• Title/Summary/Keyword: Sensor Data Process

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Development of Wireless Measurement System for Bridge Using PDA and Fiber Optical Sensor (PDA와 광섬유 센서를 이용한 교량의 무선계측 시스템 개발)

  • Kwak, Kae-Hwan;Hwang, Hae-Sung;Jang, Hwa-Sup;Kim, Woo-Jong;Kim, Hoi-OK
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.13 no.1 s.53
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    • pp.88-96
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    • 2009
  • This study proposes a wireless measurement system that is a new safety management system by using an FBG sensor and a PDA. The sensor part has many advantages of implementing a wireless measurement system, and the study emploies an FBG-LVDT sensor, FBG-STRAIN sensor, FBG-TEMP sensor, and FBG-ACC sensor, using FBG sensors. Also, the study show a configuration of a signal process system for operating a wireless transmission system of FBG sensors applied to the signal process system, and engrafted the cutting edge information technology industry in order to display from a remote distance using a PDA. In order to verify the applicability of the developed FBG sensors and wireless measurement monitoring system to the field, their accuracy, and usability, the study has conducted a static and dynamic test to a bridge in the field. The study made an assessment of service for the vibration of the bridge by applying dynamic data measured by an FBG-LVDT sensor and FBG-ACC sensor to Meister's curve and prepared methods for assessing the vibration of the bridge by proposing a standard of vibration limitation given the service of vibration of the bridge. As a follow up for this study, it would be necessary to set up an overall model for the standard of service assessment established in this study.

A Framework for Internet of Things (IoT) Data Management

  • Kim, Kyung-Chang
    • Journal of the Korea Society of Computer and Information
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    • v.24 no.3
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    • pp.159-166
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    • 2019
  • The collection and manipulation of Internet of Things (IoT) data is increasing at a fast pace and its importance is recognized in every sector of our society. For efficient utilization of IoT data, the vast and varied IoT data needs to be reliable and meaningful. In this paper, we propose an IoT framework to realize this need. The IoT framework is based on a four layer IoT architecture onto which context aware computing technology is applied. If the collected IoT data is unreliable it cannot be used for its intended purpose and the whole service using the data must be abandoned. In this paper, we include techniques to remove uncertainty in the early stage of IoT data capture and collection resulting in reliable data. Since the data coming out of the various IoT devices have different formats, it is important to convert them into a standard format before further processing, We propose the RDF format to be the standard format for all IoT data. In addition, it is not feasible to process all captured Iot data from the sensor devices. In order to decide which data to process and understand, we propose to use contexts and reasoning based on these contexts. For reasoning, we propose to use standard AI and statistical techniques. We also propose an experiment environment that can be used to develop an IoT application to realize the IoT framework.

THE DESIGN OF U-GIS CONVERGENCE MIDDLEWARE

  • Jang, In-Sung;Kim, Min-Soo;Lee, Young-Jun
    • Proceedings of the KSRS Conference
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    • 2008.10a
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    • pp.115-118
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    • 2008
  • Traditionally, Geographical Information System can only process static spatial data, which include geometries and attributes. Recently, According to Special attention is paid to ubiquitous computing environment, we require a u-GIS convergence middleware to efficiently process ubiquitous data and improves the existing GIS engine in order to enable converged processing of spatial and sensor data. So, in this study, we propose a design of u-GIS Convergence Middleware, which are based on the integration between GIS and USN technologies

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A Study on injection mold shrinkage estimates (사출 금형 수축률 산정에 관한 연구)

  • Choi, Gwang-Hyeck;Han, Seong-Ryeol;Lee, Chun-Kyu
    • Design & Manufacturing
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    • v.10 no.3
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    • pp.30-33
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    • 2016
  • It is true that the plastic shrinkage is inevitable. Shrinkage rate in effect at the time of mold design will soon determine the size of the global product. Process for the shrinkage of the plastic that provides how made, yet it has identified a process for making the question whether the shrinkage that can be trusted, and by the experimental results were as follows: as shrinkage, see ISO but, according to circumstances the process can go to the agreement between the parties. shrinkage ratio of the pressure sensor installed in the specimen mold is essential, amount of pressure sensor is that it is appropriate approximately 2-3. proper holding pressure is a significant effect on shrinkage Mitch, so that the effect of selecting the contraction ratio data according to the appropriate holding pressure during mold making. shrinkage CAE analysis results are difficult to utilize in the mold-making chamber. Based on these results, it concluded by looking forward to the improved products produced shrinkage.

A Study of Data correction method when in-situ end point detection in Chemical-Mechanical Polishing of Copper Overlay (구리 박막 CMP의 실시간 end point detection을 위한 데이터 정밀도 개선 방법에 관한 연구)

  • Kim, Nam-Woo;Hur, Chang-Wu
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.18 no.6
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    • pp.1401-1406
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    • 2014
  • Knowledge of the manufacturing process of semiconductor devices in order to obtain a copper pattern using chemical mechanical polishing (CMP) planarization using a Wafer polishing process is applied with a thickness of the copper measured in real time, which need to be precisely controlled by, where the acquisition the actual thickness of the sensor value with the calculated value in terms of error can occur in the process. Approximated the actual measurement values so as to obtain a method using a simple average, moving average, compared to the results using filters onggo Strom real-time measurements of the thickness of the units of the control system to reduce the variation in the implementation of the method described for the.

