• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.1
• /
• pp.11-21
• /
• 1999

For microelectronic packaging application, the crystallizable glass powder in CaO-$A1_2O_3-SiO_2-B_2O_3$system was mixed with various amounts of alumina inclusions (\approx 4 $\mu \textrm{m}$), and its sintering behavior, crystallization behavior, and dielectric constant were examined in terms of vol% of alumina and the reaction between the alumina and the glass. Sintering of the CASB glass powder alone at $900^{\circ}C$ resulted in full densification (99.5%). Sintering of alumina-filled composite at $900^{\circ}C$ also resulted in a substantial denslfication higher than 97% of theoretical density, In this case, the maximum volume percent of alumina should be less than 40%. XRD analysis revealed that there was a partial dissolution of alumina into the glass. This alumina dissolution, however, did not show the particle growth and shape accommodation. Therefore, the sintering of both the pure glans and the alumina-filled composite was mainly achieved by the viscous flow and the redistribution of the glass. Alumina dissolution accelerated the crystallization initiation time at $1000^{\circ}C$ and hindered the densification of the glass. Dielectric constants of both the alumina-filled glass and the glass-ceramic composites were increased with increasing alumina content and followed rule of mixture. In case of the glass-ceramic matrix composites showed relatively lower dielectric constant than the glass matrix composite. Furthermore, as alumina content increased, crystallization behavior of the glass was changed due to the reaction between the glass and the alumina. As alumina reacted with the glass matrix, the major crystallized phase was shifted from wollastonite to gehlenite. In this system, alumina dissolution strongly depended on the particle size: When the particle size of alumina was increased to 15 $\mu\textrm{m}$, no sign of dissolution was observed and the major crystallized phase was wollastonite.

• Korean Journal of Materials Research
• /
• v.20 no.11
• /
• pp.606-610
• /
• 2010

Films consisting of a silicon quantum dot superlattice were fabricated by alternating deposition of silicon rich silicon nitride and $Si_3N_4$ layers using an rf magnetron co-sputtering system. In order to use the silicon quantum dot super lattice structure for third generation multi junction solar cell applications, it is important to control the dot size. Moreover, silicon quantum dots have to be in a regularly spaced array in the dielectric matrix material for in order to allow for effective carrier transport. In this study, therefore, we fabricated silicon quantum dot superlattice films under various conditions and investigated crystallization behavior of the silicon quantum dot super lattice structure. Fourier transform infrared spectroscopy (FTIR) spectra showed an increased intensity of the $840\;cm^{-1}$ peak with increasing annealing temperature due to the increase in the number of Si-N bonds. A more conspicuous characteristic of this process is the increased intensity of the $1100\;cm^{-1}$ peak. This peak was attributed to annealing induced reordering in the films that led to increased Si-$N_4$ bonding. X-ray photoelectron spectroscopy (XPS) analysis showed that peak position was shifted to higher bonding energy as silicon 2p bonding energy changed. This transition is related to the formation of silicon quantum dots. Transmission electron microscopy (TEM) and electron spin resonance (ESR) analysis also confirmed the formation of silicon quantum dots. This study revealed that post annealing at $1100^{\circ}C$ for at least one hour is necessary to precipitate the silicon quantum dots in the $SiN_x$ matrix.

• Korean Journal of Materials Research
• /
• v.15 no.6
• /
• pp.408-412
• /
• 2005

[ $Ba_{1.5}Sr_{0.5}SiO_4:Eu$ ] phosphor particles with high photoluminescence intensity under long wavelength ultraviolet were prepared by spray pyrolysis. We investigated the effect of $NH_4F$ flux added into starting solution on the morphology and photoluminescence intensity of $Ba_{1.5}Sr_{0.5}SiO_4:Eu$ phosphor prepared by spray pyrolysis. $Ba_{1.5}Sr_{0.5}SiO_4:Eu$ phosphor particles prepared from starting solution containing $NH_4F$ flux had the maximum photoluminescence intensity at the post-treatment temperature of $1200^{\circ}C$ and the maximum photoluminescence intensity of $Ba_{1.5}Sr_{0.5}SiO_4:Eu$ phosphor particles prepared from the starting solution containing $NH_4F$ flux was $137\%$ of that of the phosphor particles prepared from the starting solution without flux material. $Ba_{1.5}Sr_{0.5}SiO_4:Eu$ phosphor particles prepared from starting solution containing $NH_4F$ flux had larger size and more aggregated morphology than those prepared from starting solution without flux material. The photoluminescence intensity of $Ba_{1.5}Sr_{0.5}SiO_4:Eu$ phosphor particles prepared from starting solution containing $NH_4F$ flux above $3wt.\%$ had high photoluminescence intensities. The addition amount of $NH_4F$ flux showing the maximum photoluminescence intensity was $12wt.\%$. The optimum amount of $NH_4F$ flux was $5wt.\%$ when we considered the morphological and photoluminescence characteristics of $Ba_{1.5}Sr_{0.5}SiO_4:Eu$ ohosphor particles prepared by spray pyrolysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.252-252
• /
• 2009

