• Journal of Technologic Dentistry
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• v.35 no.4
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• pp.295-302
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• 2013

Purpose: The grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys in order to develop Ti alloys for dental applications with better machinability than unalloyed titanium has been evaluated. Methods: Experimental Ti-10%Zr-X%Cr(X=0,1,3) alloys were made in an argon-arc melting furnace. Slabs of experimental alloys were ground using a SiC abrasive wheel on an electric handpiece at one of the four rotational speeds of the wheel (12000, 18000, 25000 or 30000rpm) by applying a force(100gf). Grindability was evaluated by measuring the amount of metal volume removed per minute(grinding rate) and the volume ratio of metal removed compared to the wheel material lost, which was calculated from the diameter loss (grinding ratio). Experimental datas were compared the results with those of cp-Ti(commercially pure titanium) Results: It was observed that the grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys increased with an increase in the Cr concentration. More, they are higher than cp-Ti, particularly the Ti-10%Zr-3%Cr alloy exhibited the highest grindability at all rotational speeds except 12000rpm. There was significant difference in the grinding rate and grinding ratio between Ti-10%Zr-3%Cr alloy and cp-Ti at all rotational speeds(p<0.05). Conclusion: The Ti-10%Zr-3%Cr alloy exhibited better grindability at high rotational speeds, great potential for use as a dental machining alloy.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1493-1498
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• 2007

Silicon Nitride ($Si_3N_4$), which is widely used in a variety of applications, is hard-to-machine due to its high hardness. At high temperature (e.g. above $1000^{\circ}C$), however, the machinability can be greatly improved. In this work, we used a $CO_2$ laser with a high absorptivity to $Si_3N_4$ of 0.9 to preheat the surface of a rothting $Si_3N_4$ rod. Preheating and turning of $Si_3N_4$ was executed at the same time. The result of machining was MRR of $8.0mm^3/s$ that is four times faster than normal grinding. Continuous chip formation was observed by a microscope.

• Journal of Oral Medicine and Pain
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• v.45 no.1
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• pp.1-11
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• 2020

Purpose: The purpose of this study was to assess influences of psychological factors on sleep disturbances in young adults through the revised version of the Minnesota Multiphasic Personality Inventory (MMPI-2). Methods: Two hundred and ninety nine college students in Gyeonggi-do completed the MMPI-2 and a questionnaire related to sleep disturbances and collected data were analyzed by logistic regression. Results: The odds of tooth grinding increased significantly with the increase of T-score of hysteria (Hy) scale. The increase of T-score of hypomania (Ma) and social introversion (Si) scale significantly contributed to the risk of insomnia. The occurrence of insomnia increased significantly as T-score of somatic complaints (RC1) and psychoticism (PSYC) scale increased. The odds of tooth grinding increased significantly as T-score of anxiety (ANX) and family problems (FAM) scale increased. The occurrence of insomnia decreased significantly with the increase of T-score of type A behavior (TPA) scale. The increase of T-score of dominance (Do) scale significantly contributed to the risk of tooth clenching. The odds of tooth grinding decreased significantly as T-score of MacAndrew alcoholism-revised (MAC-R) scale increased, whereas it increased significantly as T-score of addiction potential scale (APS) increased. No scale of MMPI-2 significantly affected the occurrence of snoring. Conclusions: T-scores of Hy, ANX, FAM, Do, MAC-R, and APS scales on MMPI-2 affected the risk of bruxism. T-scores of Ma, Si, RC1, PSYC, and TPA scales on MMPI-2 influenced the occurrence of insomnia. The psychometric instrument such as MMPI-2 is helpful in understanding and managing bruxism and insomnia.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.11
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• pp.7-12
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• 2019

Generally, end effectors for automatic robots can use ceramics such as alumina(Al₂O₃) and silicon carbide(SiC). In this study, black alumina was developed and used in the semiconductor field through powder molding press forming. The black alumina can be mass produced.Alumina and black alumina were ground using a plane grinder to apply to the end effector of an automatic robot. The optimal cutting conditionswere found by analyzing the surface roughness(Ra) of black alumina through grinding. The alumina surface roughness is the feed rate was about 0.72 mm/sec, and the number of revolutions was best at 0.4879 ㎛ at 1700 rpm. In addition, the black alumina surface roughness shows a precision of less than 0.2 ㎛ in most cutting conditions. The feed rate was about 0.72 mm/sec, and the number of revolutions was best at 0.1361 ㎛ at 1900 rpm. The surface roughness of black alumina was better than that of alumina by about 0.35 to 0.47 ㎛.

