• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.70-71
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• 2005

The material that is both conductive in electricity and transparent to the visible ray is called transparent conducting thin film. It is investigated the performance of ITO-CMP process using commercial silica slurry with the various conditioning temperatures by control of de-ionized water (DIW). Removal rate of ITO thin film was improved after CMP process after pad conditioning at the high temperature by improved exclusion of slurry residues in polishing pad..

• Journal of the Korean Ceramic Society
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• v.36 no.3
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• pp.307-318
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• 1999

동결건조법에 의한 저유전성 실리카 박막의 제조공정 개발 및 층간 절연물질로의 응용성이 연구되었다. 코팅용 폴리머 실리카 졸은 TEOS와 이소프로판올(iso-propanol:IPA)또는 터트부탄올(tert-butanol:TBA)을 용매로한 2단계 공정에 의하여 제조되었으며, 이들 졸을 p-Si(111)웨이퍼 상에 스핀코팅한 습윤겔 박막을 동결건조 하여 다공성 실리카 박막을 제조하였다. 균일한 박막 코팅층을 얻을 수 있는 실리카 졸의 최적 점도범위는 IPA와 TBA를 용매로 한 실리카 졸의 경우 각각 10~14 cP와 20~30cP 정도였으며 스핀속도는 2000 rpm 이상이었다. 결함이 없는 다공성 실리카 박막은 TBA(빙점 $25^{\circ}C$)를 동결용매로 하여-196$^{\circ}C$까지 급랭시킨 후 $0^{\circ}C$와 0.1 torr 까지 가열 감압한 상태에서 고상의 TBAFMF 모두 제거한 다음 20$0^{\circ}C$까지 열처리하여 제조되었다. 다공성 실리카 박막의 두께는 졸의 타입과 스핀코팅 속도에 의해 2500~15000$\AA$범위 내에서 제어가 가능하였으며 이들 막의 밀도와 유전상 수 값은 각각 0.9$\pm$0.3g/㎤(기공율 60$\pm$10%)과 2.4 정도였다.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1450-1451
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• 2006

In this paper, we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. $Bi_{3.25}La_{0.75}Ti_{3}O_{12}$ (BLT) ferroelectric fan was fabricated by the sol-gel method. Removal rate and non-uniformity (WIWNU%) were examined by change of silica slurries pH(10.3, 11.3, 12.3). Surface roughness of BLT thin films before and after CMP process was inquired into by atomic force microscopy (AFM). Effects of silica slurries pH(10.3, 11.3, 12.3) were investigated on the CMP performance of BLT film by the surface analysis of X-ray photoelectron spectroscopy(XPS).

• Korean Journal of Optics and Photonics
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• v.11 no.4
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• pp.255-260
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• 2000

We report that the crack-free organic-inorganic hybrid silica thin films were fabricated by sol-gel process using organometallic compounds as a precursor and that we have established very reproducible fabrication condition with systematic investigation of thickness and refractive index variations for various control parameters, such as, coating type, coating speed, chemical composition, prebake and postbake temperature. Additionally, we measured and compared the change of optical property with the UV exposure dose for three different kinds of photoinitiators. Furthermore, the fabrication of Ix4 MMI optical power splitter using the sol-gel thin film provides the possibility of various applications to the optical waveguide devices. vices.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.301-302
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• 2010

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.995-998
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• 2003

This paper reports the correlation between dielectric constant and degree of amorphism of the hybrid type Si-O-C thin films. Si-O-C thin films were deposited by high density plasma chemical vapor deposition using bistrimethyl- silylmethane(BTMSM, $H_{9}$C$_3$-Si-C $H_2$-Si-C$_3$ $H_{9}$) and oxygen precursors with various flow rate ratio. As-deposited film and annealed films at 40$0^{\circ}C$ were analyzed by XRD. The Si-O-C thin films were amorphous from XRD patterns. For quantitative analysis, the diffraction pattern of the samples was transformed to radial distribution function by Fourier analysis, and then compared with each other. The degree of amorphism of annealed films was higher than that of as-deposited ones. The dielectric constant varied in accordance with flow rate ratio of precursors. The lowest dielectric constant was obtained from the as-deposited film which has the highest degree of amorphism after annealing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.9
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• pp.739-745
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• 1998

