• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.1022-1025
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• 2005

The effect of substrate surface to the formation of ZnO nanostructures has been investigated using Si (111), $Al_2O_3$(C-plane) $Al_2O_3$(A-plane), and $Al_2O_3$(R-plane) substrates. The growth temperature was controlled from 500$^{\circ}C$ ${\sim}$ 600$^{\circ}C$, and the luminescence properties were investigated by a series of photoluminescence (PL) measurements at the elevating temperatures. ZnO nanostructures grown on Si substrate show strong UV emission intensity along with green emission positioned at 3.22 eV and 2.5 eV, respectively. However, green emission was not observed from the ZnO nanostructures grown on $Al_2O_3$ substrates. It is explained in terms of the difference of the surface energy between Si and $Al_2O_3$. Also, the origin of UV emissions has been discussed by using the temperature-dependent PL. The distinction of the PL spectra is interpreted in terms of the difference of the impurity included in the nanostructures.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.1034-1037
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• 2005

The variation of shapes and related properties of ZnO nanostructures grown on the metal pattern and Si substrate have been investigated. Ni, Cr metal patterns were formed on Si (111) substrates by e-beam evaporation, and ZnO nanostructures were fabricated on it by using thermal evaporation of Zn powder in air. Growth temperature was controlled from 500 $^{\circ}$C to 700 $^{\circ}$C. When the growth temperature was relatively low, no considerable effect was found. However, UV emission intensity decreased, and Green-emission intensity, which is regarded as originated from the defect state in the ZnO nanostructure, increased as growth temperature increase. Also, the variation of nanostructure shape at high temperature (700 $^{\circ}$C) is understood in terms of the enhanced incorporation of metal vapor during the nanostructure formation.

• Journal of the Korean Ceramic Society
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• v.26 no.1
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• pp.139-145
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• 1989

An eutectic melt in the system(Bi2O3)0.85·(Nb2O5)0.15-6Bi2O3·SiO2 was unidirectionally solidfield at a rate of 0.5mm/h under a thermal gradient of 100℃/cm. Double crucibles and seed crystal plate were used in order to botain the composite crystals which had uniform microstructure throughout the ingot. The obtained composite crystals showed uniform microstructure, in which needle-like δ-(Bi2O3)0.85·(Nb2O5)0.15 crystals were arrayed in parallel in a matrix of γ-6Bi2O3·SiO2 single crystal. It was found that the <110> direction of δ-(Bi2O3)0.85·(Nb2O5)0.15 crystal was essentially parallel to the <111> direction of γ-6Bi2O3·SiO2 crystal in the composite crystals. A transverse thin plate of the composite crystals showed a high resolution optical transmission like an optical fiber array, and sharp chatoyancy was observed in the cabochon shaped composite crystals. Then, this may be useful for applications such as screen of a cathode ray tube or artificial cat's eye gem stones.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.645-648
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• 2010

The structure and morphology of epitaxial layer defects in epitaxial Si wafers produced by the Czochralski method were studied using focused ion beam (FIB) milling, scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Epitaxial growth was carried out in a horizontal reactor at atmospheric pressure. The p-type Si wafers were loaded into the reactor at about $800^{\circ}C$ and heated to about $1150^{\circ}C$ in $H_2$. An epitaxial layer with a thickness of $4{\mu}m$ was grown at a temperature of 1080-$1100^{\circ}C$. Octahedral void defects, the inner walls of which were covered with a 2-4 nm-thick oxide, were surrounded mainly by $\{111\}$ planes. The formation of octahedral void defects was closely related to the agglomeration of vacancies during the growth process. Cross-sectional TEM observation suggests that the carbon impurities might possibly be related to the formation of oxide defects, considering that some kinds of carbon impurities remain on the Si surface during oxidation. In addition, carbon and oxygen impurities might play a crucial role in the formation of void defects during growth of the epitaxial layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.1
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• pp.26-32
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• 2003

