• Transactions on Electrical and Electronic Materials
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• v.14 no.5
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• pp.254-257
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• 2013

In-situ optical emission spectroscopy (OES) is employed for PECVD chamber monitoring. OES is used as an addon sensor to monitoring and cleaning end point detection (EPD). On monitoring plasma chemistry using OES, the process gas and by-product gas are simultaneously monitored. Principal component analysis (PCA) enhances the capability of end point detection using OES data. Through chamber cleaning monitoring using OES, cleaning time is reduced by 53%, in general. Therefore, the gas usage of fluorine is also reduced, so satisfying Green Fab challenge in semiconductor manufacturing.

• Proceedings of the KIEE Conference
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• 2006.10c
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• pp.533-535
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• 2006

Cleaning robot that is selling in present city has various cleaning algorithm. However, error of most products happens on progress direction by small obstacle that do not properly and miss cleaning thereby happens. There is robot that correct own position, but is hard to use in general home because economical strain is very big because is high price product very. In this paper measures angular velocity of robot using deviation sensor, and do to correct error using turning angular velocity and vertical angular velocity. Because detailed cleaning such as high pice style is available without addition of expensive hardware in middle and low price style cleaning product thereby, can possess price competitive power.

• Journal of Advanced Navigation Technology
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• v.24 no.5
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• pp.343-347
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• 2020

This paper presents the development of a software for tracking the location of objects in the water and for creating a three-dimensional hull map. The objective of this software, as a software for underwater hull cleaning robot, is to map the location of underwater hull cleaning robot and to locate the position of sensor by identifying the shaded area of acoustic communication. For the software designed for mapping the location of cleaning robot in the water, the height and intensity were applied as variables for underwater ultrasonic communication. The software for creating a three-dimensional hull was developed by OpenGL using scanned lines from a blueprint of a ship. This software can help identifying the location of underwater hull cleaning robot without actual visibility and can be used to maintain a stable communication status by locating the position of sensor by easily spotting the shaded area of acoustic communication caused by the curved area of the bottom of the ship.

• Journal of Korean Society for Quality Management
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• v.30 no.2
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• pp.72-85
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• 2002

Advances in computer and sensor technology have made it possible to obtain superlarge manufacturing process data in real time, letting us extract meaningful information from these superlarge data sets. We propose a systematic data analysis procedure which field engineers can apply easily to manufacture quality products. The procedure consists of data cleaning and data analysis stages. Data cleaning stage is to construct a database suitable for statistical analysis from the original superlarge manufacturing process data. In the data analysis stage, we suggest a graphical easy-to-implement approach to extract practical information from the cleaned database. This study will help manufacturing companies to achieve six sigma quality.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.73-78
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• 2016

Contact pressure distribution between PVA brush and semiconductor wafer was measured by developing a test setup which could simulates the post CMP cleaning process. The test set-up used thin film type pressure sensor which could measure the pressure distribution of contact area with the resolution of $15.5ea/cm^2$. As the experimental results, it was verified that there had been severe contact pressure non-uniformity along the axis of the brush and between the adjacent projections on the brush's surface. These results should be considered when developing post CMP cleaning stage or designing the PVA brush.

• Tribology and Lubricants
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• v.20 no.6
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• pp.343-349
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• 2004

The adsorption of soot particles onto a sensor surface of the engine soot detector posses a critical problem in the measurement. In order to prevent the optical rod surface from soot contamination, various functional coatings and flow-induced cleaning were applied to the surface in this work. For surface coatings, various materials of self-assembled monolayers (SAM) such as OTS (octadecyltrichlorosilane), PFDTES (perfluorodecyl-triethoxysilane) and PFDTMS (perfluorodecyltrimethoxysilane) were coated on the optical rod surface ,which have different characteristics in both hydrophobicity and oleophobicity. These coatings were tested with soot content varying from $0\%\;to\;3wt\%$ and oil temperature from 20 to $70^{\circ}C$. Test results showed that surface coatings were not effective for preventing the adsorption of soot panicles on the surface of optical rod. It was thought that these coatings provided the surface with additional attractive surface forces. However, it was found that adsorption of soot particles onto a sensor surface was minimized by flow-induced cleaning. This effect was tested with varying the flow velocity.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.45-50
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• 2009

By Laser Through-Silicon-Via process, debris and particles occur when you are forming. Therefore the research of TSV cleaning become important to remove those particles and debris. Both chemical cleaning method that uses a surfactant and physical cleaning method that uses a brush were studied with the via of $30{\mu}m$ diameter and $100{\mu}m$ depth on the 8 inch CMOS Image Sensor wafer. On the DI water and a surfactant in mixture ratio of 2:1, debris show $73{\mu}m^2$ per $0.054mm^2$. Cleaning is superior by lower mixture ratio of DI water and surfactant. In addition, It is less than 5% of debris distribution in the laser condition changed by Laser's frequency and its speed and cleaning had no effect. In the physical cleaning, there are no crack and damage when the system condition is set by $1000{\sim}3000rpm$ strip, $50{\sim}3000rpm$ rinsing, and $200{\sim}300rpm$ brushing Therefore, debris and particles can be removed by enforced chemical method and physical method.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1612-1616
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• 2005

In this paper, a Home Mess-Cleanup Robot(HMR), which has a practical function of the automatic mess-cleanup, is developed. The vacuum-cleaner had made the burden of house chore lighten but the operation labour of a vacuum-cleaner had been so severe. Recently, the cleaning robot was producted to perfectly solve the cleaning labour of a house but it also was not successful because it still had a problem of mess-cleaning, which was the clean-up of big trash and the arrangement of newspapers, clothes, etc. The cleaning robot is to just vacuum dust and small trash but has no function to arrange and take away before the automatic vacuum-cleaning. For this reason, the market for the cleaning robot is not yet built up. So, we need a design method and technological algorithm of new automatic machine to solve the problem of mess-cleanup in house. It needs functions of agile automatic navigation, novel manipulation system for mess-cleanup. The automatic navigation system has to be controlled for the full scanning of living room, to recognize the absolute position and orientation of the self, the precise tracking of the desired path, and to distinguish the mess object to clean-up from obstacle object to just avoid. The manipulator, which is not needed in the vacuum-cleaning robot, must have the functions, how to distinguish big trash to clean from mess objects to arrange, how to grasp in according to the form of mess objects, how to move to the destination in according to mess objects and arrange them. We use the RFID system to solve the problems in this paper and propose the reading algorithm of RFID tags installed in indoor objects and environments. Then, it should be an intelligent system so that the mess cleaning task can be autonomously performed in a wide variety of situations and environments. It needs to also has the entertainment functions for the good communication between the human and HMR. Finally, the good performance of the designed HMR is confirmed through the results of the mess clean-up and arrangement.

• Journal of Institute of Control, Robotics and Systems
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• v.18 no.5
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• pp.445-452
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• 2012

With the increasing number of high-rise and large-scale buildings, modern buildings are becoming intelligent, and are incurring high construction costs and requiring careful maintenance. Maintenance works for high-rise buildings significantly depend on human labor, unlike other construction processes that are gradually being automated. The resulting accidents may produce very high social and economic losses. To address this problem, herein, this paper proposes robotic building maintenance system using multi-robot concept, in specific, cleaning a building facade which is directly subjected to minimize human labor; that improves the process efficiency and economic feasibility. The sensor for detecting contamination of building's outer-wall glass is proposed; Kalman filter was used for estimating robots' status with the contamination of the window glass. Task allocation of the sensor based multi-robots for an effective way of task execution is introduced and the feasibility was verified through the simulations.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.1
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• pp.17-21
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• 2011

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.