• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1600-1604
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• The Journal of Korea Robotics Society
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• v.3 no.3
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• pp.226-236
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• 2008

In this paper, control software architecture is designed to enable a heterogeneous multiple humanoid robot demonstration executing tasks cooperating with each other. In the heterogeneous humanoid robot team, one large humanoid robot and two small humanoid robots are included. For the efficient and reliable information sharing between many software components for humanoid control, sensing and planning, CORBA based software framework is applied. The humanoid tasks are given in terms of finite state diagram based human-robot interface, which is interpreted into the XML based languages defining the details of the humanoid mission. A state transition is triggered based on the event which is described in terms of conditions on the sensor measurements such as robot locations and the external vision system. In the demonstration of the heterogeneous humanoid team, the task of multiple humanoid cleaning the table is given to the humanoid robots and successfully executed based on the given state diagram.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2502-2507
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• 2003

In this paper, a crack sealing robot is developed. The crack sealing robot is built to detect, track, and seal the crack on the pavement. The sealing robot is required to brush all dirt in the crack out for preparing a better sealing job. Camera calibration has been done to get accurate crack position. In order to perform a cleaning job, the explicit force control method is used to regulate a specified desired force in order to maintain constant contact with the ground. Experimental studies of force tracking control are conducted under unknown environment stiffness and location. Crack tracking control is performed. Force tracking results are excellent and the robot finds and tracks the crack very well.

• Journal of Sensor Science and Technology
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• v.25 no.3
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• pp.213-217
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• 2016

The superhydrophobic and superoleophobic meshes surfaces have been used in various applications such as self-cleaning, anti-icing, gas exchange, oil-water separation, sound-wave penetrable anti-wetting structures, etc. In particular, there are many studies for oil-water separation with environmental issues. Because of high pressure and dynamic environment, oil-water separation filters must have stable surface properties as super-hydrophobicity and superoleophobicity. The oleophobicity of surface depends on the surface chemistry and roughness of the surface. The roughness of oleophobic surface enhances its static contact angle and stability. The multi-scale hierarchical structure provides a stable superhydrophobic state by maintaining a Cassie state. In this research, we fabricated a superoleophobic mesh with a multi-scale hierarchical structure to increase the pressure resistance and adjusted a size of the mesh hole.

• Journal of Sensor Science and Technology
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• v.29 no.4
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• pp.227-231
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• 2020

Silver nanowire random networks are promising candidates for replacing indium tin oxide (ITO) as transparent and conductive electrodes. They can also be used as transparent heating films with self-cleaning and defogging properties. By virtue of the Joule heating effect, silver nanowire random networks can be heated when voltage bias is applied; however, they are unsuitable for long-term use. In this work, we study the Joule heating of silver nanowire random networks embedded in polymers. Silver nanowire random networks embedded in polymers exhibit breakdown under the application of electric current. Their surface morphological changes indicate that nanoparticle formation may be the main cause of this electrical breakdown. Numerical analyses are used to investigate the temperatures of the silver nanowire and substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.93-96
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• Journal of Sensor Science and Technology
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• v.15 no.4
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• pp.245-250
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• 2006

In this paper, glass cap wafer for MEMS device package is fabricated by using sand blaster dry etcher and Its surface is studied. The surface of dry etched glass is analyzed by using SEM, and many glass particles and micro cracks are observed. If these kind of particles were dropped from glass to the surface of device, It would make critical failure to the operation of device. So, several cleaning and etching methods are induced to remove these kinds of dormant failure mode and optimized condition is found out.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.184-187
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) lyaer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2-CMP$ process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis or used slurry.

• IEMEK Journal of Embedded Systems and Applications
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• v.14 no.3
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• pp.151-156
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• 2019

According to recent advances in technology, major robot technologies that have been developed and commercialized for industrial use are being applied to various fields in our everyday life such as guide robots and cleaning robots. Among them, the navigation based on the self localization has become an essential element technology of the robot. In the case of indoor environment, many high-priced sensors are used, which makes it difficult to activate the robot industry. In this paper, we propose a robotic platform and a moving algorithm that can travel by using Dijkstra algorithm. The proposed system can find a short route to the destination with its own position. Also, its performance is discussed through the experimentation of an actual robot.