• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.27-31
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• 2009

In this paper, the polymer adhesive bonding technology using wafer-level technology was investigated and warpage results were analyzed. Si and glass wafer was bonded after adhesive polymer layer and dam pattern for uniform state was patterned on glass wafer. In this study, warpage result decreased as the low of bonding temperature of Si wafer, bonding pressure and height of adhesive bonding layer. The availability of adhesive polymer bonding was confirmed by TC, HTC, Humidity soak test after dicing. The result is that defect has not found without reference to warpage.

• Journal of the Semiconductor & Display Technology
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• v.5 no.2 s.15
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• pp.33-36
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• 2006

Many issues arose to use the Pb-free solder as adhesive materials in MEMS ICs and packaging. Then this study for easy and simple sealing method using adhesive materials was carried out to maintain hermetic characteristic in MEMS Package. In this study, Hermetic characteristic using negative PR (XP SU-8 3050 NO-2) as adhesive at the interface of Si test coupon/glass substrate and Si test coupon/LTCC substrate was examined. For experiment, the dispenser pressure was 4 MPa and the $200\;{\mu}m{\Phi}$ syringe nozzle was used. 3.0 mm/sec as speed of dispensing and 0.13 mm as the gap between Si test coupon and nozzle was selected to machine condition. 1 min at $65^{\circ}C$ and 15 min at $95^{\circ}C$ as Soft bake, $200\;mj/cm^2$ expose in 365 nm wavelength as UV expose, 1 min at $65^{\circ}C$ and 6 min at $95^{\circ}C$ as Post expose bake, 60 min at $150^{\circ}C$ as hard bake were selected to activation condition of negative PR. Hermetic sealing was achieved at the Si test coupon/ glass substrate and Si test coupon/LTCC substrate. The leak rate of Si test coupon/glass substrate was $5.9{\times}10^{-8}mbar-l/sec$, and there was no effect by adhesive method. The leak rate of Si test coupon/LTCC substrate was $4.9{\times}10^{-8}mbar-l/sec$, and there was no effect by dispensing cycle. Better leak rate value could be achieved to use modified substrate which prevent PR flow, to increase UV expose energy and to use system that controls gap automatically with vision.

• The monthly packaging world
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• s.325
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• pp.59-64
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• 2020

• The monthly packaging world
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• s.338
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• pp.48-53
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• 2021

• Elastomers and Composites
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• v.40 no.3
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• pp.196-203
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• 2005

In this work, the engine oil resistant evaluation and breakdown analysis of room temperature vulcanizing silicone adhesives were performed through the surface properties, thermal stabilities, adhesive strength, and morphology measurements. As a result, the permeation of engine oil into adhesive specimens was carried out from surface to center in the specimens. And the oil content in the adhesive specimens was increased and the Si-O-Si bond of the adhesives was decomposed with increasing the aging time. The TGA results indicated that the thermal degradation was mainly occurred at under and surfaces of the specimens. The tensile strength, elongation, and adhesive strength of the adhesives were significantly decreased after the engine oil resistant tests, which could be attributed to the initial lose of adhesive properties resulting from the engine oil absorption and thermal aging. And the failure mode of the adhesive specimens was changed from cohesive failure to interfacial failure.

• Journal of Korea Foundry Society
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• v.14 no.5
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• pp.447-454
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• 1994

Wear resistance and wear mechanism of hypereutectic Al-($15{\sim}40$)wt%Si alloys were investigated. Primary Si particles under $20{\mu}m$ size were formed in hypereutectic Al-Si alloy powders due to rapid solidification. But the Si particles of extruded bars were finely distributed in smaller size than that of atomized powders. The wear mechanism of hypereutectic Al-Si alloys was divided into three types of wear phenomena, which were abrasive wear, delamination wear and severe adhesive wear according to sliding speed and load. At low sliding speed and load, wear mechanism was abrasive wear, so Al-15wt%Si alloy showed the best wear resistance. At high sliding speed and load, wear mechanism was adhesive wear, and Al-40wt%Si alloy showed the best wear resistance.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.5
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• pp.840-847
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• 2003

The bonding of adhesive joints of adhesive joints is influenced by the surface roughness of the joining Parts. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, it is shown that surface treatment affects adhesive strength and durability of alumina/polycarbonate single-lap .joints, and leading speed affects tensile-shea strength of adhesive Joints. To evaluate effect of surface treatments on the adhesive strength, several surface treatment methods are used, that is, cleaning, grinding, SiC polishing and sand blasting. It is shown that an optimum value of the surface roughness exists with respect to the tensile-shea strength of adhesive joints. The adhesive strength shows linear relationship with the surface roughness and loading speed. And the mechanical removal of disturbing films of lubricants, impurities and oxides make adhesive strength increase significantly.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.2
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• pp.122-130
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• 2012

Adhesive bend and shear tests of micro-sized bonded component have been performed to clarify the relationship between effects of heat-treatment on the adhesive strength and the bonded specimen shape using Weibull analysis. Multiple micro-sized SU-8 columns with four different diameters were fabricated on a Si substrate under the same fabrication condition. Heat-treatment can improve both of the adhesive bend and shear strength. The improvement rate of the adhesive shear strength is much larger than that of the adhesive bend strength, because the residual stress, which must change by heat-treatment, should effect more strongly on the shear loading. In case of bend type test, the adhesive bend strength in the smaller diameters (50 and $75\;{\mu}m$) widely vary, because the critical size of the natural defect (micro-crack) should vary more widely in the smaller diameters. In contrast, in case of shear type test, the adhesive shear strengths in each diameter of the columns little vary. This suggests that the size of the natural defects may not strongly influence on the adhesive shear strength. All the result suggests that both of the adhesive bend and shear strengths should be complicatedly affected by heat-treatment and the bonded columnar diameter.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1151-1154
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• 2005

The size effects for adhesive and frictional characteristics were studied. The specimen was Mica and the AFM tips were SiO2. The radii of SiO2 tip were 280, 380, 930, and 2230 nm on which tribological tests had never been performed. It was found that the adhesive forces and the frictional coefficients increased non-linearly with tip radius. Compared with previous studies at nanoscale and microscale, the results showed behaviors bridging each previous result. It could be said that these results were clues to explain the material behaviors between nanoscale and microscale both in adhesion and friction.