• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.234-239
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• 2007

This paper describes the TiW ohmic contact characteristics under the surface treatment of the polycrystalline 3C-SiC thin film grown on $SiO_2/Si(100)$ wafers by APCVD. The poly 3C-SiC surface was polished by using CMP(chemical mechanical polishing) process and then oxidized by wet-oxidation process, and finally removed SiC oxide layers. A TiW thin film as a metalization process was deposited on the surface treated poly 3C-SiC layer and was annealed through a RTA(rapid thermal annealing) process. TiW/poly 3C-SiC was investigated to get mechanical, physical, and electrical characteristics using SEM, XRD, XPS, AFM, optical microscope, I-V characteristic, and four-point probe, respectively. Contact resistivity of the surface treated 3C-SiC was measured as the lowest $1.2{\times}10^{-5}{\Omega}cm^2$ at $900^{\circ}C$ for 45 sec. Therefore, the surface treatments of poly 3C-SiC are necessary to get better contact resistance for extreme environment MEMS applications.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권3호
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• pp.111-116
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• 2004

The Ni/SiC Schottky diode was fabricated with the $\alpha$-SiC thin film grown by the ICP-CVD method on a (111) Si wafer. $\alpha$-SiC film has been grown on a carbonized Si layer in which the Si surface was chemically converted to a very thin SiC layer achieved using an ICP-CVD method at $700^{\circ}C$. To reduce defects between the Si and $\alpha$-SiC, the surface of the Si wafer was slightly carbonized. The film characteristics of $\alpha$-SiC were investigated by employing TEM (Transmission Electron Microscopy) and FT-IR (Fourier Transform Infrared Spectroscopy). Sputterd Ni thin film was used as the anode metal. The boundary status of the Ni/SiC contact was investigated by AES (Auger Electron Spectroscopy) as a function of the annealing temperature. It is shown that the ohmic contact could be acquired beyond a 100$0^{\circ}C$ annealing temperature. The forward voltage drop at 100A/cm was I.0V. The breakdown voltage of the Ni/$\alpha$-SiC Schottky diode was 545 V, which is five times larger than the ideal breakdown voltage of the silicon device. As well, the dependence of barrier height on temperature was observed. The barrier height from C- V characteristics was higher than those from I-V.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.211-211
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• 2012

Using spin-polarized density-functional theory calculations, we find that the existence of either Peierls instability or antiferromagnetic spin ordering is sensitive to hydrogen passivation near the step. As hydrogens are covered on the terrace, the dangling bond electrons are localized at the step, leading to step-induced states. We investigate the competition between charge and spin orderings in dangling-bond (DB) wires of increasing lengths fabricated on an H-terminated vicinal Si(001) surface. We find antiferromagnetic (AF) ordering to be energetically much more favorable than charge ordering. The energy preference of AF ordering shrinks in an oscillatory way as the wire length increases. This oscillatory behavior can be interpreted in terms of quantum size effects as the DB electrons fill discrete quantum levels.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 춘계학술발표회 논문집
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• pp.213-213
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• 2012

In this study, effect of EB-PVD coated Si/HA film thickness on surface characteristics of Ti-35Nb-10Zr alloy was investigated. The Ti-35Nb-10Zr alloy was fabricated by arc melting method. The Si/HA layers were coated with 0.8 wt.% of Si in pure HA by EB-PVD method. The coating thickness was consisted with 100 - 300 nm for each group, the surface characteristics was analyzed by FE-SEM, EDS, XRD, XRF and corrosion test. The Si/HA coating layer was well deposited on the alloy surface by EB-PVD, the thickness was correlative factor with HA peaks and corrosion resistance value.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 디스플레이 광소자분야
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• pp.90-93
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• 2004

In this work, we have used different techniques for the surface passivation: conventional thermal oxidation (CTO), rapid thermal oxidation (RTO), and plasma-enhanced chemical vapour deposition (PECVD). The surface passivation qualities of eight different single and combined double layer have been investigated both on the phosphorus non-diffused p-type FZ silicon and on phosphorus diffused emitter of 100 ${\Omega}/Sq$ and 40 ${\Omega}/Sq$. In the single layer, silicon dioxide $(SiO_2)$ passivates good on the emitter while silicon nitride (SiN) passivates better than on the non-diffused surface. In the double layers, CTO/SiN1 passivates very well both on non-diffused surface on the emitter. However, RTO/SiN1 and RTO/SiN2 stacks are more suitable for surface passivation in solar cells caused by a relatively good passivation qualities and the low optical reflection. Applying these stacks in solar cells we achieved 18.5 % and 18.8 % on 0.5 ${\Omega}$ cm FZ-Si with planar and textured front surface, respectively. The excellent open circuit voltage $(V_{oc})$ of 675.6 mV is obtained the planar cell with RTO/SiN stack.

