PECVD Chamber Cleaning End Point Detection (EPD) Using Optical Emission Spectroscopy Data |
Lee, Ho Jae
(Department of Electronic Engineering, Myongji University)
Seo, Dongsun (Department of Electronic Engineering, Myongji University) Hong, Sang Jeen (Department of Electronic Engineering, Myongji University) May, Gary S. (School of Electrical and Computer Engineering, Georgia Institute of Technology) |
1 | G. E. Moore, Electronics, 38, 8 (1965) [DOI: http://dx.doi.org/10.1109 /N-SSC.2006.4785860]. |
2 | L. Pfitzner and P. Kucher, Materials Science in Semiconductor Processing, 5, 321 (2002) [DOI: http://dx.doi.org/10.1016/S13698001(03)00010-6]. DOI ScienceOn |
3 | W.-T. Tsai, H.-P. Chen and W.-T. Hsien, J. of Loss Prevention in the Process Industries, 15, 65 (2002) [DOI: http://dx.doi.org/10.1016/S0950-4230(01)00067-5]. DOI ScienceOn |
4 | E. M. Chan, G. Loh and C. C. Allgood, IEEE Trans. Semi. Manufac., 21, 668 (2008) [DOE: http://dx.doi.org/10.1109/TSM.2008.2005400]. DOI ScienceOn |
5 | A. D. Jonson, R. G. Ridgeway and P. J. Maroulis, IEEE Trans. Semi. Manufac., 17, 491 (2004) [DOE: http://dx.doi.org/10.1109/TSM.2004.835700]. DOI ScienceOn |
6 | B. Kim and S. Hong, Trans. Electrical and Electronic Materials, 13, 139 (2012) [DOI: http://dx.doi.org /10.4313/TEEM.2012.13.3.139] DOI ScienceOn |
7 | S. J. Hong and G. S. May, IEEE Trans. Semi. Manufac., 17, 408 (2004) [DOI: http://dx.doi.org/10.1016/10.1109/TSM.2004.831952]. DOI ScienceOn |
8 | B. Kim, M. Kwon, D. Kim and S. W. Baik, Materials and Manufacturing Processes, 26, 218 (2011) [DOI: http://dx.doi.org/10.1016/j.solmat.2012.09.02510.1080/10426914.2010.492054]. DOI ScienceOn |
9 | J. B. Boffard C. C. Lin, C. A. DeJoseph Jr, Journal of Physics D: Applied Physics, 37, R143 (2004) [DOI: http://dx.doi.org/10.1088/ 0022-3727/37/12/R01]. DOI ScienceOn |
10 | N. Brinkmann, D. Sommer, G. Micard, G. Hahn, B. Terheiden, Solar Energy Materials and Solar Cells, 108, 180 (2013) [DOI: http://dx.doi.org/10.1016/j.solmat.2012.09.025]. DOI ScienceOn |
11 | I. Jolliffe, Principal Component Analysis, Second Edition. New York: Springer-Verlag (2002). |