• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.7
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• pp.131-137
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• 2016

In this paper, we analyze the impedance analysis of vertical interconnection through-silicon vias (TSV) that is being studied for the purpose of improving the degree of integration and an electric feature in 3D IC. Also, it is to improve the performance and the degree of integration of the three-dimensional integrated circuit system which can exceed the limits of conventional two-dimensional a IC. In the future, TSV technology in full-chip 3-dimensional integrated circuit system design is very important, and a study on the electrical characteristics of the TSV for high-density and high-bandwidth system design is very important. Therefore, we study analyze the impedance influence of the TSV in accordance with the distance and frequency in a multiple TSV-to-TSV for the purpose of designing a full-chip three-dimensional IC. The results of this study also are applicable to semiconductor process tools and designed for the manufacture of a full-chip 3D IC.

• Journal of electromagnetic engineering and science
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• v.13 no.1
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• pp.54-61
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• 2013

An equivalent model has been developed to estimate the electromagnetic immunity for integrated circuits under a complex electromagnetic environment. The complete model is based on the characteristics of the equipment and physical configuration of the device under test (DUT) and describes the measurement setup as well as the target integrated circuits under test, the corresponding package, and a specially designed printed circuit board. The advantage of the proposed model is that it can be applied to a SPICE-like simulator and the immunity of the integrated circuits can be easily achieved without costly and time-consuming measurements. After simulation, measurements were performed to verify the accuracy of the equivalent model for immunity prediction. The improvement of measurement accuracy due to the added effect of a bi-directional coupler in the test setup is also addressed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.12
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• pp.7287-7291
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• 2014

A CDTA (current differencing transconductance amplifier) is an active building block for current mode analog signal processing with the advantages of high linearity and a wide frequency bandwidth. In addition, it can generate a stable voltage because all the differencing input current flows to the grounded devices. In this paper, a new small signal equivalent circuit is proposed to analyze a CDTA. The proposed small signal equivalent circuit provides greater precision in analyzing the magnitude and frequency response than its previous counterparts because it considers the parasitic components of the input, internal and output terminal. In addition, observations of the changes made in various devices, such as the resistor (Rz) confirmed that those devices heavily influence the characteristics of CDTA. The designed parameters of the proposed small signal equivalent circuit of the CDTA provides convenience and accuracy in the further design of analog integrated circuits. For verification purposes, a 2.5 MHz low pass filter was designed on the HSPICE simulation program using the proposed small signal equivalent circuit of CDTA.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.793-799
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• 2016

A multi-purpose sensor interface that provides dual-mode operation of fingerprint sensing and physiological signal detection is presented. The dual-mode sensing capability is achieved by utilizing inter-pixel shielding patterns as capacitive amplifier's input electrodes. A prototype readout circuit including a fingerprint panel for feasibility verification was fabricated in a $0.18{\mu}m$ CMOS process. A single-channel readout circuit was implemented and multiplexed to scan two-dimensional fingerprint pixels, where adaptive calibration capability against pixel-capacitance variations was also implemented. Feasibility of the proposed multi-purpose interface was experimentally verified keeping low-power consumption less than 1.9 mW under a 3.3 V supply.

• The Transactions of the Korean Institute of Power Electronics
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• v.25 no.5
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• pp.412-419
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• 2020

In this study, a 70 W buck converter using GaN metal-oxide-semiconductor field-effect transistor (MOSFET) is developed. This converter exhibits over 97 % efficiency, high power density, and 48 V-to-12 V/1.2 V/1 V (triple output). Three gate drivers and six GaN MOSFETs are placed in a 1 ㎠ area to enhance power density and heat dissipation capacity. The theoretical switching and conduction losses of the GaN MOSFETs are calculated. Inductances, capacitances, and resistances for the output filters of the three buck converters are determined to achieve the desired current, voltage ripples, and efficiency. An equivalent circuit model for the thermal analysis of the proposed triple-output buck converter is presented. The junction temperatures of the GaN MOSFETs are estimated using the thermal model. Circuit operation and temperature analysis are evaluated using a circuit simulation tool and the finite element analysis results. An experimental test bed is built to evaluate the proposed design. The estimated switch and heat sink temperatures coincide well with the measured results. The designed buck converter has 130 W/in³ power density and 97.6 % efficiency.

• IEIE Transactions on Smart Processing and Computing
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• v.4 no.3
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• pp.141-144
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• 2015

A broadband radio frequency synthesizer for multi-band, multi-standard mobile DTV tuners is proposed, it's loop bandwidth can be calibrated to optimize integrated phase noise performance without the problem of phase noise peaking. For this purpose, we proposed a new third-order scalable loop filter and a scalable charge pump circuit to minimize the variation in phase margin during calibration. The prototype phase-lock loop is fabricated in 180nm complementary metal-oxide semiconductor shows that it effectively prevents phase noise peaking from growing while the loop bandwidth increases by up to three times.

• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.644-649
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• 2001

This paper proposes a soft-switching current -source inverter for photovoltaic power system, which has an H-type switched-capacitor module composed of two semiconductor switches, two diodes, and an L-C resonant circuit. The operation of proposed system was analyzed by a theoretical approach with equivalent circuits and verified by computer simulations with SPICE and experimental works with a hardware prototype. The proposed system could be effectively applied for the power converter of photovoltaic power system interconnected with the power system.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.50 no.8
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• pp.402-407
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• 2001

This paper proposes a soft-switching current source inverter for photovoltaic power system, which has an H-type switched-capacitor module composed of two semiconductor switches, two diodes , and an L-C resonant circuit. The operation of proposed system was analyzed by a theoretical approach with equivalent circuits and verified by computer simulations with SPICE. The feasibility of hardware implementation was verified by experimental works with a prototype. The proposed system could by effectively applied for the photovoltaic power system with high efficiency.

• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• v.3B no.1
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• pp.37-43
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• 2003

This paper proposes a soft-switching current source inverter for a photovoltaic power system. The proposed inverter has an H-type switched-capacitor module composed of two semiconductor switches, two diodes, and an LC resonant circuit. The operation of the proposed system was analyzed by a theoretical approach with equivalent circuits and was verified by computer simulations with SPICE and experimental implementation with a hardware prototype. The proposed system could be effectively applied for the power converter of photovoltaic power system interconnected with the AC power system.