• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.406-407
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• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using the C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}cm^2$ was obtained due to the improved interfacial adhesion.

• 한국정보전자통신기술학회논문지
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• 제12권5호
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• pp.499-506
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• 2019

본 논문은 SiC Hybrid module를 적용한 7kW 인버터의 동작 안정성에 관한 것으로 손실 방정식과 시뮬레이션 결과를 비교하여 시뮬레이션 결과의 유효성을 검증하였으며, 시뮬레이션을 통해 Si module과 SiC Hybrid module의 스위치 손실과 다이오드 손실을 비교하였다. 손실 방정식 계산을 통하여 SiC Hybrid module의 도통 손실은 168W, 스위칭 손실은 9.3W, 다이오드 손실은 10.5nW의 결과를 나타내었으며, 시뮬레이션 결과와 비교하였을 때 유사한 값을 나타내었다. 이를 바탕으로 Si module과 SiC Hybrid module의 시뮬레이션 결과 값 비교 결과, Si module의 총 소자 손실값은 246.2W, SiC Hybrid module의 총 소자 손실 값은 189.9W를 나타내었으며, 손실 차이 값은 56.3W로써 약 0.8W의 효율 차이를 보였다. 이로 인하여 SiC SBD의 Reverse recovery 특성을 검증하였다. 또한 고온 포화상태에서 SiC Hybrid module 및 Si module의 안정성을 확인하기 위하여 온도 포화 테스트를 진행하였으며, Si module의 경우, 출력전력 4kW에서 동작을 멈추었고, SiC Hybrid module은 7kW까지 동작을 확인하였다. 이를 바탕으로, 효율 그래프와 온도 그래프를 제시하였으며, Si module은 4kW까지, SiC Hybrid module은 7kW까지 그래프로 나타내었다.

• 전기전자학회논문지
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• 제22권4호
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• pp.1202-1205
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• 2018

본 논문에서는 4H-SiC물질 기반으로 제작된 ggNMOS를 제안하고 전기적 특성을 분석하였다. 4H-SiC는 Wide Band-gap 물질로 Si 물질 보다 면적대비 특성과 고전압 특성이 뛰어나 전력반도체 분야에 주목받고 있다. 제안된 소자는 높은 감내 특성과 Strong snapback 특성을 가진다. 공정은 SiC 공정으로 이루어 졌으며 TLP 측정 장비를 통해 전기적 특성을 분석하였다.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2014년도 추계학술대회 논문집
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• pp.85-86
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• 2014

The paper presents a power supply of atmospheric-pressure plasma reactor based on SiC (Silicon Carbide) MOSFET resonant inverter. Thanks to the capacitive characteristic of capacitive coupling plasma reactor type, the LC series resonant inverter had been applied to take advantages of this topology with the implementation of SiC MOSFET power modules as switching power devices. Designation of gate driver for SiC MOSFET had been introduced by this paper. The 5kVp, 5kW power supply had also been verified by experimental results.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2017년도 전력전자학술대회
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• pp.188-189
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• 2017

There has been a growing demand for power semiconductor switches equipped with high-voltage blocking capability of kV range and fast-switching characteristics of ns range in various plasma application. This paper investigates the application of SiC MOSFETs in the particular plasma application which requires the blocking voltage of 4.5kV and the switching transient time of less than 100ns. In order to meet the required blocking voltage, the series connection of multiple SiC MOSFETs is adopted in this paper. Also, snubber capacitors are employed to equalize the voltage sharing among the series connected SiC MOSFETs. The simulation and experimental result successfully verifies the application of SiC MOSFETs and snubber capacitors in the plasma application requiring high-voltage and fast-switching load dynamics.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 추계학술대회 발표 논문집
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• pp.10-13
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• 2006

This paper describes on the fabrication and characteristics of a 3C-SiC (Silicon Carbide) micro pressure sensor for harsh environment applications. The implemented micro pressure sensor used 3C-SiC thin-films heteroepitaxially grown on SOI (Si-on-insulator) structures. This sensor takes advantages of the good mechanical properties of Si as diaphragms fabricated by D-RIE technology and temperature properties of 3C-SiC piezoresistors. The fabricated pressure sensors were tasted at temperature up to $250^{\circ}C$ and indicated a sensitivity of 0.46 mV/V*bar at room temperature and 0.28 mV/V*bar at $250^{\circ}C$. The fabricated 3C-Sic/SOI pressure sensor presents a high-sensitivity and excel lent temperature stability.