• Bulletin of the Korean Chemical Society
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• 제16권11호
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• pp.1028-1032
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• 1995

The structure and electronic properties of the Si(100) surface is studied using the atom superposition and electron delocalization method. The energy released when the symmetric dimer surface is reconstructed to form the buckled dimer surface with p(2X2) symmetry is calculated to be 0.99 eV per dimer in the case of ideal clean surfaces. This indicates that the surface dimer buckling is intrinsic from the viewpoint of thermodynamics. The relaxation energy, when water is adsorbed on the clean symmetric dimer surface to form the buckled dimer surface, is 2.25 eV per dimer for appropriate coverages. These results show that H2O molecule could induce a reconstruction of the surface structure through adsorption. The buckling of the surface dimer is, therefore, more favorable under the existence of water vapour. This conclusion supports the recently obtained experimental observations by Chander et al.

• 대한전자공학회논문지SD
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• 제41권3호
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• pp.9-14
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• 2004

본 논문에서는 압저항 압력센서 응용을 위한 최적의 멤브레인 구조를 만들기 위하여 tetramethylammonium hydroxide (TMAH)/ammonium persulfate (AP)/isopropyl alcoho 1(IPA) 용액의 Si 이방성 식각 특성을 연구하였다. 독성이 적고 CMOS 공정과의 높은 호환성 때문에 TMAH를 Si 이방성 식각용액으로 사용하였다. 식각온도, TMAH농도 및 식각시간에 따른 Si 식각률의 변화를 측정하였다. 식각온도를 증가 시키고 TMAH농도를 감소시킴에 따라 Si 식각률은 증가한 반면에 (100)면에 hillock 이 생겨 식각표면의 평탄도가 감소하였다. TMAH 에 IPA 용액을 첨가하면 식각표면의 평탄도를 증가 시키나 Si의 식각률을 감소 시켰다. 그러나, TMAH 에 AP 용액을 첨가하면 Si의 식각률과 식각표면의 평탄도 모두를 증가시켰다. 또한 시간당의 AP 첨가 횟수를 증가시킴으로서 Si 식각률을 최대화시킬 수 있었다. TMAH/AP 용액의 최적의 Si 식각조건을 적용하여 한변의 길이가 100∼400㎛이고 두께가 20㎛인 정사각형 모양의 Si 멤브레인을 성공적으로 제작하였다.

• Bulletin of the Korean Chemical Society
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• 제30권8호
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• pp.1805-1810
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• 2009

The adsorptions of trimethygallium (TMG) and arsine (As$H_3$) on H/Si(100)-2x1 surface were theoretically investigated. In the case of TMG adsorption, methane loss reaction, surface methylation, hydrogen loss reaction and ring closing reaction channels were found. The mechanism of As$H_3$ adsorption on the surface was also identified. Among these, the methane loss reaction depositing –Ga(C$H_3)_2$ was found to be the major channel due to its low barrier height and the large exothermicity. The surface methylation reaction is the second most favorable channel. In contrast, arsine turned out to be less reactive on the surface, implying that Arsine surface reaction would be the rate limiting step in the overall ALD process.

• 한국정밀공학회지
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• 제21권5호
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• pp.24-31
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• 2004

Masking effect of the nanoscratched silicon (100) surface was studied and applied to a maskless nanofabrication technique. First, the surface of the silicon (100) was machined by ductile-regime nanomachining process using the scratch option of the Nanoindenter${ \circledR}$ XP. To clarify the possibility of the nanoscratched silicon surfaces for the application to wet etching mask, the etching characteristic with a KOH solution was evaluated at room temperature. After the etching process, the convex nanostructures were made due to the masking effect of the mechanically affected layer. Moreover, the height and the width of convex structures were controlled with varying normal loads during nanoscratch.

• 대한전자공학회논문지
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• 제22권4호
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• pp.92-100
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• 1985

P형 Si기판에 N에피층을 성장시키고 Si-AR막 계면에서 고정양전하밀도(Qss)를 높임으로써 전지의 에미터 표면영역을 N'전하축적층으로 나타낸 새로운 형태의 N'N/P HLE 태':1전지 를 제 작하였다. 제작된 전지의 종류로는 AR막으로 SiOr층을 이용한 OCI전지와 Si,N,/sioxynitride층을 이응한 NCI전지로 구분하였다. 전지의 AR막내 Qss분포는 커패시턴스-전압 측정을 통해 조사하였으며 이로부터 NCI전 al (Qss=1.79~ 1.84$\times$1011cm-2) 가 OCI전 지 (Qss=3.03~ 4.40$\times$1011cm-1) 에 비 해 로면 전 하축 적 층 이 효과적 으로 나타남을 알 수 있었다. JCR할로겐 램프로 100mW/cm2의 인공조명을 만들어 효율특성을 분석한 결과 유효수광면적에 대한 평균(최대)변환효율이 OCI전지에서 15.18(15.46)%, NCI전지에서 16.31(17.07%)로 나타났다.