Then-channel poly-Si thin-film transistors (poly-Si TFT's) formed by solid phase crystallization (SPC) method on glass were measured to obtain the electrical parameters such as of I-V characteristics, mobility, leakage current, threshold voltage, and subthreshold slope. Then, devices were analyzed to obtain the reliability and appliability on TFT-LCD with large-size and high density. In n-channel poly-Si TFT with 5$\mu\textrm{m}$/2$\mu\textrm{m}$, 8$\mu\textrm{m}$, 30$\mu\textrm{m}$ devices of channel width/length, the field effect mobilities are 111, 116, 125 $\textrm{cm}^2$/V-s and leakage currents are 0.6, 0.1, and 0.02 pA/$\mu\textrm{m}$, respectively. Low threshold voltage and subthreshold slope, and good ON-OFF ratio are shown, as well. Thus. the poly-Si TFT's used by SPC are expected to be applied on TFT-LCD with large-size and high density, which can integrate the display panel and peripheral circuit on a targe glass substrate.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.895-905
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• 1994

The solid phase crystallization behavior of undoped amorphous $Si_{1-x}Ge_{x}$ (X=O to 0.53) alloyfilms was studied by X-ray diffractometry(XRD) and transmission electron microscopy(TEM). Thefilms were deposited on thermally oxidized 5" (100) Si wafer by MBE(Mo1ecular Beam Epitaxy) at 300'C and annealed in the temperature range of $500^{\circ}C$ ~ $625^{\circ}C$. From XRD results, it was found that the thermal budget for full crystallization of the film is significantly reduced as the Ge concentration in thefilm is increased. In addition, the results also shows that pure amorphous Si film crystallizes with astrong (111) texture while the $Si_{1-x}Ge_{x}$ alloy film crystallzes with a (311) texture suggesting that the solidphase crystallization mechanism is changed by the incorporation of Ge. TEM analysis of the crystallized filmshow that the grain morphology of the pure Si is an elliptical and/or a dendrite shape with high density ofcrystalline defects in the grains while that of the $Si_{0.47}Ge_{0.53}$ alloy is more or less equiaxed shape with muchlower density of defects. From these results, we conclude that the crystallization mechanism changes fromtwin-assisted growth mode to random growth mode as the Ge cocentration is increased.ocentration is increased.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.62-62
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• 2003

금속-실리콘간 화합물인 실리사이드 중에서, 코발트다이실리사이드(CoSi$_2$)는 비저항이 낮고 선폭이 좁아짐에 따라 면저항이 급격히 증가하는 선폭의존성이 없으며 화학적으로 안정한 재료로 현재 널리 이용되고 있는 재료이다. 또한, 실리콘 (100) 기판과 에피택셜하게 성장한 CoSi$_2$는 우수한 열안정성 과 낮은 juction leakage의 특성을 가지며, shallow junction 형성을 가능하게 하는 많은 장점을 가지고 있어 각광받고 있다. 그러나 순수한 Co의 증착 후속 열처리에 의해 형성된 CoSi$_2$는 (110), (111), (221)등의 다양한 결정방위를 가지게 되어 에피택셜 하게 형성되기 어렵다. 현재까지 Ti, Ta, Zr과 화학 산화막 등의 확산 방지막을 이용하여 에피 택셜하게 성장시키는 많은 방법들이 연구되어 왔으며, 최근에는 본 연구실에서 반응성화학기상증착법으로 Co-C 박막을 증착하여 in-Situ로 에피택셜 CoSi$_2$를 형성하는 새로운 방법을 보고하였다. 본 연구는 반응성 스퍼터링에 의해 증착된 Co-N 박박으로부터 후속 열처리를 통하여 에피택셜 CoSi$_2$를 성장시키는 새로운 방법을 제시하고자 한다. Co-N 박박은 Ar과 $N_2$의 혼합가스 분위기 속에서 Co를 스퍼터링하여 증착하였다. 증착시 혼합가스 내의 $N_2$함량의 변화에 따라 다양한 Co-N 박막이 형성됨을 확인하였다. 후속열처리시 Co-N 박막의 산화를 방지하기 위하여 Ti층을 마그네트론 스퍼터링으로 증착하였으며, Ar 분위기에서 온도에 따른 ex-situ RTA 열처리를 통하여 에피택셜 CoSi$_2$를 성장시킬 수 있었다. 이러한 에피택셜 CoSi$_2$는 특정 한 Ar/$N_2$ 비율 내에서 성장이 가능하였으며, 약 $600^{\circ}C$이상의 열처리 온도에서 관찰되었다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.12A
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• pp.2002-2007
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• 1999

