• Journal of the Korean Chemical Society
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• v.45 no.6
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• pp.555-561
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• 2001

Vinyl acetate usually used in PVA resin preparation was converted to PVAc by bulk polymerization using AIBN as a initiator and PVA was synthesized by changing the concentration of NaOH added for saponification subsequently. As a result of estimating molecular weight using GPC, molecular weight increased as the NaOH concentration increased to 2.5 N, 5.0 N, 7.5 N and 10.0 N and polydispersity had similar values of 2.1~2.3, however, showed slightly decreasing tendency. In addition, PVA saponificated by 10.0 N-NaOH showed high syndiotacticity in observation of tacticity using NMR spectroscopy. From this fact, the degree of tacticity was predicted to be high and it was in good agreement with the tendency of polydispersity by GPC. Also, from the result of FT-IR spectroscopy, it might be known that hydrolysis was more promoted in the PVA with 10.0 N-NaOH than other NaOH concentration. Intrinsic viscosity measured using Ubbelohde viscometer, which increased as the concentration of NaOH added for saponification increased. The change of shear strength with the change of shear rate was investigated using Brookfield viscometer, in consequence, viscosity of PVA synthesized decreased as shear rate increased. PVA solution confirmed to show the shear thining behavior by Casson plot and PVA with 10.0 N-NaOH had the largest yield value. DSC measurement was performed to know the thermal properties of PVA. Tp had nearly constant value of 214$^{\circ}C$ in all cases except for adding 2.5 N-NaOH and $\Delta$H was increased as the concentration of NaOH increased. From this properties, it was concluded that the degree of hydrogen bonding was proportional to the added concentration of NaOH and the increase of the degree of hydrogen bonding and hydrophobic interaction could affect the rheological and thermal properties of title compound.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.2
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• pp.245-265
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• 1991

The purpose of this study was to observe the changes of the elemental transmission and bond strength between the metal and porcelain according to various kinds of ion beam mixing method. ion beam mixing of $meta1/SiO_2$ (silica), $meta1/Al_2O_3$(alumina) interfaces causes reactions when the $Ar^+$ was implanted into bilayer thin films using a 100KeV accelerator which was designed and constructed for this study. A vacuum evaporator used in the $10^{-5}-10^{-6}$ Torr vacuum states for the evaporation. For this study, three kinds of porcelain metal selected, -precious, semiprecious, and non-precious. Silica and alumina were deposited to the metal by the vacuum evaporator, separately. One group was treated by two kinds of dose of the ion beam mixing $(1\times10^{16}ions/cm^2,\;5\times10^{15}ions/cm^2)$, and the other group was not mixed, and analyzed the effects of ion beam mixing. The analyses of bond strength, elemental transmissions were performed by the electron spectroscopy of chemical analysis (ESCA), light and scanning electron microscope, scratch test, and micro Vickers hardness tests. The finding led to the following conclusions. 1. In the scanning electron and light microscopic views, ion beam mixed specimens showed the ion beam mixed indentation. 2. In the micro Vickers hardness and scratch tests, ion beam mixed specimens showed higher strength than that of non mixed specimens, however, nonprecious metal showed a little change in the bond strength between mixed and non mixed specimens. 3. In the scratch test, ion beam mixed specimens showed higher shear strength than that of non treated specimens at the precious and semiprecious groups. 4. In the ESCA analysis, Au-O and Au-Si compounds were formed and transmission of the Au peak was found ion beam mixed $SiO_2/Au$ specimen, simultaneously, in the higher and lower bonded areas, and ion beam mixed $SiO_2/Ni-Cr$ specimen, oxygen, that was transmitted from $SiO_2\;to\;SiO_2/Ni-Cr$ interface combined with 12% of Ni at the interface.

• Journal of the korean academy of Pediatric Dentistry
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• v.31 no.1
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• pp.66-78
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• 2004

The objective of this study was to apply the vibration technique to reduce the viscosity of bonding adhesives and thereby compare the bond strength and resin penetration in enamel and dentin achieved with those gained using the conventional technique and vibration technique. For enamel specimens, thirty teeth were sectioned mesio-distally. Sectioned two parts were assigned to same adhesive system but different treatment(vibration vs. non-vibration). Each specimen was embedded in 1-inch inner diameter PVC pipe with a acrylic resin. The buccal and lingual surfaces were placed so that the tooth and the embedding medium were at the same level. The samples were subsequently polished silicon carbide abrasive papers. Each adhesive system was applied according to its manufacture's instruction. Vibration groups were additionally vibrated for 15 seconds before curing. For dentin specimen, except removing the coronal part and placing occlusal surface at the mold level, the remaining procedures were same as enamel specimen. Resin composite(Z250. 3M. U.S.A.) was condensed on to the prepared surface in two increments using a mold kit(Ultradent Inc., U.S.A.). Each increments was light cured for 40 seconds. After 24 hours in tap water at room temperature, the specimens were thermocycled for 1000cycles. Shear bond strengths were measured with a universal testing machine(Instron 4465, England). To investigate infiltration patterns of adhesive materials, the surface of specimens was examined with scanning electron microscope. The results were as follows: 1. In enamel the mean values of shear bond strengths in vibration groups(group 2, 4, 6) were greater than those of non-vibration group(group 1, 3, 5). The differences were statistically significant except AQ bond group. 2. In dentin, the mean values of shear bond strengths in vibration groups(group 2, 4, 6) were greater than those of non-vibration groups(group 1, 3, 5). But the differences were not statistically significant except One-Up Bond F group. 3. The vibration group showed more mineral loss in enamel and longer resin tag and greater number of lateral branches in dentin under SEM examination.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of Adhesion and Interface
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• v.16 no.2
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• pp.69-75
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• 2015

