• Journal of Conservation Science
• /
• v.25 no.3
• /
• pp.293-298
• /
• 2009

We fabricated the gap-filling material for antic-ceramics restoration which were made up polyvinyl butyral (butvar) base and silane system additive in iso-propyl solvent. This was made hardness control possible that user want. And it have very strong adhesion and shear strength properties and is shown the best properties for pigment filling, anti-contractibility, coloring as like epoxy system materials. Particularly, the yellowing and ir-reversibility problem in Epoxy restoration material were finally steadiness. So, there is guarantee in the eternity and stabilization of restoration for antic-celamics. And in order to show the reversible state of the restoration, we successfully dissolve this polyvinyl butyral gap-filling materials in solvent after perfect restoring the Punchong plate from sam-chun temple site subsequently.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2004.04a
• /
• pp.182-185
• /
• 2004

In this work, the effect of chemical treatments on surface properties of SiC was investigated in mechanical interfacial properties of carbon fibers-reinforced composites. The surface properties of the SiC were determined by acid/base values and contact angles. The thermal stabilities of carbon fibers-reinforced composites were investigated by thermogravimetric analysis (TGA). Also, the mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical strain energy release rate mode II $(G_{IIC})$ measurements. As a result, tile acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). According to the contact angle measurements, it was observed that chemical treatments led to an increase of surface free energy of the SiC surfaces, mainly due to the increase of the specific (polar) component. The mechanical interfacial properties of the composites, including ILSS and $(G_{IIC})$, had been improved in the specimens treated by chemical solutions. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between SiC and epoxy resin matrix.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.9 no.2
• /
• pp.117-126
• /
• 2021

An experimental study was carried out to investigate the applicability of cement-based materials for green soil which is a soil for promoting plant growth. The results show that the shear strength of the green soil mixed with gypsum cement (No.3) was low, but the hardness (23.6mm) and pH value (7.4) was most suitable for the vegetation environment. In addition, the initial vegetation germination of green soil, which improved performance by adding a moisturizer, was slower than that of general green soil, and the conductivity value tended to be slightly higher. On the other hand, the slope adhesion of advanced green soil was high, and it was found that the plant growth rate and the regeneration capacity were superior after time passed.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.2 s.43
• /
• pp.49-57
• /
• 2007

Au-Sn solder alloy were deposited in multilayer and co-sputtered film by rf-magnetron sputter and the composition control and analysis were studied. For the alloy deposition condition, each components of Au or Sn were deposited separately. On the basis of pure Sn and Au deposition, the deposition condition for Au-Sn solder alloy were set up. As variables, the substrate temperature, the rf-power, and the thickness ratio were used for the optimum composition. For multilayer solder alloy, the roughness and the composition of solder alloy were controlled more accurately at the higher substrate temperature. In contrast, for co-sputtered solder, the substrate temperature influenced little to the composition, but the composition could be controlled easily by rf-power. In addition, the co-sputtered solder film mostly consisted of intermetallic compound, which formed during deposition. The compound were confirmed by XRD. Without flux during bonding of solder alloy film on leadframe, the adhesion strength were measured. The maximum shear stress was $330(N/mm^2)$ for multilayer solder with Au 10wt% and $460(N/mm^2)$ for co-sputtered solder with Au 5wt%.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.34 no.2
• /
• pp.155-164
• /
• 2014

Carbon-fiber-reinforced plastic (CFRP) composites are increasingly being used in a variety of industry applications, such as aircraft, automobiles, and ships because of their high specific stiffness and high specific strength. Aircraft are exposed to high temperatures and high humidity for a long duration during flights. CFRP materials of the aircraft can absorb water, which could decrease the adhesion strength of these materials and cause their volumes to change with variation in internal stress. Therefore, it is necessary to estimate the characteristics of CFRP composites under actual conditions from the viewpoint of aircraft safety. In this study air-coupled ultrasonic testing (ACUT) was applied to the evaluation of water absorption properties of CFRP composites. CFRP specimens were fabricated and immersed in distilled water at $75^{\circ}C$ for 30, 60, and 120 days, after which their ultrasonic images were obtained by ACUT. The water absorption properties were determined by quantitatively analyzing the changes in ultrasonic signals. Further, shear strength was applied to the specimens to verify the changes in their mechanical properties for water absorption.