In this paper, the n-channel poly-Si thin-film transistors (poly-Si TFT's) formed by solid phase crystallization (SPC) on glass were investigated by measuring the electrical properties of poly-Si films, such as I-V characteristics, mobility, leakage current, threshold voltage, and subthreshold slope. It is done to decide to be applied on TFT-LCD with large-size and high density. In n-channel poly-Si TFT with 2, 10, 25$\mu\textrm{m}$ of channel length, the field effect mobilities are 111, 126 and 125 $\textrm{cm}^2$/V-s and leakage currents are 0.6, 0.1, and 0.02 pA/$\mu\textrm{m}$, respectively. Low threshold voltage and subthreshold slope, and good ON-OFF ratio are shown, as well. Thus, the poly-Si TFT’s used by SPC are expected to be applied on TFT-LCD with large-size and high density, which can integrate display panel and peripheral circuit on a large glass substrate.

• Composites Research
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• v.31 no.2
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• pp.43-50
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• 2018

The effects of deposition temperature on chemical vapor deposited silicon carbide (CVD-SiC) were studied to obtain high deposition rates and excellent bending strength characteristics. Silicon carbide prepared at $1250{\sim}1400^{\circ}C$ using methyltrichlorosilane(MTS : $CH_3SiCl_3$) by hot-wall CVD showed deposition rates of $95.7{\sim}117.2{\mu}m/hr$. The rate-limiting reaction showed the surface reaction at less than $1300^{\circ}C$, and the mass transfer dominant region at higher temperature. The activation energies calculated by Arrhenius plot were 11.26 kcal/mole and 4.47 kcal/mole, respectively. The surface morphology by the deposition temperature changed from $1250^{\circ}C$ pebble to $1300^{\circ}C$ facet structure and multi-facet structure at above $1350^{\circ}C$. The cross sectional microstructures were columnar at below $1300^{\circ}C$ and isometric at above $1350^{\circ}C$. The crystal phases were all identified as ${\beta}$-SiC, but (220) peak was observed from $1300^{\circ}C$ or higher at $1250^{\circ}C$ (111) and completely changed to (220) at $1400^{\circ}C$. The bending strength showed the maximum value at $1350^{\circ}C$ as densification increased at high temperatures and the microstructure changed from columnar to isometric. On the other hand, at $1400^{\circ}C$, the increasing of grain size and the direction of crystal growth were completely changed from (111) to (220), which is the closest packing face, so the bending strength value seems to have decreased.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.6
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• pp.254-261
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• 2010

Polycrystalline silicon (pc-Si) films are fabricated and characterized for application to pc-Si thin film solar cells as a seed layer. The amorphous silicon films are crystallized by the aluminum-induced layer exchange (ALILE) process with a structure of glass/Al/$Al_2O_3$/a-Si using various thicknesses of $Al_2O_3$ layers. In order to investigate the effects of the oxide layer on the crystallization of the amorphous silicon films, such as the crystalline film detects and the crystal grain size, the $Al_2O_3$ layer thickness arc varied from native oxide to 50 nm. As the results, the defects of the poly crystalline films are increased with the increase of $Al_2O_3$ layer thickness, whereas the grain size and crystallinity are decreased. In this experiments, obtained the average pc-Si sub-grain size was about $10\;{\mu}m$ at relatively thin $Al_2O_3$ layer thickness (${\leq}$ 16 nm). The preferential orientation of pc-Si sub-grain was <111>.