Stone board for the rock bed was needed to reduce weight using thin thickness and reinforced materials. In this work, stone/wood board for rock bed was studied. Stone and wood were attached to reduce total weight of stone for rock bed. For reinforcing wood heat treatment method was used to change surface and mechanical properties. Mechanical strength of heat treated wood increased more than neat condition. The optimum heat treatment condition was set on $100^{\circ}C$ under tensile, flexural loads whereas surface energy was also obtained by contact angle measurement. Optimum adhesive condition was to get the maximum adhesion between stone and wood. Lap shear test was performed for stone/wood board with different adhesives such as amine type epoxy, polyurethane, chloro-rubber and vinyl chloride acetate type. Fracture surface of lap shear test was shown at wood fracture part on stone using amine type epoxy adhesive. It was found that for high adhesion between stone and wood the optimum adhesive was epoxy type for the rock bed.

• Journal of the Korean Wood Science and Technology
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• v.38 no.4
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• pp.316-322
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• 2010

The research attempted to develop a wood adhesive based on waste cooking oil, using ozonification technology for the chemical structure modification. The waste cooking oil (WCO) was reacted with $O_3$ for different times; 1 h, 2 h, and 3 h. The chemical structure modifications of the ozonized WCOs were examined by Fourier transform Infrared (FT-IR) spectrum. The FT-IR spectrum of WCO had an absorbance peak at 3,010 $cm^{-1}$ that was the characteristic peak of the unsaturated double bonds. As ozone treatment time increased, the peak of the double bond was disappeared and carboxyl peak appeared at 1,700 $cm^{-1}$. Especially, the double bond of 3 hrs-ozonized WCO was vanished almost. In results of the dry bonding strengths of the 3 hrs-ozonized WCO mixed with polymeric methylene diphenyl diisocyanate (pMDI) were the strengths of weight ratio of 3hrs-ozonized WCO : pMDI, 1 : 0.5, 8.08 kgf/$cm^2$, 1 : 0.75, 9.53 kgf/$cm^2$ 1 : 1, 44.16 kgf/$cm^2$, 1 : 2, 58.08 kgf/$cm^2$, 1 : 3, 61.41 kgf/$cm^2$, and 1 : 4, 46.95 kgf/$cm^2$. Therefore, it was found that the optimum equivalent ratio was formed at the ratio of 1 : 2 or 1 : 3. Under wetting the bonding strength of 1 : 3 ratio was appeared higher than that of 1 : 2 ratio, while the results obtained from hot-water and cyclic boiling shear test were similar.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.41-48
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• 2010

To improve the pot life of one-part in-house anisotropic conductive paste (ACP) formulations, 2-methyl imidazole curing accelerator powders were encapsulated with five agents. Through measuring the melting point of the five agents using DSC, it was confirmed that a encapsulation process with liquid-state agents is possible. Viscosity of ACP formulations containing the encapsulated imidazole powders was measured as a function of storage time from viscosity measurements. As a result, pot life of the formulations containing imidazole powders encapsulated with stearic acid and carnauba wax was improved, and these formulations indicated similar curing behaviors to a basic formulation containing rare imidazole. However, the bondlines made of these formulations exhibited low average shear strength values of about 37% level in comparison with the basic formulation.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Composites Research
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• v.30 no.3
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• pp.215-222
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• 2017

The effect of a multi walled carbon nanotubes (MWNCT) on the adhesive properties and thermal properties of epoxy were studied by double lap-shear tests. Epoxy/MWCNT resins were prepared from a different amount of the MWCNT incorporated into the epoxy resins (araldite 2011). Steel plates and carbon fiber reinforced plastics (CFRP) were chosen as materials. Mechanical tests were performed by a universal testing machine (UTM). The analysis of thermal properties were conducted by a thermogravimetric analyzer (TGA) and a differential scanning calorimetry (DSC). The fracture surface morphology was examined using a scanning electron microscopy (SEM) and optical microscope. Compared to neat epoxy, it was found that the mechanical properties of epoxy/MWCNT resins are increased.

• Journal of Korean Society of Steel Construction
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• v.18 no.5
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• pp.633-642
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• 2006

Serviceability design is required to control the cracking at the joint of precast decks with longitudinal prestress in continuous composite bridges. Details of twin-girder bridges are especially complex not only due to their main reinforcements and transverse prestresses for the design of long-span concrete slabs, but also due to the shear pockets for obtaining the composite action. This paper suggests the design guidelines for the magnitude of the effective prestress and for the selection of filling materials and their requirements that would allow for the use of precast decks for twin-girder continuous composite bridges. The necessary initial prestress was also evaluated through long-term behavior analysis. From the analysis, existing design examples were revised and their effectiveness was estimated. When a filling material with a bonding strength higher than the requirement is used in the region of a high negative moment, a uniform configuration of the longitudinal prestressing steels along thewhole span length of continuous composite bridges can be achieved, which would result in the simplification of the details and the reduction of the construction costs.