• 제목/요약/키워드: Si grinding

검색결과 107건 처리시간 0.293초

치과용 Ti-10%Zr-X%Cr(X=0,1,3)합금의 연삭성 (Grindability of Ti-10%Zr-X%Cr(X=0,1,3) Alloys for Dental Applications)

  • 정종현;신재우
    • 대한치과기공학회지
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    • 제35권4호
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    • pp.295-302
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    • 2013
  • Purpose: The grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys in order to develop Ti alloys for dental applications with better machinability than unalloyed titanium has been evaluated. Methods: Experimental Ti-10%Zr-X%Cr(X=0,1,3) alloys were made in an argon-arc melting furnace. Slabs of experimental alloys were ground using a SiC abrasive wheel on an electric handpiece at one of the four rotational speeds of the wheel (12000, 18000, 25000 or 30000rpm) by applying a force(100gf). Grindability was evaluated by measuring the amount of metal volume removed per minute(grinding rate) and the volume ratio of metal removed compared to the wheel material lost, which was calculated from the diameter loss (grinding ratio). Experimental datas were compared the results with those of cp-Ti(commercially pure titanium) Results: It was observed that the grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys increased with an increase in the Cr concentration. More, they are higher than cp-Ti, particularly the Ti-10%Zr-3%Cr alloy exhibited the highest grindability at all rotational speeds except 12000rpm. There was significant difference in the grinding rate and grinding ratio between Ti-10%Zr-3%Cr alloy and cp-Ti at all rotational speeds(p<0.05). Conclusion: The Ti-10%Zr-3%Cr alloy exhibited better grindability at high rotational speeds, great potential for use as a dental machining alloy.

레이저 예열에 의한 $Si_3N_4$ 세라믹스의 선삭가공 (Turning of Si3N4 ceramics preheated by Laser)

  • 김선원;이제훈;서정;신동식
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1493-1498
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    • 2007
  • Silicon Nitride ($Si_3N_4$), which is widely used in a variety of applications, is hard-to-machine due to its high hardness. At high temperature (e.g. above $1000^{\circ}C$), however, the machinability can be greatly improved. In this work, we used a $CO_2$ laser with a high absorptivity to $Si_3N_4$ of 0.9 to preheat the surface of a rothting $Si_3N_4$ rod. Preheating and turning of $Si_3N_4$ was executed at the same time. The result of machining was MRR of $8.0mm^3/s$ that is four times faster than normal grinding. Continuous chip formation was observed by a microscope.

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The Effect of Psychological Factors on Sleep Disturbances in Young Adults

  • Park, Hye Sook
    • Journal of Oral Medicine and Pain
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    • 제45권1호
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    • pp.1-11
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    • 2020
  • Purpose: The purpose of this study was to assess influences of psychological factors on sleep disturbances in young adults through the revised version of the Minnesota Multiphasic Personality Inventory (MMPI-2). Methods: Two hundred and ninety nine college students in Gyeonggi-do completed the MMPI-2 and a questionnaire related to sleep disturbances and collected data were analyzed by logistic regression. Results: The odds of tooth grinding increased significantly with the increase of T-score of hysteria (Hy) scale. The increase of T-score of hypomania (Ma) and social introversion (Si) scale significantly contributed to the risk of insomnia. The occurrence of insomnia increased significantly as T-score of somatic complaints (RC1) and psychoticism (PSYC) scale increased. The odds of tooth grinding increased significantly as T-score of anxiety (ANX) and family problems (FAM) scale increased. The occurrence of insomnia decreased significantly with the increase of T-score of type A behavior (TPA) scale. The increase of T-score of dominance (Do) scale significantly contributed to the risk of tooth clenching. The odds of tooth grinding decreased significantly as T-score of MacAndrew alcoholism-revised (MAC-R) scale increased, whereas it increased significantly as T-score of addiction potential scale (APS) increased. No scale of MMPI-2 significantly affected the occurrence of snoring. Conclusions: T-scores of Hy, ANX, FAM, Do, MAC-R, and APS scales on MMPI-2 affected the risk of bruxism. T-scores of Ma, Si, RC1, PSYC, and TPA scales on MMPI-2 influenced the occurrence of insomnia. The psychometric instrument such as MMPI-2 is helpful in understanding and managing bruxism and insomnia.