The objective of this paper is to provide experimental data of Er(rare- earth)doped $SiO_2$thin film made by sputtering methods. The deposition rate of silica glass by sputtering method was 55$\AA$/min. In EDD measurements, the average Er concentration in the deposited film was 0.77(wt%). After annealing at $900^{\circ}C$, the Cl concentration decreased from 3.79(wt%) to 1.52(wt%). The refractive indices of the core $n_1$, cladding $n_2$ were 1.458, 1.558 respectively at 632.8 nm. The refractive index difference between core and cladding, $\Delta$n was 0.1. The refractive index profile of core and cladding interface shows step profile. In the study, $SiO_2$ glass films of Si wafer were successfully doped with active erbium. Therefore, this experimental data will be applicable for fabrications of Er doped planar integrated optical device.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.590-593
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• 2003

Ozone is a strong and useful oxidizing gas for the fabrication of oxide thin films. In order to obtain high quality oxide thin films, higher ozone concentration is necessary. In this paper an ozone condensation system was evaluated from the viewpoint of an ozone supplier for oxide thin film growth. Crone was condensed by an adsorption method and the ozone concentration reached 8.5 mol% in 2.5 h after the beginning of the ozone condensation process, indicating high effectiveness of the condensation process. Ozone was continuously desorbed from the silica gel by the negative pressure. We found the decomposition in the ozone concentration negligible if the condensed ozone is transferred from the ozone condensation system to the film growth chamber within a few minutes.

• Korean Journal of Metals and Materials
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• v.47 no.5
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• pp.316-321
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• 2009

Co nanoparticles on silica substrates were fabricated by inducing a thin-film dewetting through two different processes-furnace annealing and pulsed-laser annealing. The effects of annealing temperature, film thickness and laser energy density on dewetting morphology and mechanism were investigated. Co thinfilms with thicknesses between 3 to 15 nm were deposited using ion-beam sputtering, and then, in order to induce dewetting, thermally annealed in furnace at temperatures between 600 and $900^{\circ}C$. Some as-deposited films were irradiated using a Nd-YAG pulsed-laser of 266 nm wavelength to induce dewetting in liquid-state. Films annealed in furnace agglomerated to form nanoparticles above $700^{\circ}C$, and those average particle size and spacing were increased with an increase of film thickness. On the laser annealing process, above the energy density of $100mJ/cm^2$, metal films were completely dewetted and the agglomerated particles exhibited greater size uniformity than those on the furnace annealing process. A detailed dewetting mechanism underlaying both processes were discussed.

• Applied Chemistry for Engineering
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• v.30 no.1
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• pp.88-94
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• 2019

Triplet-triplet annihilation upconversion (TTA-UC) is a photochemical process wherein two or more low-energy photons are converted to a high-energy photon through a special energy transfer mechanism. Herein, we report a strategy to enhance the efficiency of TTA-UC through the light-scattering effect induced by silica microparticles (SM) embedded in polymeric thin films. By incorporating monodisperse uniform silica microparticles with a uniform size of 950 nm synthesized by $St{\ddot{o}}ber$-based seeded growth method into UC polymeric thin films, the UC intensity in the 430-570 nm range was enhanced by as much as 64% when irradiated by 635 nm laser. Analyzing the lifetime of PdTPBP phosphorescence revealed that the presence of SM in the UC layer does not affect triplet-triplet energy transfer (TTET) between sensitizers and acceptors, supporting the enhancement of TTA-UC originated from the light-scattering effect. On the other hand, the incorporation of SM in UC layer is shown to enhance the triplet-triplet annihilation (TTA) efficiency, which results in a 1.5-fold increase of the ${\Phi}_{UC}$, by scattering light source and thus increasing the number of excited photons to be utilized in TTA-UC process.