• Title/Summary/Keyword: Sensor Packaging

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Packaging MEMS, The Great Challenge of the $21^{st}$ Century

  • Bauer, Charles-E.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.29-33
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    • 2000
  • MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than $9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

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Fabrication of Fluorescent Oxygen Sensor Probe Module Based on Planner Lightwave Circuits using UV Imprint Lithography (UV 임프린트 공정을 이용한 평면 광회로 기반 형광 산소 센서 프로브 모듈 제작)

  • Ahn, Ki Do;Oh, Seung hun
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.3
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    • pp.37-41
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    • 2018
  • This paper presents the integrated fluorescent oxygen sensor probe module based on planner lightwave circuits using UV imprint lithography. The oxygen sensor system is consisted of the optical source part, optical detector part and optical sensing probe part to be composed of the planner lightwave circuit and oxygen sensitive thin film layer. Firstly, we optimally designed the planner lightwave circuit with asymmetric $1{\times}2$ beam splitter using beam propagation method. Then, we fabricated the planner lightwave circuits using UV imprint lithography process. This planner lightwave circuits transmitted the optical power with 76% efficiency and the fluorescence signal with 70% efficiency. The oxygen sensitive thin film layer is coated on the end face of planner lightwave circuit. The oxygen sensor system using this sensor probe module with planner lightwave circuit could measure the concentration with 0.3% resolution from 0% to 20% gas range. This optical oxygen sensor probe module make it possible to compact, simple and cheap measurement system.

Development of silicon based flexible tactile sensor array mounted on flexible PCB (연성회로기판에 실장된 실리콘 기반의 유연 촉각센서 어레이 제작 및 평가)

  • Kim, K.N.;Kim, Y.K.;Lee, K.R.;Cho, W.S.;Lee, D.S.;Cho, N.K.;Kim, W.H.;Park, J.H.;Kim, S.W.;Ju, B.K.
    • Journal of Sensor Science and Technology
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    • v.15 no.4
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    • pp.277-283
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    • 2006
  • We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.

Vacuum Packaging of MEMS (Microelectromechanical System) Devices using LTCC (Low Temperature Co-fired Ceramic) Technology (LTCC 기술을 이용한 MEMS 소자 진공 패키징)

  • 전종인;최혜정;김광성;이영범;김무영;임채임;황건탁;문제도;최원재
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.31-38
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    • 2003
  • In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

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Evaluation of Signal Stability of Fiber Optic Sensors with respect to Sensor Packaging Methods in Long-Term Monitoring (장기 모니터링 환경에서 센서 패키징 방법에 따른 광섬유 센서의 신호 안정성 평가)

  • Kang, Donghoon;Kim, Heon-Young;Kim, Dae-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.36 no.4
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    • pp.281-287
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    • 2016
  • Fiber Bragg grating (FBG) sensors are applied in structural health monitoring (SHM) in various application fields because of their ease of multiplexing and capability of performing absolute measurements. Moreover, the packaging methods of FBG sensors accelerate their commercialization rapidly. However, long-term SHM exposes the FBG sensors to cyclic thermal loads, and a investigation is required because it finally leads to the signal instability of the FBG sensors. In this study, the effects of sensor packaging methods two methods are generally used for the FBGs: (bonding both sides of the FBG or bonding the FBG directly on signal stability of FBG sensors are investigated. Tests are conducted on specimens in a thermal chamber, over a temperature range from $-20^{\circ}C$ to $60^{\circ}C$ for 300 cycles. Signal characteristics such as Bragg wavelength, light intensity and full width at half maximum are examined and are compared with those of the FBG sensors, obtained in a previous study under direct bonding conditions. From the comparison, it is observed that the FBG sensors with bonding on both sides of the FBG demonstrate higher signal stabilities when exposed to cyclic thermal loads during long-term SHM. Consequently, it guarantees more effectiveness when packaging the FBG sensors.

