• Journal of the Institute of Convergence Signal Processing
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• v.19 no.1
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• pp.28-34
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• 2018

This paper is composed of a passenger management system using a temperature sensing module, a PIR sensor module for detecting movement inside a room, and a smart breath sensing module for determining a sleeping state. An embedded sensor module and a communication system integrated the sensing part and the algorithm driving part. As the aging society is accelerating and becoming more upgraded, the social cost of Silver Care increases, and in order to protect privacy, it is necessary to reduce costs by developing efficient smart silver care devices. The proposed non - image human body detection IOT sensor system is implemented by hardware and software and has superior performance compared with conventional image monitoring method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.9
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• pp.124-129
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• 2009

Recently, PWM inverter is widely utilized for many industrial applications such as high performance drive and space vector pulse width modulation(SVPWM) inverter which has high voltage ratio and low harmonics compared to conventional PWM inverter. This paper presents the implementation on a field programmable gate array(FPGA) of a SVPWM module for a voltage source inverter. The SVPWM module consists of PWM generator, current and position sensor interface and dead time compensator. The implemented SVPWM module can be integrated with a digital signal processor(DSP) to provide a flexible and effective solution for high performance voltage source inverter and for the use of multi-motor control. The performance of SVPWM module is verified by simulation and several experimental results.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.37-41
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• 2007

Fast Fourier Transformation(FFT) is one of the most useful way to analyze response signal for the purpose of grasping the dynamic characteristics of system. Excitation is a factor or process making noise or vibration. It's typical and simple experimental method widely used for catching hold of dynamic peculiar characters and modal behaviors of system by frequency analysis. There are harmonic excitation, impact excitation, random excitation, sweep excitation, chirp excitation and so on as the ideal method in an experiment using exciter. In this thesis, excitation testing module for NI-PXI equipment is developed. The analyzing module is developed with LabVIEW tool. A user can generate each waveform for shaking a structure and see quickly and easily modal shape of system with this module. This developed module will be expected to build up more convenient and serviceable measurement system.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1925_1926
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• 2009

This paper describes a novel power management circuitry for reducing the sleeping mode power dissipation. Based on the proposed power management circuitry, the sensor module can be activated by RF wake-up signal, perform designated process and deactivate itself. There is absolutely no power dissipation at the sleeping mode which takes almost time of the operation. The temperature sensor module using solar cell as energy source has been fabricated and tested. Experimental results show that the sensor module with 3300 ${\mu}$F for storage capacitor can transmits RF temperature data to a receiver at a distance of 20 m every 15 second in a normal indoor light condition and keep the capacitor voltage over 9 V. And the sensor module can operate 100 times with a single charging, that means it is possible for the sensor module to transmit every 5 minute for 8 hours without light or any other power input during the night time.

• The Journal of the Acoustical Society of Korea
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• v.14 no.2
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• pp.30-39
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• 1995

In this paper, study on implementation of FFT analyzer applied to CAT, A/D conversion module, DSP module and VXIbus interface module are implemented in hardware and calculation program and control software are implemented in DSP module and VXIbus interface module, respectively. The control of the modules using PC is realized in software. The real time bandwidth of the FFT analyzing device is 100KHz. At sampling rate of 200KHz and with 2048 point FFT, the result of applying sine, triangular and rectangular wave of 20KHz to FFT analyzing device is compared with the FFT analyzed results of Hewlett-Packard 3562A dynamic output range of -40dBV- +30dBV, correct results are obtained and results of applying 10KHz, 20KHz and 50KHz input are compared and the correct values are obtained.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.5C
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• pp.522-529
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• 2002

MMIC circuits in whole receiver system was fabricated based on GaAs pHEMT technology. And a V-band downconverter module was fabricated by integrating these circuits. The downconverter module consists of a LO drive power amplifier which generates 24dBm output power, a low noise amplifier(LNA) which shows 20 dB small signal gain, an active parallel feedback oscillator which generates 1.6 dBm output power, and a cascode mixer which shows over 6dB conversion gain. The good conversion gain performance of our mixer made no need to attach any IF amplifier which grows conversion gain. Measured results of the complete downconverter show a conversion gain of over 20 dB between 57.5 GHz and 61.7GHz without IF amplifier.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.1 no.3
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• pp.41-47
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• 2008

This paper describes a wearable electro-stethoscope module for home-healthcare system. The module is consisted of a microphone, an instrumentation amplifier, a filter, a power amplifier etc. and is light and small. The phonogram signal from the module shows good performance. The test for the material and size of the sound collector of the chest piece is performed and the results is reflected on the prototype product. If the module is connected to wired or wireless communication network, so people can check their health without going hospital.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.507-511
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• 2010

Digital Radio Frequency Memory (below, DRFM) performs RF signal data store, delay and re-transmission. DRFM is wildly used as core module of Jammer, EW simulator, Target Echo Generator etc. This paper suggests a hardware design of DRFM which is composed RF section(RF Input/Output Module, Local Oscillator Module) and Digital section(ADC module, memory, DAC module), and confirm the validity of the propose by the test result.