• Journal of Powder Materials
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• v.10 no.6
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• pp.406-414
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• 2003

In order to produce good wear resistance powder metallurgy Al-Si alloys with high strength, addition of glass forming elements of Ni and Ce in $Al_{81}$Si$_{19}$ alloy was examined using SEM, TEM, tensile strength and wear testing. The solubility of Si in aluminum increased with increasing Ni and Ce contents for rapidly solidified powders. These bulk alloys consist of a mixed structure in which fine Si particles with a particle size below 500 nm and very fine A1$_3$Ni, A1$_3$Ce compounds with a particle size below 200 nm are homogeneously dispersed in aluminum matrix with a grain size below 600 nm. The tensile strength at room temperature for $Al_{81}$Si$_{19}$, $Al_{78}$Si$_{19}$Ni$_2$Ce$_{0.5}$, and $Al_{76}$Si$_{19}$Ni$_4$Ce$_1$ bulk alloys extruded at 674 K and ratio of 10 : 1 is 281,521, and 668 ㎫ respectively. Especially, $Al_{73}$Si$_{19}$Ni$_{7}$Ce$_1$ bulk alloy had a high tensile strength of 730 ㎫. These bulk alloys are good wear-resistance bel ter than commercial I/M 390-T6. Specially, attactability for counterpart is very little, about 15 times less than that of the I/M 390-T6. The structural refinement by adding glass forming elements such as Ni and Ce to hyper eutectic $Al_{81}$Si$_{19}$ alloy is concluded to be effective as a structural modification method.d.tion method.

• Journal of the Korean Ceramic Society
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• v.29 no.5
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• pp.347-356
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• 1992

Various kaolin samples with different alumina content were prepared from calcined admixture of kaolin and ammonium sulfate by varying the treatment time in sulfuric acid. Samples were nitridated under N2 or N2-H2 atmosphere with changing the amount of added carbon, the reaction time and temperature. As the alumina content lowered, the size of kaolin particles decreased and the specific surface area increased. XRD analysis indicated that ${\alpha}$-quartz remained by decomposition of halloysite and meta-halloysite. Experimental results of nitridation behavior are summerized as follows; 1) Nitridation under N2 atmosphere. With the increase of C/SiO2 ratio and with the decrease of Al2O3 content, disappearance of XRD pattern peaks of mullite, ${\alpha}$-quartz and ${\alpha}$-Al2O3 were accelerated at 1300$^{\circ}C$. SiC was the main phase in the reaction product of acid-treated kaolin samples nitridated at 1300$^{\circ}C$ for 10 hours regardless of C/SiO2 ratio. But the XRD peak intensities of ${\beta}$-Si3N4, ${\beta}$-sialon and SiC did not show much difference when untreated raw kaolin was fired at the same condition. When the ratio of C/SiO2 was 3.5, ${\beta}$-sialon and ${\beta}$-Si3N4 existed in the reaction product of about 22% alumina containing kaolin sample fired at 1350$^{\circ}C$ for 7 hours. Only ${\beta}$-sialon existed in the same sample fired at 1400$^{\circ}C$ for 10 hours. ${\beta}$-sialon was obtained from all of the acid-treated kaolin samples fired at 1400$^{\circ}C$ for 40 hours, but AlN and SiC remained in the untreated kaolin sample. Z value of the ${\beta}$-sialon obtained from the 22% alumina containing kaolin sample fired at 1400$^{\circ}C$ for 40 hours was about 1.3(XRD) and 1.5(EDS). 2) Nitridation under 80N2+2OH2 mixed gas atmosphere with the C/SiO2 ratio of 1 Mullite was not found, but ${\alpha}$-Si3N4, and ${\beta}$-sialon were present in the reaction product of about 22% alumina containing kaolin sample fired at 1300$^{\circ}C$ for 10 hours. When untreated kaolin sample was nitridated at the same condition, mullite remained. AlN and SiC were not found in the reaction product of about 22% alumina containing kaolin sample fired at 1350$^{\circ}C$ for 5 hours. On the other hand, AlN and SiC remained in the product of untreated kaolin fired at the same condition.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.96.2-96.2
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• 2010

The surface morphology and structural properties of polycrystalline silicon (poly-Si) films made in-situ aluminum induced crystallization at various substrate temperature (300~600) was investigated. Silicon films were deposited by hot-wire chemical vapor deposition (HWCVD), as the catalytic or pyrolytic decomposition of precursor gases SiH4 occurs only on the surface of the heated wire. Aluminum films were deposited by DC magnetron sputtering at room temperature. continuous poly-Si films were achieved at low temperature. from cross-section TEM analyses, It was confirmed that poly-Si above $450^{\circ}C$ was successfully grown on and poly-Si films had (111) preferred orientation. As substrate temperature increases, Si(111)/Si(220) ratio was decreased. The electrical properties of poly-Si film were investigated by Hall effect measurement. Poly-Si film was p-type by Al and resistivity and hall effect mobility was affected by substrate temperature.