• Journal of the Korea institute for structural maintenance and inspection
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• v.17 no.2
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• pp.135-141
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• 2013

In this study, to improve the early-age compressive strength of mortar, the compressive strength tests of mortar mixed smart BFS powder added powder of rapid setting additives milled by processing, using functional grinding aid, the power-typed rapid setting cement clinker developed by sintering industrial waste and by-products with much CaO-$SiO_2-Al_2O_3$ to cement were performed. From the tests, the followings are found that (1) for BFS early-age strength improvement test (Series I): early-age strength improvement of BFS mixed rapid setting additive milled after adding functional grinding aid, when the clinker is milled, is superior and (2) for OPC early-age strength improvement test (Series II): case of additive mixed rapid setting powder typed activator milled after adding functional grinding aid to Clinker-C showed the higher compressive strength.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.212-219
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• 2009

A study on the dry beneficiation of sericite occurring in the Daehyun Mine of the Republic of Korea region as performed by applying selective grinding and air classification techniques. Quartz and sericite occurred in the raw ore as major components. The results of liberation using a ball mill and an impact mill showed that the contents of $R_2O$ were increased while $SiO_2$ was decreased in proportion to decreasing particle size. According to the XRD, XRF analysis and the EDS of SEM analysis, the ball mill gave a better grade product in $R_2O$ content than the impact mill when the particle size was the same. When the raw ore was ground by the impact mill with arotor speed 57.6 m/sec and then followed by 15,000rpm classification using an air classifier, the chemical composition of the over flowed product was 49.65wt% $SiO_2$, 32.15wt% $Al_2O_3$, 0.13wt% $Fe_2O_3$, 10.37wt% $K_2O$, and 0.14wt% $Na_2O$. This result indicates that the $R_2O$ contents were increased by 49.5% compared to that of the raw ore. From these results described above, it is suggested that hard mineral such as Quartz little ground by selective grinding using impact mill whereas soft mineral such as sericite easily ground to small size. As a result of that hard minerals can be easily removed from the finely ground sericite by air classification and the $R_2O$ grade of thus obtained concentrate was improved to higher than 10wt% which can be used for ceramics raw materials.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.63-67
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• 2008

3D integration technology has been a major focus of the next generation of IC industries. In this study Si wafer ultra-thinning has been investigated especially for the effect of ultra-thinning on the silicon surface. Wafers were grinded down to $30{\mu}m\;or\;50{\mu}m$ thickness and then grinded only samples were compared with surface treated samples in terms of surface roughness, surface damages, and hardness. Dry polishing or wet etching treatment has been applied as a surface treatment. Surface treated samples definitely showed much less surface damages and better roughness. However, ultra-thinned Si samples have the almost same hardness as a bulk Si wafer.

• Journal of the korean Society of Automotive Engineers
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• v.15 no.2
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• pp.130-143
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• 1993

Engineering ceramics have some excellent properties as the material for the mechanical components. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. In this paper, experiments are carried out to obtain the effect of "In-process dressing" to grind the Engineering ceramics with high efficiency. To save running time for dressing process and obtain restraint effect of diamond grain wear, "In-process dressing" system using WA stick type honing stone is proposed. Representative Engineering ceramics, such as AI$_{2}$O$_{3}$, Si$_{3}$N$_{4}$, are ground with diamond wheel. Also bending strength test is carried out to check upward tendancy of mecahnical properties as the result of machining defact restraint through the grinding machining method using "In-process dressing" process. Some results obtained in this study provide useful information to attain the high efficiency grinding and the high mechanical properties of Engineering ceramics.rties of Engineering ceramics.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.128-128
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• 2010

In this study, we investigated the evolution and reduction of the surface roughness during the high-speed chemical dry thinning process of Si wafers. The direct injection of NO gas into the reactor during the supply of F radicals from NF3 remote plasmas was very effective in increasing the Si thinning rate, due to the NO-induced enhancement of the surface reaction, but resulted in the significant roughening of the thinned Si surface. However, the direct addition of Ar and N2 gas, together with NO gas, decreased the root mean square (RMS) surface roughness of the thinned Si wafer significantly. The process regime for the increasing of the thinning rate and concomitant reduction of the surface roughness was extended at higher Ar gas flow rates. In this way, Si wafer thinning rate as high as $20\;{\mu}m/min$ and very smooth surface roughness was obtained and the mechanical damage of silicon wafer was effectively removed. We also measured die fracture strength of thinned Si wafer in order to understand the effect of chemical dry thinning on removal of mechanical damage generated during mechanical grinding. The die fracture strength of the thinned Si wafers was measured using 3-point bending test and compared. The results indicated that chemical dry thinning with reduced surface roughness and removal of mechanical damage increased the die fracture strength of the thinned Si wafer.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1119-1120
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• 2006

High Energy Milling (HEM) is applied for the grinding of cement and this can lead to substantial refinement $(<2{\mu}m)$ and mechanically activation of the powder particles. The present paper reviews the preliminary studies, explains the novel technique and suggests the route into commercial application. Particular attention is paid to wear results with an applied $Si_3N_4-grinding$ unit where no substantial wear was found after 4000 h of operation.