• 한국신뢰성학회지:신뢰성응용연구
• /
• 제14권3호
• /
• pp.169-175
• /
• 2014

In this paper, the evaluating test methods of the fire and the electric shock on the Electric pad using the house is proposed. We analyzed electric pad using magnetic shielded type hot wire because electric pad using the magnetic shielded type hot wire generally be used in the home. We analyzed FMEA in order to analyze the mechanism of the fire and the electric shock of the electric pad and designed testing methods (Durability tests on the environment, Mechanical durability tests, Electrical durability tests) obtained through the two-step QFD and tested. We verified the evaluating test methods of the fire and the electric shock on the Electric pad using the house through the analysis of the test results.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제15권3호
• /
• pp.163-169
• /
• 2015

In this paper, the evaluating test methods of the fire and the electric shock on the led lamp supply using the house is proposed. We analyzed FMEA in order to analyze the mechanism of the fire and the electric shock of the led lamp supply and designed durability tests on the environment ($85^{\circ}C$, 85% R.H.) and obtained through the two-step QFD and tested. We verified the evaluating test methods of the fire and the electric shock on the led lamp supply using the house through the analysis of the test results.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제15권1호
• /
• pp.60-66
• /
• 2015

In this paper, The infrastructure case for reproduction or analysis of the mechanism on the fire or the electrics shock of the electrical appliances is proposed. The various electrical appliances(Washing machine, Ballast, Electric heaters, Electronic switches, Mobile phone chargers) used in the home can be tested on the high voltage and over current test through the implementation of the infrastructure. The electrical tests of fire and electric shock consists of the high voltage of maximum 5000 V and over current test of 3 steps(90 A, 60 A, 40 A) and noise test. The mechanism of the fire and the electric shock tests reproduced are analyzed through the monitoring system and the oscilloscope. The electronics manufacturers can prevent accidents through the tests of the electronics factor reproduced and the analysis of the infrastructure designed.

• 대한금속재료학회지
• /
• 제47권12호
• /
• pp.842-851
• /
• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• 대한금속재료학회지
• /
• 제47권8호
• /
• pp.500-507
• /
• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• 마이크로전자및패키징학회지
• /
• 제18권3호
• /
• pp.45-52
• /
• 2011

Flip Chip Ball Grid Array (FCBGA) 패키지의 솔더조인트 신뢰성을 평가하기 위한 방법으로는 다이 충격법, 다이 전단법, 3점 굽힘법, 열충격법 등이 활용된다. 본 연구에서는 솔더 접합부의 주요 고장메카니즘인 취성파괴를 확인하기 위한 방법으로 리플로우 상태, $85^{\circ}C$/85%RH 처리, $150^{\circ}C$/10hr 에이징의 처리한 후, 4가지 평가법으로 평가를 진행하여 파단모드를 분석하였다. 본 연구결과에서는 다이 충격법과 다이 전단법의 Good joint rate (GJR, %)는 리플로우 상태와 $85^{\circ}C$/85%RH처리에서 각각 89~91%와 100% 였으며, $150^{\circ}C$/10hr 에이징에서는 66%와 90%를 나타내었다. 3점 굽힘법과 열충격법의 GJR(%)는 3종류 샘플에서 모두 100%를 나타내어 변별력이 없었다. C4 솔더접합부의 신뢰성 평가법에 따른 GJR(%)의 변별력을 확인할 수 있는 방법은 die shock 과 die shear test였다.

• Journal of Welding and Joining
• /
• 제24권6호
• /
• pp.21-27
• /
• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• 한국안전학회지
• /
• 제20권2호
• /
• pp.61-66
• /
• 2005

This paper presents an human reliability assessment(HRA) for a installation task of the temporary power cable in construction fields. HRA is evolved to ensure that the workers could reliably perform critical tasks such as a process of the temporary power cable. Human errors are extremely commonplace, with almost everyone committing at least some errors every day. The considerable parts of electric shock accidents in the construction field are caused by a series of human errors. Therefore it is required to analyze the human errors contained in the task causing electric shock event, the event tree analysis(ETA) is adopted in this paper, and particularly human reliability was estimated for a installation task of the temporary power cables. It was assumed that the error probabilities of the human actions may be obtained using the technique for human error rate prediction(THERP). The results show that the predominant task on reliability in the cable installation tasks is check-out tasks and the probability causing electric shock by human errors was calculated as $1.0\times10^{-9}$.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1995년도 추계학술대회 논문집
• /
• pp.942-946
• /
• 1995

Using database obtained by means of experiments, or using the synamic behaviour analysis program of automotive shock absorber, database system is constructed within the limits of adequate reliability. Thus constructed data base can be used to find out corresponding specification of shock absorber design parameters to the required damping ability and tolerance.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
• /
• pp.89-98
• /
• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.