• Journal of the Korean Ceramic Society
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• v.26 no.2
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• pp.167-170
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• 1989

Al2O3/SiC composite-material was synthesized by the birth-spread mechanism through the carbothermal reduction reaction of SiO2 in Ha-Dong Kaolin with carbon powder under H2 gas atmosphere at 1300~140$0^{\circ}C$. Average diameter of synthesized SiC whiskers were 1${\mu}{\textrm}{m}$ and aspect ratio (c/a) was 10~100. Al2O3 particles and SiC whiskers were mixed homogeneously in the reacted pellet.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.367-380
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• 2013

In this paper, an analytical threshold voltage model is developed for a short-channel double-material-gate (DMG) strained-silicon (s-Si) on silicon-germanium ($Si_{1-X}Ge_X$) MOSFET structure. The proposed threshold voltage model is based on the so called virtual-cathode potential formulation. The virtual-cathode potential is taken as minimum channel potential along the transverse direction of the channel and is derived from two-dimensional (2D) potential distribution of channel region. The 2D channel potential is formulated by solving the 2D Poisson's equation with suitable boundary conditions in both the strained-Si layer and relaxed $Si_{1-X}Ge_X$ layer. The effects of a number of device parameters like the Ge mole fraction, Si film thickness and gate-length ratio have been considered on threshold voltage. Further, the drain induced barrier lowering (DIBL) has also been analyzed for gate-length ratio and amount of strain variations. The validity of the present 2D analytical model is verified with ATLAS$^{TM}$, a 2D device simulator from Silvaco Inc.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.100-100
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• 2000

Aluminium oxide (Al2O3) films have been investigated for many applications such as insulating materials, hard coatings, and diffusion barriers due to their attractive electrical and mechanical properties. In recent years, application of Al2O3 films for dielectric materials in integrated circuits as gates and capacitors has attracted much attention. Various deposition techniques such as sol-gel, metalorganic decomposition (MOD), sputtering, evaporation, metalorganic chemical vapor deposition (MOCVD), and pulsed laser ablation have been used to fabricate Al2O3 thin films. Among these techniques, reactive sputtering has been widely used due to its high deposition rate and easy control of film composition. It has been also reported that the sputtered Al2O3 films exhibit superior chemical stability and mechanical strength compared to the films fabricated by other processes. In this study, Al2O3 thin films were deposited on Pt/Ti/SiO/Si2 and Si substrates by DC reactive sputtering at room temperature with variation of the Ar/O2 ratio in sputtering ambient. Crystalline phase of the reactively sputtered films was characterized using X-ray diffractometry and the surface morphology of the films was observed with Scanning election microscopy. Effects of Th Ar/O2 ratio characteristics of Al2O3 films were investigated with emphasis on the thickness dependence of the dielectric properties. Correlation between the dielectric properties and the microstructure was also studied

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.314-314
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• 2008

The low temperature sintering and the dielectric properties of $Al_2O_3/SiO_2$-zinc borosilicate glass composites were investigated in the view of the application for LTCC. When the sintering was conducted at $900^{\circ}C$ $ZnAl_2O_4$ and $ZnB_2O_4$ compounds formed at the $Al_2O_3$-rich and the $SiO_2$-rich compositions, respectively. The reaction between ZBS glass and $Al_2O_3/SiO_2$ caused the formation of these compounds. The $Al_2O_3/SiO_2$ ratio affected the dielectric properties. The excellent dielectric properties, i.e., Q$\times$f value= 40,000 GHz and ${\varepsilon}_r$=4.5, were obtained in the $Al_2O_3/SiO_2$-ZBS glass system and fabricated the LTCC substrate materials.

• Journal of the Korean Ceramic Society
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• v.26 no.1
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• pp.13-20
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• 1989

After sintering Si3N4 containing 20wt% of variable composition ratio of Y2O3 and Al2O3 at 1$600^{\circ}C$, the specimens were annealed at 125$0^{\circ}C$ and 135$0^{\circ}C$ for 5, 10, 15 hours in order to crystallize the remanining oxynitride glass phases. The main grain-boundary crystalline phases in the Si3N4-Y2O3-Al2O3 system were melilite and YAG. By annealing 15hrs. at 125$0^{\circ}C$, almost all of the glasses were crystallized. During the growth of melilite, lattice volyume of $\beta$-Si3N4 was increased as Al3+ and O2- ions in the oxynitride glass diffuse into $\beta$-Si3N4 lattice, but during the growth of YAG, lattice volume of $\beta$-Si3N4 was decreased by reverse diffusion of Al3+ and O2- ions. In case of crystallization of glass phase to melilite, thermal expansion of sample was decreased, but in case of crystallization to YAG, inverse phenomen on was observed.