In this work, the nanocrystalline ZnO/polycrystalline (poly) aluminum nitride (AlN)/Si structure was fabricated for humidity sensor applications based on surface acoustic wave (SAW). In this structure, the ZnO film was used as sensing material layer. These ZnO and AlN(0002) were deposited by so-gel process and a pulse reactive magnetron sputtering, respectively. These experimental results showed that the obtained SAW velocity on AlN film was about 5128 m/s at $h/\lambda$=0.0125 (h and $\lambda$ is thickness and wavelength, respectively). For ZnO sensing layers coated on AlN, films have hexagonal wurtzite structure and nanometer particle size. The crystalline size of ZnO films annealed at 400, 500, and 600 $^{\circ}C$ is 10.2, 29.1, and 38 nm, respectively. Surface of the film exhibits spongy which can adsorb steam in the air. The best quality of the ZnO film was obtained with annealing temperature at 500 $^{\circ}Cis$. The change in frequency response (127.9~127.85 MHz) of the SAW humidity sensor based on ZnO/AlN structure was measured along the change in humidity (41~69%). The structural properties of thin films wereinvestigated by XRD and SEM.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.1626-1631
• /
• 2007

The purpose of the study is to simulate the displacement of the LCD glass during process of a large size imprint. During this process, a small temperature variation makes thermal stress, which causes the horizontal variation of mold and glass. During alignment process to fix the LCD glass on a alignment stage, the vertical displacement is made by the absorption pressure and the shear stress. This study simulates the horizontal displacement of mold and glass due to temperature variation, the vertical displacement depending on the shape of absorption surface fixing the LCD glass in the alignment process, and the horizontal and vertical displacement which occurs in the LCD glass at the alignment process. Algor which is a FEM code for a framework simulation was applied. Temperature variation above ${\pm}$ $0.1^{\circ}C$ on mold and glass causes the horizontal displacement of 150nm due to thermal expansion. The vertical displacement due to the circular is ten times of the case of rectangular absorption nozzle. The displacement of the LCD glass in the alignment process is about 49nm.

• Journal of the Korean Society for Precision Engineering
• /
• v.24 no.6
• /
• pp.113-120
• /
• 2007

Chemical vapor deposition (CVD) is one of the various synthesis methods that have been employed for carbon nanotube (CNT) growth. In particular, Ren et al reported that large areas of vertically aligned multi-wall carbon nanotubes could be grown using a direct current (dc) PECVD system. The synthesis of CNT requires a metal catalyst layer, etchant gas, and a carbon source. In this work, the substrates consists of Si wafers with Ni-deposited film. Ammonia $NH_3$) and acetylene ($C_2H_2$) were used as the etchant gases and carbon source, respectively. Pretreated conditions had an influence on vertical growth and density of CNTs. And patterned growth of CNTs could be achieved by lithographical defining the Ni catalyst prior to growth. The length of single CNT was increased as niclel dot size increased, but the growth rate was reduced when nickel dot size was more than 200 nm due to the synthesis of several CNTs on single Ni dot. The morphology of the carbon nanotubes by TEM showed that vertical CNTs were multi-wall and tip-type growth mode structure in which a Ni cap was at the end of the CNT.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.23 no.6
• /
• pp.291-295
• /
• 2013