Development of Semiconductor Packaging Technology using Dicing Die Attach Film

  • Keunhoi, Kim;Kyoung Min, Kim;Tae Hyun, Kim;Yeeun, Na
    • Journal of Sensor Science and Technology
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    • v.31 no.6
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    • pp.361-365
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    • 2022
  • Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

Interference Effects on the Thickness of a Pulse Pressure Sensor Array Coated with Silicone (맥 센서 어레이(array)의 실리콘(silicone) 코팅 두께에 따른 센서 간 간섭효과)

  • Jun, Min-Ho;Jeon, Young Ju;Kim, Young-Min
    • Journal of Sensor Science and Technology
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    • v.25 no.1
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    • pp.35-40
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    • 2016
  • Pulse diagnosis is one of the representative diagnostic methods in Oriental medicine. In this study, a pulse pressure sensor array coated with silicone, which includes 6 piezo-resistive sensors and 1 thermistor, is fabricated for pulse measurement. It is necessary to coat the pulse sensor array with silicone to avoid the fracture or damage of pressure sensors when the sensor is in contact with the skin and a constant pressure is applied. However, the silicone coating on the pulse sensor array can cause signal interference among the sensors in the pulse sensor array. The interference number (IN), a calculation for expressing the degree of interference among channels, is changed according to the silicone thickness on the pulse sensor array. The IN is increased by a thick silicone coating, but the fabrication error, an important index for the mass production of the sensor array, is reduced by the thickness of the silicone coating. We propose that the thickness of the silicone on the pulse sensor array is an important consideration for the performance of the fabricated sensor and manufacturing repeatability.

[ $NO_2$ ] Gas Sensing Characteristics of Carbon Nanotubes (탄소 나노튜브를 이용한 이산화질소 감지 센서의 특성)

  • Lee R. Y.
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.3 s.36
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    • pp.227-233
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    • 2005
  • Carbon nanotubes (CNT) which were grown, on the alumina substrate with a pair of comb-type Au electrodes, by plasma enhanced chemical vapor deposition have been investigated for $NO_2$ gas sensor. The electrical resistance of CNT film decreased with temperature, indicating a semiconductor type of CNT, and also the resistance of CNT sensor decreased with increasing $NO_2$ concentration. Upon exposure to $NO_2$ gas, the electrical resistance of CNT film sensor rapidly decreased within 3 minutes, and then showed a constant value after $20\~30$ minutes. It is found that the sensitivity of CNT sensor has been improved by air oxidation. The CNT sensor oxidized at $450^{\circ}C$ for 30 minutes showed higher sensitivity value than that without oxidation by $27\%$, even for a low 250 ppb $NO_2$ concentration at operating temperature of $200^{\circ}C$. But it needs a recovery time more than 20 minutes for reuse after detection of $NO_2$ gas.

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Sensitivity Improvement of 3-D Hall Sensor using Anisotropic Etching and Ni/Fe Thin Films (트랜치 구조를 갖는 3차원 홀 센서의 감도 개선에 관한 연구)

  • 이지연;최채형
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.17-23
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    • 2001
  • The 3-D Hall sensor has two horizontal magnetic field sensing parts ($\chi$, y components) and one vertical magnetic field sensing part (z component). For conventional, 3-D Hall sensor it is general that the sensitivity for $B_{z}$ is about 1/10 compared with those for $B_\chi$ or $B_y$. Therefore, in this work, we proposed 3-D Hall sensor with new structure. We have increased the sensitivity about 6 times to form the trench using anisotropic etching. And we have increased the sensitivity for the $B_z$ by 80% compared with those of $B_\chi$ and$B_y$ using deposition of the ferromagnetic thin films on the bottom surface of the wafer to concentrate the magnetic fluxes. When the input current was 3 mA, sensitivities of the fabricated sensor with Ni/Fe film for $B_\chi, B_y$ and $B_{z}$ were measured as 120.1 mV/T, 111.7 mV/T, 95.3 mV/T, respectively. The measured linearity of the sensor was within $\pm$3% of error.

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Overview on Smart Sensor Technology for Biometrics in IoT Era (사물인터넷 시대의 생체인식 스마트 센서 기술과 연구 동향)

  • Kim, Kwang-Seok;Kim, Dae Up
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.2
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    • pp.29-35
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    • 2016
  • With the pace of rapid innovation in technology of IoT (Internet of Things) and smart devices, biometric technology becomes one of the most progressive industries. Recent trends in biometrics show most are focused on embedding biometric sensors in mobile devices for user authentication. Multifactor biometrics such as fingerprint, retina, voice, etc. are considering as identification system to provide users with services more secured and convenient. Here we, therefore, demonstrate some major technologies and market trends of mobile biometric technology with its concerns and issues.