• Journal of Environmental Science International
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• v.22 no.9
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• pp.1097-1103
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• 2013

Tetrafluoromethane($CF_4$) have been widely used as etching and chemical vapor deposition gases for semiconductor manufacturing processes. $CF_4$ decomposition efficiency using microwave system was carried out as a function of the microwave power, the reaction temperature, and the quantity of $Al_2O_3$ addition. High reaction temperature and addition of $Al_2O_3$ increased the $CF_4$ removal efficiencies and the $CO_2/CF_4$ ratio. When the SA30 (SiC+30wt%$Al_2O_3$) and SA50 (SiC+50wt%$Al_2O_3$) were used, complete $CF_4$ removal was achieved at $1000^{\circ}C$. The $CF_4$ was reacted with $Al_2O_3$ and by-products such as $CO_2/CF_4$ and $AlF_3$ were produced. Significant amount of by-product such as $AlF_3$ was identified by X-ray powder diffraction analysis. It also showed that the ${\gamma}-Al_2O_3$ was transformed to ${\alpha}-Al_2O_3$ after microwave thermal reaction.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.162-162
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• 2017

AlCrN 코팅은 높은 경도, 낮은 표면 조도 등의 상온에서의 우수한 기계적 특성 이외에 고온에서 안정한 합금상의 형성으로 인하여 우수한 내열성을 보이는 코팅이며, Si을 첨가하여 나노복합구조를 갖는 AlCrSiN 코팅은 고경도 특성을 나타내는 나노결정립과 고내열성을 나타내는 $Si_3N_4$ 비정질이 동시에 존재함으로써 뛰어난 고온 특성까지 보유하여 공구 코팅으로의 적용 가능성이 크다. 본 연구에서는, 가혹화된 공구사용 환경 대응 하는 더욱 우수한 내마모성 및 내열성을 보이는 코팅막을 개발하기 위해 AlCrN/AlCrSiN 이중층 코팅을 합성하였다. 합성된 코팅의 구조 및 물성을 분석하기 위해 field emission scanning electron microscopy(FE-SEM), nano-indentation, atomic force microscopy(AFM) 및 ball-on-disk wear tester를 사용하였다. 내열성을 확인하기 위하여 코팅을 furnace에 넣어 500, 600, 700, 800, 900도에서 30분 동안 annealing한 후에 nano-indentation을 사용하여 경도를 측정을 하였다. 5:5, 7:3, 9:1의 두께 비율로 AlCrN/AlCrSiN 이중층 코팅을 합성하였으며 모든 코팅의 두께는 $3{\mu}m$로 제어되었다. AlCrN 코팅층의 두께가 증가할수록, 이중층 코팅의 경도 및 내마모성은 점차 향상되었지만 코팅의 밀착력은 감소하였다. 일반적으로 AlCrN 코팅은 상대적으로 높은 잔류응력을 갖고 있으므로, AlCrN 층의 두께비율이 증가함에 따라 코팅내의 잔류응력이 높아져 코팅의 경도는 증가하고 밀착특성은 낮아진 것으로 판단된다. AlCrSiN 상부층 공정시 기판 바이어스 전압을 -50 ~ -200V 로 증가시키면서 이중층 코팅을 합성하였다. XRD 분석 결과, 공정 바이어스 전압이 증가함에 따라 AlCrSiN 상부층은 점차 비정질화 되었고, 코팅의 경도와 표면 특성이 향상되는 것을 확인하였다. 이러한 특성 향상은 높은 바이어스 인가가 이온 충돌효과의 증가를 야기시켰으, 이로 인해 치밀한 코팅층 합성에 의한 결과로 판단된다. AlCrN/AlCrSiN 이중층 코팅을 어닐링 한 후 경도 분석 결과, -150, -200V에서 합성한 코팅은 900도 이상에서 26GPa 이상의 높은 경도를 보인 것으로 보아 우수한 내열성을 갖는 것으로 확인 되었다. 이는 AlCrSiN 상부층의 높은 Si 함량 (11at.%) 으로 인한 충분한 $Si_3N_4$ 비정질상의 형성과, 고바이어스 인가로 인한 AlCrN 결정상과 $Si_3N_4$ 비정질상의 고른 분배가 코팅의 내열성을 향상시키는데 기여를 한 결과로 판단된다.