• Journal of the Korean Society for Precision Engineering
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• v.7 no.2
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• pp.105-112
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• 1990

Advanced ceramics have some excellent properities as the material for the mechanical component. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. In this paper, some experiments are carried out to find the basic grinding characteristic of advanced ceramics. Representative advanced ceramics, such as AL/sub 2/ O/sub 3/, ZrO/sub 2/, SiC and Si/sub 3/N/sub 4/and ground with diamond wheels. Special attention is paid to comparison between the conventional and creep feed grinding. Results obtained in this study provide some useful informations to attain the high efficiency grinding of advanced ceramics.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.2
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• pp.26-32
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• 2010

This paper reports some experimental result in grinding and polishing of silicon cathodes used in semiconductor manufacturing process. Cup shape diamond core wheels were used in experiments and the radial and tangential grinding forces were measured with surface roughness. In polishing experiments, flat type and donut type wool polishing tools were tested. The experimental results indicate that the grinding forces are proportional to the material removal rates and the surface roughness are inversely proportional to the spindle speed. The surface roughness of polished Si decreases with polishing time and higher spindle speed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.308-313
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• 2002

In order to investigate the characteristics of grinding and diamond wheel grinding ceramic materials, grinding resistance, surface roughness of worked surface and image of grinding wheel were acquired using experimental method. Through the experiments, this makes it possible to observe grinding wheel behavior by grinding resistance, surface roughness and cutting edge ratio. In case of A1$_2$O$_3$, cutting edge ratio is begger than that of ZrO$_2$and Si$_3$N$_4$. That's because A1$_2$O$_3$has a characteristics of low fracture toughness and bending stress.

• Journal of the Korean Ceramic Society
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• v.46 no.6
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• pp.545-547
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• 2009

An immiscible Si/Sn (=7/3 by volume) powder mixture was subjected to simple grinding and subsequent leaching process to give Sn nanopowder reinforced or dispersed in Si powder. Crystallite and their agglomerates of Si were ca. 15 nm and 100 nm, respectively. Sn remained at 4.5 vol% in Si powder after aqueous HCl leaching, dispersively occluded in Si matrix as confirmed by ICP analysis and cross sectional TEM observation.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.3
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• pp.86-92
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel far ceramic materials. Normal component of grinding resistance of $Al_2$O$_3$ was less then that of $Si_3 N_4$ and $ZrO_2$. This seems to be the characteristics of ceramic tools on work pieces both of high hardness. For the case of $Si_3 N_4$ and $ZrO_2$, as the mesh number of wheel increases, the surface roughness decreases. For the case of $Al_2 O_3$, the surface roughness does not decreases. Specific binding energy decreases as the material removal rate per unit time increases. For the case of $Si_3 N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $Al_2 O_3$, grinding is carried out by grain shedding process due to brittle fracture.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.49-53
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• 2018

Recently, technologies for integrating various devices such as a flexible device, a transparent device, and a MEMS device have been developed. The key processes of heterogeneous device manufacturing technology are chip or wafer-level bonding process, substrate grinding process, and thin substrate handling process. In this study, the effect of Si substrate grinding process on the electrical properties of tin oxide thin films applied as transparent thin film transistor or flexible electrode material was investigated. As the Si substrate thickness became thinner, the Si d-spacing decreased and strains occurred in the Si lattice. Also, as the Si substrate thickness became thinner, the electric conductivity of tin oxide thin film decreased due to the lower carrier concentration. In the case of the thinner tin oxide thin film, the electrical conductivity was lower than that of the thicker tin oxide thin film and did not change much by the thickness of Si substrate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.938-942
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding renditions of ceramic materials in the grinding with diamond wheel by the experimental plan method. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the Si$_3$${N^4} and Zr{O_2}$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the ${Al_2}{O_3}$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using the experimental plan method.

• Journal of the korean Society of Automotive Engineers
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• v.12 no.5
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• pp.60-75
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• 1990

Advanced Ceramics have some excellent prosperities as the material for the mechanical component. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. In this study, various machining experiments are carried out to obtain the basic knowledge of grinding High Strength Ceramics with high efficiency and precision for the purpose of application to Automobile parts. Advanced Engineering Ceramics such as Si$_{3}$N$_{4}$, SiC, ZrO$_{2}$, $Al_{2}$O$_{3}$ are ground with diamond wheels using conventional grinding machine. Results obtained in this study provide some useful informations to attain the high efficiency grinding of Advanced Ceramics.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.1
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• pp.16-21
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• 2004

In order to investigate the characteristics of diamond wheel grinding of ceramic materials, grinding resistance, surface roughness of ground surface and image of grinding wheel were acquired using experimental method. Through the experiments, this makes it possible to observe grinding wheel behavior by grinding resistance, surface roughness and cutting edge ratio. In case of $Al_2O_3$, cutting edge ratio is bigger than that of $ZrO_2$ and $Si_3N_4$. That's because $Al_2O_3$ has a characteristic of low fracture toughness and bending stress.