air-Bridge Fabricated on Oxidized Porous Silicon(OPS) Substrate (산화된 다공질 실리콘 기판 위에 제작된 에어브리지를 가진 CPW Phase Shifter와 Shunt Stub)

  • Sim, Jun-Hwan;Park, Dong-Kook;Kang, In-Ho;Kwon, Jae-Woo;Park, Jeong-Yong;Lee, Jong-Hyun;Jeon, Joong-Sung;Ye, Byeong-Duck
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.9
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    • pp.11-18
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    • 2002
  • This paper presents a CPW phase shifter and shunt stub with air-bridge on a 10-${\mu}m$-thick oxidized porous silicon(OPS) substrate using surface micromachining. The line dimensions of the CPW phase shifter was designed with S-W-Sg = 100-30-400 ${\mu}m$. And the width and length of the air-bridge with "ㄷ“ shape were 100 ${\mu}m$ and 400-460-400 ${\mu}m$, respectively. In order to achieve low attenuation, stepped air-bridge CPW phase shift was proposed. The insertion loss of the stepped air-bridge CPW phase shift is more improved than that of no stepped air-bridge CPW phase shift. The measured phase characteristic of the fabricated CPW phase shifter is close to 180$^{\circ}$ over a very broad frequency range of 28 GHz. The measured working frequency of short-end series stub is 28.7 GHz and the return loss is - 20 dB. And the measured working frequency of short-end shunt stub is 28.9 GHz and the return loss is - 23 dB at midband. As a result, the pattering of stub in the center conductor of CPW lines can offer size reduction and lead to high density chip layouts.

LED Beam Shaping and Fabrication of Optical Components for LED-Based Fingerprint Imager (LED 빔조형에 의한 초소형 이미징 장치의 제조 기술)

  • Joo, Jae-Young;Song, Sang-Bin;Park, Sun-Sub;Lee, Sun-Kyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.10
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    • pp.1189-1193
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    • 2012
  • The Miniaturized Fingerprint Imager (MFI) is a slim optical mouse that can be used as an input device for application to wireless portable personnel communication devices such as smartphones. In this study, we have fabricated key optical components of an MFI, including the illumination optical components and imaging lens. An LED beam-shaping lens consisting of an aspheric lens and a Fresnel facet was successfully machined using a diamond turning machine (DTM). A customized V-shaped groove for beam path banding was fabricated by the bulk micromachining of silicon that was coated with aluminum using the shadow effect in thermal evaporation. The imaging lens and arrayed multilevel Fresnel lenses were fabricated by electron beam lithography and FAB etching, respectively. The proposed optical components are extremely compact and have high optical efficiency; therefore, they are applicable to ultraslim optical systems.