• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.169.1-169.1
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• 2013

산업 및 기술의 발전에 의해 많은 신소재들이 개발되고 있다. 그 중에서 SiC는 고온재료, LED, 반도체 등의 우주선 표면재료, 핵융합로 구조재료, 고온 씰, 히터 등 여러 산업분야에서 관심을 가지면서 다양한 가스를 이용한 합성법이 개발되어 있다. 최근에는 분말의 형태 및 크기를 용도에 맞게 개발해서 사용하고 있는 상황이다. 그런데 각 합성법에 따른 합성원리에 대해서는 여러 가지 주장이 있다. 그 중에서 몇 가지 합성법에 대해서 고찰하고 합성의 원리를 추론한다. 그리고 그 중의 한 가지인 CH3SiCl3 가스를 이용한 SiC 나노분말 합성과 SiC의 결정성장 과정에서 나타나는 whisker의 형성을 확인했다. 정교한 SiC 분말합성은 일반적으로 sol-gel, 플라즈마(DC, AC 및 ICP 등) 등을 이용한 방법이 개발되어 있다. 이와 같이 정교한 SiC 나노분말 등은 실리콘 유기 화합물 중합체(trichloromethylsilane, polycarbosilane 등)의 열분해를 통해 합성 할 수 있으며, 열분해 는 약 1,000{\sim}1,500^{\circ}C의 온도 영역에서 일어난다. 이 과정에서 고분자의 열분해 및 재결합 이 동반되고 부산물로서 HCl, CH4 등의 유해가스를 같이 생성한다. 합성된 SiC 나노분말은 전형적인 ${\beta}-SiC$로 XRD의 관찰결과 (111), (220), (311)의 방향성을 갖는 것을 확인했으며 평균입자의 크기는 약 30 nm 정도다.

• Journal of the Korean Ceramic Society
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• v.31 no.3
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• pp.257-264
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• 1994

The objectives of this study were to develop the low pressure chemical vapor deposition(LPCVD) process of SiC and to fabricate pure and dense SiC layer onto graphite substrate at low temperature. The deposition experiments were performed using the MTS-H2 system (30 torr) in the deposition temperature ranging from 100$0^{\circ}C$ to 120$0^{\circ}C$. The deposition rate of SiC was increased with the temperature. The rate controlling step can be classified from calculated results of the apparent thermal activation energy as follows; surface reaction below 110$0^{\circ}C$ and gas phase diffusion through a stagnant layer over 110$0^{\circ}C$. The deposited layer was $\beta$-SiC with a preferred orientation of (111) and the strongly faceted SiC deposits were observed over 115$0^{\circ}C$.

• Journal of Power System Engineering
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• v.10 no.2
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• pp.111-116
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• 2006

Tribologcal property of the ceramics used in severe condition was investigated and both $Al_2O_3$ ball and Al/SiC composite made by thermal spray process[TSP] were used as a specimen in this study. Four kinds of material couple in ball and disk specimens were tested in the dry condition by using ball-on-disk type tribo-tester. Friction coefficient, surface roughness, wear rate, and photograph of the worn surface were investigated. Generally, High SiC contents[$40{\sim}50%$] specimens showed very low friction coefficient below 0.05 and little wear rate in dry condition. And also, low SiC contents[0%] specimens showed a moderate wear rate and high coefficient of friction at the same condition.

• Journal of Sensor Science and Technology
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• v.23 no.2
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• pp.73-81
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• 2014

Silicon PIN diode radiation sensors and CMOS readout circuits were designed and fabricated in this study. The PIN diodes were fabricated using a 380-${\mu}m$-thick 4-inch n+ Si (111) wafer containing a $2-k{\Omega}{\cdot}cm$ n- thin epitaxial layer. CMOS readout circuits employed the driving and signal processes in a radiation sensor were mixed with digital logic and analog input circuits. The primary functions of readout circuits are amplification of sensor signals and the generation of the alarm signals when radiation events occur. The radiation sensors and CMOS readout circuits were fabricated in the Institute of Semiconductor Fusion Technology (ISFT) semiconductor fabrication facilities located in Kyungpook National University. The performance of the readout circuit combined with the Si PIN diode sensor was demonstrated.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.138-143
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• 2004

Recently there has been a great world-wide interest in developing and characterizing new nano-structured materials. These newly developed materials are often prepared in limited quantities and shapes unsuitable for the extensive mechanical testing. The development of depth sensing indentation methods have introduced the advantage of load and depth measurement during the indentation cycle. In the present work, ZnO thin films are prepared on Si(111), Si(100) substrates at different temperatures by pulsed laser deposition(PLD) method. Because the potential energy in c-axis is low, the films always show c-axis orientation at the optimized conditions in spite of the different substrates. Thin films are investigated by X-ray diffractometer and Nano indentation equipment. From these measurements it is possible to get elastic modulus and hardness of ZnO thin films on Si substrates.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.111-112
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• 2007

Silicon nitride (SiN) 박막을 플라즈마 응용화학기상법을 이용하여 증착하였다. SiN박막의 전하밀도는 일반화된 회귀 신경망과 유전자 알고리즘을 이용하여 모델링하였다. PECVD 공정은 Box Wilson 실험계획표를 이용하여 수행하였다. $SiH_4$ 유량변화에 따른 온도의 영향은 미미하였다. 그러나, 저 전력에서의 온도증가 (또는 저온에서의 전력의 증가)에 따라 전하밀도는 급격히 상승하였으며, 이는 [N-H]의 증가에 기인하는 것으로 해석되었다. $SiH_4$ 유량의 증가 (또는 고온에서의 전력의 증가)에 따라 전하밀도는 감소하고 있으며, 이는 [Si-H]의 증가에 기인하는 것으로 이해된다.

