• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1995년도 하계학술대회 논문집 C
• /
• pp.1431-1433
• /
• 1995

This paper describes the characteristics of Si Hall sensors fabricated on a SOI(Si-on-insulator} structure, in which the SOI structure was forrmed by SDB(Si-wafer direct bonding) technology. The Hall voltage and the sensitivity of implemented Si Hall devices show good linearity with respect to the applied magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall device is average $600V/A{\cdot}T$. In the temperature range of 25 to $300^{\circ}C$, the shifts of TCO(Temperature Coefficient of the Offset Voltage) and TCS(Temperature Coefficient of the product Sensitivity) are less than ${\pm}6.7{\times}10^{-3}/^{\circ}C$ and ${\pm}8.2{\times}10^{-4}/^{\circ}C$, respectively. From these results, Si Hall sensors using the SOI structure presented here are very suitable for high-temperature operation.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제55권11호
• /
• pp.505-513
• /
• 2006

The present study investigated the influence of the content of $Al_2O_3+Y_2O_3$ sintering additives on the microstructure, mechanical and electrical properties of the pressureless-sintered $SiC-ZrB_2$ electroconductive ceramic composites. Phase analysis of composites by XRD revealed mostly of ${\alpha}-SiC(4H),\;ZrB_2,\;{\beta}-SiC(15R)$ and In Situ $YAG(Al_5Y_3O_{12})$. The relative density and the flexural strength showed the highest value of 86.8[%] and 203[Mpa] for $SiC-ZrB_2$ composite with an addition of 8[wt%] $Al_2O_3+Y_2O_3$ as a sintering aid at room temperature respectively. Owing to crack deflection and crack bridging of fracture toughness mechanism, the fracture toughness showed 3.7 and $3.6[MPa{\cdot}m^{1/2}]\;for\;SiC-ZrB_2$ composites with an addition of 8 and 12[wt%] $Al_2O_3+Y_2O_3$ as a sintering aid at room temperature respectively. Abnormal grain growth takes place during phase transformation from ${\beta}-SiC\;into\;{\alpha}-SiC$ was correlated with In Situ YAG phase by reaction between $Al_2O_3\;and\;Y_2O_3$ additives during sintering. The electrical resistivity showed the lowest value of $6.5{\times}10^{-3}[({\Omega}{\cdot}cm]$ for the $SiC-ZrB_2$ composite with an addition of 8[wt%] $Al_2O_3+Y_2O_3$ as a sintering aid at room temperature. The electrical resistivity of the $SiC-ZrB_2$ composites was all positive temperature coefficient(PTCR) in the temperature ranges from $25[^{\circ}C]\;to\;700[^{\circ}C]$. The resistance temperature coefficient showed the highest value of $3.53{\times}10^{-3}/[^{\circ}C]\;for\;SiC-ZrB_2$ composite with an addition of 8[wt%] $Al_2O_3+Y_2O_3$ as a sintering aid in the temperature ranges from $25[^{\circ}C]\;to\;700[^{\circ}C]$. In this paper, it is convinced that ${\beta}-SiC$ based electroconductive ceramic composites for heaters or ignitors can be manufactured by pressureless sintering.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2017년도 추계학술대회
• /
• pp.153-154
• /
• 2017

In this paper, a short-circuit protection function of a gate driver for SiC FET is investigated, which monitors voltage between drain and source of a FET under turn-on condition and turns off the FET if the voltage exceeds a predefined value.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2016년도 추계학술대회 논문집
• /
• pp.63-64
• /
• 2016

This paper deal with single module design of 13.2kVrms/10kVA solid state transformers exchanging conventional transformer. We can design compact hardware system to reduce size and get higher switching frequency by using SiC devices. As a result by comparing simulation results with experiment result, it is verified.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2017년도 추계학술대회
• /
• pp.133-134
• /
• 2017

This paper analyzes switch Device losses and efficiency depending on SiC and Si devices. The switch devices loss is compared to Si and SiC-based elements through Threshold Voltage and Miller Platequ Voltage. And analyzed through comparison of each switching loss by experiment.