• 한국결정성장학회지
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• 제20권5호
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• pp.232-236
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• 2010

SiC 세라믹스는 가볍고, 우수한 고온 강도 및 온도 안정성을 지니고 있어 고온 구조용 디바이스에 많이 응용되고 있다. 본 논문에서는 분자동역학을 이용하여 다양한 온도에서 SiC 결정의 탄성율 특성을 분석하고자 하였다. 이를 위하여 SiC 결정을 모델링하여 구성 원자 사이에 Tersoff 포텐셜을 적용하고, 분자동역학 프로그램인 LAMMPS S/W를 이용하여 상온부터 $1,250^{\circ}C$까지 응력-변위 거동(stress-strain behavior) 및 탄성율 변화를 분석하였다. 본 연구의 결과, SiC 결정은 잘 알려진 바와 같이 저온에서 탄성변형 특성을 보이지만, $1,000^{\circ}C$ 이상의 고온에서 높은 변위를 인가할 경우, 약간의 소성 변형 특성을 보이는 것으로 나타났다. 또한 상온부터 $1,250^{\circ}C$까지 온도가 증가함에 따라 SiC 결정의 탄성율은 약 475 GPa 부터 425 GPa의 범위에서 변화하는 것으로 분석되었다.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2014년도 추계학술대회 논문집
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• pp.193-194
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• 2014

This paper compares physical characteristic of MOSFET based on Si and SiC to achieve high efficiency in converters using MOSFETs which are typical switching elements. Also, it compares a result to compare operating efficiency when DC/DC converter is switching with each element.

• 한국재료학회지
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• 제14권9호
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• pp.649-654
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• 2004

In this paper, the fracture toughness and mechanisms of failure in a random SiC-whisker/$Al_{2}O_3$ ceramic composite were investigated using in situ observations during mode I(opening) loading. $SiC_{w}/Al_{2}O_3$ composite was obtained by hot press sintering of $Al_{2}O_3$ powder and SiC whisker as the matrix and reinforcement, respectively. The whisker and powder were mixed using a turbo mill. The composite was produced at SiC whisker volume fraction of $0.3\%$. Compared with monolithic $Al_{2}O_3$, fracture toughness enhancement was observed in $SiC_{w}/Al_{2}O_3$ composite. This improved fracture toughness was attributed to SiC whisker bridging and crack deflection. $SiC_{w}/Al_{2}O_3$ composite exhibited typically brittle fracture behavior, but a fracture process zone was observed in this composite. This means that the load versus load-line displacement curve of $SiC_{w}/Al_{2}O_3$ composite from a fracture test may involve a small non-linear region near the peak load.

• 한국세라믹학회지
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• 제47권6호
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• pp.546-552
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• 2010

The achievement of high gas permeability is a key factor in the development of porous SiC ceramics for applications of hot gas filter, vacuum chuck, and air spindle. However, few reports on the gas permeability of porous SiC ceramics can be found in the literature. In this paper, porous SiC ceramics were fabricated at temperatures ranging from $1600^{\circ}C$ to $1800^{\circ}C$ using the mixing powders of SiC, silicon, carbon and boron as starting materials. In some samples, expanded hollow microspheres as a pore former were used to make a cellular pore structure. It was possible to produce Si bonded SiC ceramics with porosities ranging from 42% to 55%. The maximum bending strength was 58MPa for the carbon content of 0.2 wt% and sintering temperature of $1700^{\circ}C$. The increase of air permeability was accelerated by addition of hollow microsphere as a pore former.