• Journal of the Korean Magnetics Society
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• v.7 no.3
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• pp.152-158
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• 1997

NiFeCo/ Cu /Co trilayers were formed on 4$^{\circ}$ tilt-cut Si(111) substrates with a Cu(50$\AA$) underlayer and large-scaled test magnetoresistive RAM (MRAM) cells were fabricated using a conventional lithographic process. NiFeCo / Cu /Co trilayers deposited on the same templates without any applied magnetic field showed strong in plane uniaxial magnetic anisotropy and excellent magnetoresistive (MR) properties such as high MR ration and sensitivity within a low external magnetic field, which are suitable properties for a MRAM application. In order to obtain optimized MR results in NiFeCo /Cu /Co trilayers, the thickness of Cu spacer was varied. Interlayer coupling between two magnetic layers was observed and it was found that the MR properties were strongly dependent on the coupling force, especially near 20 $\AA$ of Cu spacer thickness. Test MRAM cells were fabricated using the optimized NiFeCo (60$\AA$)/ Cu (25$\AA$)/ Co (30$\AA$) trilayer thin films. With a 10 mA of sense current and 5$\times$$10^5$ of word current, 10 mV of signal output was obtained, which implies the strong potentials of NiFeCo/ Cu /Co trilayer thin films for a MRAM application.

• Journal of the Korean Chemical Society
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• v.34 no.5
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• pp.396-403
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• 1990

We describe how to design and construct a LPCVD (Low Pressure Chemical Vapor Deposition) apparatus which can be applicable to the study of reaction mechanism in general CVD experiments. With this apparatus we have attempted to make diamond like carbon films on the p-type (111) Si wafer from (H$_2$ ＋ CH$_4$) gas mixtures. Two different methods have been tried to get products. (1)The experiment was carried out in the reactor with two different inlet gas tubes. One coated with phosphoric acid was used for supplying microwave discharged hydrogen gas stream, and methane has been passed through the other tube without the microwave discharge. In this method we got only amorphous carbon cluster products. (2) The gas mixture (H$_2$ ＋ CH$_4$) has been passed through the discharge tube with the Si wafer located in and/or near the microwave plasma. In this case diamond-like carbon products could be obtained.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.79-79
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• 1999

The varous techniques for fabrication of si or metal tip as a field emission electron source have been reported due to great potential capabilities of flat panel display application. In this report, 240nm thermal oxide was initially grown at the p-type (100) (5-25 ohm-cm) 4 inch Si wafer and 310nm Si3N4 thin layer was deposited using low pressure chemical vapor deposition technique(LPCVD). The 2 micron size dot array was photolithographically patterned. The KOH anisotropic etching of the silicon substrate was utilized to provide V-groove formation. After formation of the V-groove shape, dry oxidation at 100$0^{\circ}C$ for 600 minutes was followed. In this procedure, the orientation dependent oxide growth was performed to have a etch-mask for dry etching. The thicknesses of the grown oxides on the (111) surface and on the (100) etch stop surface were found to be ~330nm and ~90nm, respectively. The reactive ion etching by 100 watt, 9 mtorr, 40 sccm Cl2 feed gas using inductively coupled plasma (ICP) system was performed in order to etch ~90nm SiO layer on the bottom of the etch stop and to etch the Si layer on the bottom. The 300 watt RF power was connected to the substrate in order to supply ~(-500)eV. The negative ion energy would enhance the directional anisotropic etching of the Cl2 RIE. After etching, remaining thickness of the oxide on the (111) was measured to be ~130nm by scanning electron microscopy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.2
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• pp.111-117
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• 2008

We have studied surface roughness, contamination of impurity, bonding with some gas element, reflectance and zeta potential on masks to be generated or changed during photolithography/dry or wet etching process. Mask surface roughness was not changed after photolithography/dry etching process. But surface roughness was changed on some area under MoSi film of Cr/MoSi/Qz. There was not detected any impurity on mask surface after plasma dry etching process. Reflectance of mask was increased after variable plasma etching treatment, especially when mask was treated with plasma including $O_2$ gas. Blank mask was positively charged when the mask was treated with Cr plasma etching gas($Cl_2:250$ sccm/He:20 $sccm/O_2:29$ seem, source power:100 W/bias power:20 W, 300 sec). But this positive charge was changed to negative charge when the mask was treated with $CF_4$ gas for MoSi plasma etching, resulting better wet cleaning. There was appeared with negative charge on MoSi/Qz mask treated with Cr plasma etching process condition, and this mask was measured with more negative after SC-1 wet cleaning process, resulting better wet cleaning. This mask was charged with positive after treatment with $O_2$ plasma again, resulting bad wet cleaning condition.