• 한국표면공학회지
• /
• 제22권2호
• /
• pp.69-77
• /
• 1989

Codeposion of inert particles particles in a metallic mateix by electroless plating process involves two phenomena. Firstly, the adsorption of inercles and secondly, the adsorption of inert particles on the cathode. In the present paper the first adsorption phenomenon and in the next paper the second ane are studied in greaterdetail for the Ni-SiCc, Ni-Al2AO3 and Ni-WC systems. Measurements of the Zeta potentials for the SiC and Al2AO3 particles have been in different electrolyte solutions and the ionic species adsorbed on the Particles studied. The addition of sodium acetate, trisodium citrate and sodium phosphinate to nikel sulface sruomotes the zeta potential of SiC and Al2O3 particles, but zeta phosphinate to nickel is more positive than Al2O3 particles although the amount of nickel ion adsorbrd on the Al2O3 particles become greater than that of SiC particles. It is suggested that this is due to adsortion of Na ion onto the surface SiC particles.

• 전기전자학회논문지
• /
• 제26권1호
• /
• pp.50-55
• /
• 2022

SiC는 차세대 전력반도체의 핵심 재료로 넓은 밴드갭과 높은 절연파괴강도, 열전도율을 가지고 있지만 deep level defect와 같은 다양한 문제를 야기하는 결함이 존재한다. SiC에서 나타나는 defect는 물성에서 나타나는 defect와 계면에서 나타나는 interface trap 2가지로 나뉜다. 본 논문은 상온 (300 K)에서 보고되는 Z_1/2 trap concentration 0 ~ 9×10¹⁴ cm^-3을 SiC substrate와 epi layer에 적용하여 turn-on 특성을 알아보고자 한다. 전류밀도와 SRH(Shockley-Read-Hall), Auger recombination을 통해 구조 내 재 결합률을 확인하였다. trap concentration이 증가할수록 turn-on시 전류밀도와 재 결합률은 감소하며 Ron은 0.004에서 0.022 mΩ으로 약 550% 증가하였다.

• 마이크로전자및패키징학회지
• /
• 제30권2호
• /
• pp.43-51
• /
• 2023

본 논문에서는 전기차 전력변환 시스템의 근간이 되는 전력반도체 소자의 발전 방향과 차세대 전력반도체 소자인 wide bandgap (WBG)의 특징에 관해 소개하고자 한다. 현재까지의 주류인 Si insulated gate bipolar transistor (IGBT)의 특징에 관해 소개하고, 제조사 별 Si IGBT 개발 방향에 대해 다루었다. 또한 대표적인 WBG 전력반도체 소자인 SiC metal-oxide-semiconductor field-effect transistor (MOSFET)이 가지는 특징을 고찰하여 종래의 Si IGBT 소자 대비 SiC MOSFET이 가지는 효용 및 필요성에 대해 서술하였다. 또한 현 시점에서의 GaN 전력반도체 소자가 가지는 한계 및 그로 인해 전기자동차용 전력변환모듈 용으로 사용하기에 이슈인 점을 서술하였다.

• 반도체디스플레이기술학회지
• /
• 제16권2호
• /
• pp.49-54
• /
• 2017

In this paper, recent researches on new and renewable energy have been conducted due to problems such as energy exhaustion and environmental pollution, and new researches on high efficiency and high speed switching are needed. Therefore, we compared the efficiency by using high speed switching devices instead of IGBT which can't be used in high speed switching. The experiment was performed theoretically by applying the same parameters of the high speed switching devices which are the Cool MOS of Infineon Co., SiC C3M of Cree, and GaN FET device of Transform, by implementing the DC-DC boost converter and measuring the actual efficiency for output power and frequency. As a result, the GaN FET showed good efficiency at all switching frequency and output power.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1999년도 하계학술대회 논문집 D
• /
• pp.1818-1820
• /
• 1999

This paper presents direct ${\mu}c$-Si:H thin film growth on the glass substrates using RPCVD system (remote plasma chemical vapor deposition) in low temperature. Hydrogenated micro-crystalline silicon deposited by RPCVD system in low temperature is very useful material for photovoltaic devices, sensor applications, and TFTs (thin film transistors). Varying the deposition conditions such as substrate temperature, gas flow rate, reactive gas ratio $(SiH_4/H_2)$, total chamber pressure, and rf power, we deposited ${\mu}c$-Si:H thin films on the glass substrates (Corning glass 1737). And then we measured the structural and electrical properties of the films.