• Journal of Adhesion and Interface
• /
• v.15 no.3
• /
• pp.100-108
• /
• 2014

In this work, a series of molar ratios composed with YD-128 and DDM were chosen based on the viscosity analysis. The mixtures of YD-128 and DDM with the different molar ratios were cured at $170^{\circ}C$ for 15 min followed by post cure at $190^{\circ}C$ for two hours. The thermal properties of the cured samples were investigated with DSC, TGA, DMA, and TMA. The conversion ratio of the mixtures of YD-128 and DDM (1 : 1.1) was calculated by dividing ${\Delta}H$ obtained from DSC experiments for each cured sample by ${\Delta}H$. The TGA data of the cured samples showed that the thermal stability and thermal degradation activation energy were proportional to the amount of DDM in the mixtures. However, the highest tan ${\delta}$, and the lowest thermal expansion data with DMA and TMA respectively were obtained from the stoichiometric mixture of YD-128 and DDM. Furthermore, the different ratio of mixtures were applied to test specimens to be cured at $170^{\circ}C$ to measure single lap shear strength with universal testing machine.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.3
• /
• pp.37-42
• /
• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• Journal of the Korean Wood Science and Technology
• /
• v.45 no.5
• /
• pp.559-571
• /
• 2017

This study was conducted to determine the adhesive performances of plywoods affected by layering direction and the amounts of thermoplastic films. The face and back layers of veneer were hardwood species (Mixed light hardwood) and core layer veneer was radiata pine (Pinus radiata D. Don). Thermoplastic film used as adhesive were polypropylene (PP) film and polyethylene (PE) film. Thermal analysis and tensile strength were investigated on each films. As a result, the melting temperature of PP and PE films were $163.4^{\circ}C$ and $109.7^{\circ}C$, respectively, and the crystallization temperature were $98.9^{\circ}C$ and $93.6^{\circ}C$, respectively. Tensile strength and elongation of each films appeared higher on the width direction than length direction. Considering the characteristics of the thermoplastic films, the test for the amount of film used was carried out by layering film to the target thickness on veneer. The effecting of layering direction of film on plywood manufacturing was conducted by laminating in the length and width directions of the film according to the grain direction of veneer. Tensile-shear strength of plywood in wet condition was satisfied with the quality standard (0.7 MPa) of KS F 3101 when the film was used over 0.05 mm of PP film and over 0.10 mm of PE film. Tensile-shear strength of plywood after cyclic boiling exceeded the KS standard when PP film was used 0.20 mm thickness. Furthermore, higher bonding strength was observed on a plywood made with width direction of film according to grain direction of veneer than that of length direction of film. Based on microscopic analysis of the surface and bonding line of plywood, interlocking between veneers by penetration of a thermoplastic film into inner and cracks were observed.

• The Journal of Korean Academy of Prosthodontics
• /
• v.34 no.4
• /
• pp.791-799
• /
• 1996

The purpose of this study was to compare the shear bond strength of adhesion bridge by various resin cements. One hundred and foully 1st premolars were used. The teeth were cut below 2mm from CEJ and the coronal portions were used. The coronal portions were embeded with the acrylic resin and trimmed with sic paper until the flat plane with ${\phi}$ 4mm above acrylic resin sticks in height 5mm were casted with nonprecious metal and the using surfaces were treated with sic paper from #200 to #1200 and polished with alminum oxide paste. And then, the using surfaces were sandblasted and treated with the electrochemical etching. The teeth were divided into three groups of fourty two each. In group I, teeth and specimens were cemented with Panavia 21 In group II, teeth and specimens were cemented with Superbond In group I, teeth and specimens were cemented with All-Bond & composite resin cement Each group was subdivided into three subgroups according to the storage period ; one-day storage, fifteen-day storage, and thirty-day storage. The special jig was made. Then, the specimen and jig were mounted to Instron Universal Testing Machine and the failure were measured. The results were as follows. 1. There was statisfically significant difference between the failure loads of group I and group II and III after one day storage(P<0.01), 2. There was statisfically significant difference between the failure loads of group II and group I and III and between group I and group III at fifteen day storage(P<0.01). 3. There was statisfically significant difference between the failure loads of group I and II and group III after thirty day storage(P<0.01). 4. There was statisfically significant difference between the failure loads of one day storage and fifteen and thirty days storages in group III (P<0.01).

• Journal of the Korean Society for Nondestructive Testing
• /
• v.32 no.4
• /
• pp.393-400
• /
• 2012

In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.