Surface chemical modification via air and hydrogen heat treatment was found to relieve the aggregation of nanodiamond (ND) seed particles and lead to a significantly enhanced nucleation density for ultrananocrystalline diamond (UNCD) film growth. After heat treatment in air and hydrogen, modification of surface functionalities and increase in the zeta potential were observed. Mean size of the ND aggregates was also dramatically reduced from ${\sim}2{\mu}m$ to ~55 nm. Si surface seeded with ND particles heat-treated at $600^{\circ}C$ in hydrogen produced a much higher nucleation density of ${\sim}2.7{\times}10^{11}cm^{-2}$ compared to untreated ND seeds.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.26-26
• /
• 2009

Vertically aligned arrays of mm-long multi-walled carbon nanotubes (MWCNTs) on Si substrates have been synthesized by water-assisted thermal chemical vapor deposition (CVD). The growth of CNTs was investigated by changing the experimental parameters such as growth temperature, growth time, gas composition, annealing time, catalyst thickness, and Al underlayer thickness. The 0.5-nm-thick Fe served as catalyst, underneath which Al was coated as a catalyst support as well as a diffusion barrier on the Si substrate. We grew CNTs by adding a little amount of water vapor to enhance the activity and the lifetime of the catalyst. Al was very good at producing the nm-size catalyst particles by preventing "Ostwald ripening". The Al underlayer was varied over the range of 15~40 nm in thickness. The optimum conditions for the synthesis parameters were as follows: pressure of 95 torr, growth temperature of $815^{\circ}C$, growth for 30 min, 60 sccm Ar + 60 sccm $H_2$ + 20 sccm $C_2H_2$. The water vapor also had a great effect on the growth of CNTs. CNTs grew 5.03 mm long for 30 min with the water vapor added while CNTs were 1.73 mm long without water vapor at the same condition. As-grown CNTs were characterized by using scanning electron microscopy (SEM), high resolution transmission electron microscopy (HRTEM), and Raman spectroscopy. High-resolution transmission electron microscopy showed that the as-grown CNTs were of ~3 graphitic walls and ~6.6 nm in diameter.

• Applied Chemistry for Engineering
• /
• v.27 no.4
• /
• pp.371-379
• /
• 2016

In this article, the foamed body of glass was manufactured from the waste borosilicate glass produced by wet pulverization process without additional pretreatment which can be used as a recycling method for waste LCD panel glass. Each 100 g of pulverized waste borosilicate glass with the size of less than 270 mesh were mixed with 0.3 weight fraction of carbon and 1.5 weight fraction of $Na_2CO_3$, $Na_2SO_4$ and $CaCO_3$ and let them foamed for 20 minutes at $950^{\circ}C$ to manufacture the foamed body having the density of less than $0.3g/cm^3$. Additionally, adding $SiO_2$ or $H_3BO_3$ to the mixture enabled the foamed body to have efficient formation of open pores which showed the possibility for producing the foamed body with new functionalities such as sound absorption.

• KSTLE International Journal
• /
• v.6 no.1
• /
• pp.13-16
• /
• 2005

Friction characteristics at nano-scale of self-assembled monolayers (SAMs) having different chain lengths and end groups were experimentally studied.51 order to understand the effect of the chain length and end group on the nano-scalefriction: (1) two different SAMs of shorter chain lengths with different end groups such as methyl and phenyl groups, and (2)four different kinds of SAMs having long chain lengths (C10) with end groups of fluorine and hydrogen were coated on siliconwafer (100) by dipping method and Chemical Vapour Deposition (CVD) technique. Their nano-scale friction was measuredusing an Atomic Force Microscopy (AFM) in the range of 0-40 nN normal loads. Measurements were conducted at the scanning speed of 2 $mu$m/s for the scan size of 1$mu$m x 1 $mu$m using a contact mode type $Si_3N_4$ tip (NPS 20) that had a nominal spring constant0.58 N/m. All experiments were conducted at anlbient temperature (24 $pm$1$circ$C) and relative humidity (45 $pm$ 5%). Results showedthat the friction force increased with applied normal load for all samples, and that the silicon wafer exhibited highest frictionwhen compared to SAMs. While friction was affected by the inherent adhesion in silicon wafer, it was influenced by the chainlength and end group in the SAMs. It was observed that the nano-friction decreased with the chain length in SAMs. In the caseof monolayers with shorter length, the one with the phenyl group exhibited higher friction owing to the presence of benBenerings that are stiffer in nature. In the case of SAMs with longer chain length, those with fluorine showed friction values relativelyhigher than those of hydrogen. The increase in friction due to the presence of fluorine group has been discussed with respect tothe siBe of the fluorine atom.