블랙 알루미나의 연삭가공에 관한 연구 (Study on grinding of the black alumina)

  • 박종남;노승희;이동길
    • 한국산학기술학회논문지
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    • 제20권11호
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    • pp.7-12
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    • 2019
  • 반도체 시장에서 소재 개발 및 제조 공법에 대한 연구는 꾸준히 진행되고 있다. 일반적으로 자동 로봇용 End Effector는 알루미나(Al2O3)와 탄화규소(SiC) 등의 세라믹이 사용되었다. 본 연구는 대량생산이 가능한 분말 성형 프레스 법을 통해 반도체 현장에서 사용되는 블랙 알루미나를 개발하였다. 그리고 알루미나와 블랙 알루미나를 자동 로봇의 End Effector에 적용될 수 있도록 평면 연삭기를 사용하여 연삭가공을 실시하였다. 연삭가공을 통해 블랙 알루미나 대한 표면 거칠기(Ra)를 비교·분석하여 최적의 절삭 조건을 확인 할 수 있었다. 알루미나 표면 거칠기는 이송 속도가 0.72mm/sec이고 회전수가 1,700 rpm에서 0.4876 ㎛로 가장 양호하였다. 블랙 알루미나 표면 거칠기는 대부분의 절삭 조건에서 0.2 ㎛이하의 정밀도를 나타내었으며, 이송 속도가 0.72mm/sec이고 회전수가 1,900 rpm에서 0.1364 ㎛로 가장 양호하였다. 블랙 알루미나의 표면 거칠기는 알루미나 보다 0.35 ㎛ ~ 0.47 ㎛ 정도 양호하였다.

스마트 고로슬래그 미분말을 첨가한 시멘트 모르타르의 초기 압축강도 향상에 관한 연구 (A Study on the Improvement of Early-age Compressive Strength of Smart BFS Powder Added Cement Mortar)

  • 이성태;노재호;김진형;이강진
    • 한국구조물진단유지관리공학회 논문집
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    • 제17권2호
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    • pp.135-141
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    • 2013
  • 본 연구에서는 CaO-$SiO_2-Al_2O_3$가 다량 함유된 산업폐기물과 산업부산물을 소성하여 개발한 분말형 속경성 분말을 초기강도의 향상을 위해 기능성 분쇄조제로 처리하여 분쇄한 속경성 미분말을 제조하였다. 이렇게 제조된 미분말을 BFS 분말과 일정비율로 혼합한 후, 시멘트에 첨가하여 모르타르 압축강도 실험을 실시하였다. 그 결과 BFS 조기강도 향상 실험 (Series I)에서는 클링커 분쇄시 기능성 분쇄조제가 첨가되어 분쇄된 속경재가 혼합된 BFS의 초기강도 발현이 우수하며 OPC 조기강도 향상 실험 (Series II)에서는 Clinker-C에 본 실험의 기능성 분쇄조제가 첨가되어 분쇄된 속경성의 분말형 자극제가 첨가된 경우에 가장 압축강도가 높은 사실을 알 수 있었다.

건식정제에 의한 견운모광의 품위향상연구 (Improvement in Grade of Sericite Ore by Dry Beneficiation)

  • 조건준;김윤종;박현혜;조성백
    • 한국재료학회지
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    • 제19권4호
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    • pp.212-219
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    • 2009
  • A study on the dry beneficiation of sericite occurring in the Daehyun Mine of the Republic of Korea region as performed by applying selective grinding and air classification techniques. Quartz and sericite occurred in the raw ore as major components. The results of liberation using a ball mill and an impact mill showed that the contents of $R_2O$ were increased while $SiO_2$ was decreased in proportion to decreasing particle size. According to the XRD, XRF analysis and the EDS of SEM analysis, the ball mill gave a better grade product in $R_2O$ content than the impact mill when the particle size was the same. When the raw ore was ground by the impact mill with arotor speed 57.6 m/sec and then followed by 15,000rpm classification using an air classifier, the chemical composition of the over flowed product was 49.65wt% $SiO_2$, 32.15wt% $Al_2O_3$, 0.13wt% $Fe_2O_3$, 10.37wt% $K_2O$, and 0.14wt% $Na_2O$. This result indicates that the $R_2O$ contents were increased by 49.5% compared to that of the raw ore. From these results described above, it is suggested that hard mineral such as Quartz little ground by selective grinding using impact mill whereas soft mineral such as sericite easily ground to small size. As a result of that hard minerals can be easily removed from the finely ground sericite by air classification and the $R_2O$ grade of thus obtained concentrate was improved to higher than 10wt% which can be used for ceramics raw materials.