The Dry Etching of TiN Thin Films Using Inductively Coupled CF4/Ar Plasma

  • Woo, Jong-Chang;Choi, Chang-Auck;Joo, Young-Hee;Kim, Han-Soo;Kim, Chang-Il
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.2
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    • pp.67-70
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    • 2013
  • In this study, we changed the input parameters (gas mixing ratio, RF power, DC bias voltage, and process pressure), and then monitored the effect on TiN etch rate and selectivity with $SiO_2$. When the RF power, DC-bias voltage, and process pressure were fixed at 700 W, - 150 V, and 15 mTorr, the etch rate of TiN increased with increasing $CF_4$ content from 0 to 20 % in $CF_4$/Ar plasma. The TiN etch rate reached maximum at 20% $CF_4$ addition. As RF power, DC bias voltage, and process pressure increased, all ranges of etch rates for TiN thin films showed increasing trends. The analysis of x-ray photoelectron spectroscopy (XPS) was carried out to investigate the chemical reactions between the surfaces of TiN and etch species. Based on experimental data, ion-assisted chemical etching was proposed as the main etch mechanism for TiN thin films in $CF_4$/Ar plasma.

Study on Upward Machining of Inclined Surface by Ball-End Milling (볼 엔드밀에 의한 경사면 상방향 절삭가공에 관한 연구)

  • Jeong, Jin-Woo;Bae, Eun-Jin;Kim, Sang Hyun;Wang, Duck Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.4
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    • pp.87-93
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    • 2021
  • The mold industry is competitive, and mold should be processed under optimal conditions for efficient processing. However, the cutting conditions of the ball-end mill, which are a major factor in mold processing, are mostly set empirically, and considerable research is required for increasing the tool life and processing accuracy. In this study, a tool dynamometer and an eddy current sensor were used along with NI-DAQ, a data acquisition device, to obtain characteristic values of the cutting force and tool deformation during the ball end-mill machining of inclined surfaces at a machining center. The cutting force and tool deformation were measured in an experiment. It was found that the tool received the greatest cutting force at the end of the machining process, and the deformation of the tool increased rapidly. Furthermore, the cutting force tended to increase with the angle and number of rotations. The deformation increased rapidly during the machining of a 45° inclined surface.

An Energy Efficient Query Processing Mechanism using Cache Filtering in Cluster-based Wireless Sensor Networks (클러스터 기반 WSN에서 캐시 필터링을 이용한 에너지 효율적인 질의처리 기법)

  • Lee, Kwang-Won;Hwang, Yoon-Cheol;Oh, Ryum-Duck
    • Journal of the Korea Society of Computer and Information
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    • v.15 no.8
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    • pp.149-156
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    • 2010
  • As following the development of the USN technology, sensor node used in sensor network has capability of quick data process and storage to support efficient network configuration is enabled. In addition, tree-based structure was transformed to cluster in the construction of sensor network. However, query processing based on existing tree structure could be inefficient under the cluster-based network. In this paper, we suggest energy efficient query processing mechanism using filtering through data attribute classification in cluster-based sensor network. The suggestion mechanism use advantage of cluster-based network so reduce energy of query processing and designed more intelligent query dissemination. And, we prove excellence of energy efficient side with MATLab.

Design of a CMOS Image Sensor Based on a Low Power Single-Slope ADC (저전력 Single-Slope ADC를 사용한 CMOS 이미지 센서의 설계)

  • Kwon, Hyuk-Bin;Kim, Dae-Yun;Song, Min-Kyu
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.2
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    • pp.20-27
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    • 2011
  • A CMOS Image Sensor(CIS) mounted on mobile appliances always needs a low power consumption because of the battery life cycle. In this paper, we propose novel power reduction techniques such as a data flip-flop circuit with leakage current elimination, a low power single slope A/D converter with a novel comparator, and etc. Based on 0.13um CMOS process, the chip satisfies QVGA resolution($320{\times}240$ pixels) whose pitch is 2.25um and whose structure is 4-Tr active pixel sensor. From the experimental results, the ADC in the middle of CIS has a 10-b resolution, the operating speed of CIS is 16 frame/s, and the power dissipation is 25mW at 3.3V(Analog)/1.8V(Digital) power supply. When we compare the proposed CIS with conventional ones, the power consumption is reduced approximately by 22% in sleep mode, 20% in operating mode.

Distributed IoT Sensor based Laboratory Safety Management System (분산 IoT센서 기반 실험실 안전관리 시스템)

  • Jeong, Daejin;Kim, Jaeyoon;Bae, Sangjung;Jung, Hoekyung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.23 no.1
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    • pp.90-96
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    • 2019
  • Storage cabinet in a lab in these days measures various environmental factors in real-time with IoT sensors. Preexisting system collects sensor data, analyze a risk and then command other equipment. Such centralized control system tends to have an issue with of speed slowing down. It's because when there are more storage cabinets, there are more data to process. In order to solve this issue, this report addresses decentralized IoT sensor based lab safety control system. It can analyze internal state of storage cabinet to identify any hazardous situations and effectively control them. Such decentralized control system using sensor modules for internal environment of the cabinet storage and automated control algorithm based on administrator's log history can manage any hazardous situations by automated control of environment factors of inside a lab. It would allow users to deal with a hazard if it happens. Even better, it can prevent it to happen from the beginning.