삼차원 집적화를 위한 초박막 실리콘 웨이퍼 연삭 공정이 웨이퍼 표면에 미치는 영향 (Effect of Si Wafer Ultra-thinning on the Silicon Surface for 3D Integration)

  • 최미경;김은경
    • 마이크로전자및패키징학회지
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    • 제15권2호
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    • pp.63-67
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    • 2008
  • 전자산업의 소형화와 경량화 추세에 맞추어 최근 집적 칩(IC)이나 패키지를 적층시키는 삼차원 집적화(3D integration) 기술 개발은 차세대 핵심기술로 중요시되고 있다. 본 연구에서는 삼차원 집적화 공정 기술 중 하나인 초박막 실리콘 웨이퍼 연삭(grinding)공정이 웨이퍼 표면에 미치는 영향에 대해서 조사하였다. 실리콘 웨이퍼를 약 $30{\mu}m$$50{\mu}m$ 두께까지 연삭한 후, 미세연삭(fine grinding) 단계까지 처리된 시편을 건식 연마(dry polishing) 또는 습식 애칭(wet etching)으로 표면 처리된 시편들과 비교 분석하였다. 박막 웨이퍼 두께는 전계방시형 주사전자현미경과 적외선 분광기로 측정하였고, 표면 특성 분석을 위해선 표면주도(roughness), 표면손상(damage), 경도를 원자현미경, 투과정자현미경 그리고 나노인덴터(nano-indentor)를 이용하여 측정하였다. 표면 처리된 시편의 특성이 표면 처리되지 않은 시편보다 표면주도와 표면손상 등에서 현저히 우수함을 확인 할 수 있었으나, 경도의 경우 표면 처리의 유무에 관계없이 기존의 벌크(bulk)실리콘 웨이퍼와 오차범위 내에서 동일한 것으로 보였다.

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연속 드레싱 공정을 도입한 엔지니어링 세라믹스의 고능률적 연삭 가공에 관한 연구 (A study on the grinding machining of engineering ceramics with high efficiency using "In-process dressing")

  • 강재훈;이재경
    • 오토저널
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    • 제15권2호
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    • pp.130-143
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    • 1993
  • Engineering ceramics have some excellent properties as the material for the mechanical components. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. In this paper, experiments are carried out to obtain the effect of "In-process dressing" to grind the Engineering ceramics with high efficiency. To save running time for dressing process and obtain restraint effect of diamond grain wear, "In-process dressing" system using WA stick type honing stone is proposed. Representative Engineering ceramics, such as AI$_{2}$O$_{3}$, Si$_{3}$N$_{4}$, are ground with diamond wheel. Also bending strength test is carried out to check upward tendancy of mecahnical properties as the result of machining defact restraint through the grinding machining method using "In-process dressing" process. Some results obtained in this study provide useful information to attain the high efficiency grinding and the high mechanical properties of Engineering ceramics.rties of Engineering ceramics.

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Effect of N2/Ar flow rates on Si wafer surface roughness during high speed chemical dry thinning

  • Heo, W.;Lee, N.E.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.128-128
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    • 2010
  • In this study, we investigated the evolution and reduction of the surface roughness during the high-speed chemical dry thinning process of Si wafers. The direct injection of NO gas into the reactor during the supply of F radicals from NF3 remote plasmas was very effective in increasing the Si thinning rate, due to the NO-induced enhancement of the surface reaction, but resulted in the significant roughening of the thinned Si surface. However, the direct addition of Ar and N2 gas, together with NO gas, decreased the root mean square (RMS) surface roughness of the thinned Si wafer significantly. The process regime for the increasing of the thinning rate and concomitant reduction of the surface roughness was extended at higher Ar gas flow rates. In this way, Si wafer thinning rate as high as $20\;{\mu}m/min$ and very smooth surface roughness was obtained and the mechanical damage of silicon wafer was effectively removed. We also measured die fracture strength of thinned Si wafer in order to understand the effect of chemical dry thinning on removal of mechanical damage generated during mechanical grinding. The die fracture strength of the thinned Si wafers was measured using 3-point bending test and compared. The results indicated that chemical dry thinning with reduced surface roughness and removal of mechanical damage increased the die fracture strength of the thinned Si wafer.

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High Performance Cements and Advanced Ordinary Portland Cement Manufacturing by HEM-refinement

  • Zoz, H.;Jaramillo V., D.;Tian, Z.;Trindade, B.;Ren, H.;Chimal-V, O.;Torre, S.Diaz de la
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.1119-1120
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    • 2006
  • High Energy Milling (HEM) is applied for the grinding of cement and this can lead to substantial refinement $(<2{\mu}m)$ and mechanically activation of the powder particles. The present paper reviews the preliminary studies, explains the novel technique and suggests the route into commercial application. Particular attention is paid to wear results with an applied $Si_3N_4-grinding$ unit where no substantial wear was found after 4000 h of operation.

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