• JSTS:Journal of Semiconductor Technology and Science
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• 제13권4호
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• pp.402-409
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• 2013

An innovative application of voltage-contrast (VC) inspection allowed inline detection of NMOS leakage in dense SRAM cells is presented. Cell sizes of SRAM are continual to do the shrinkage with bit density promotion as semiconductor technology advanced, but the resulting challenges include not only development of smaller-scale devices, but also intra-devices isolation. The NMOS leakage caused by the underneath n+/P-well shorted to the adjacent PMOS/N-well was inspected by the proposed electron-beam (e-beam) scan in which VC images were compared during the in-line process step of post contact tungsten (W) CMP (Chemical Mechanical Planarization) instead of end-of-line electrical test, which has a long response time. A series of experiments based on the mechanism for improving the intra-well isolation was performed and verified by the inline VC inspection. An optimal process-integration condition involved to the tradeoff between the implant dosage and photo CD was carried out.

• 비파괴검사학회지
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• 제25권2호
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• pp.81-86
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• 2005

본 논문에서는 반도체 패키지 내부결함의 비파괴 정량평가를 위한 ESPI 기법을 이용한 시스템 및 검사기 법을 제안하고 있으며, 검사시스템은 ESPI 검사장치, 열변형유도장치, 단열챔버로 구성되어있다. 기존 초음파, X-ray 기반의 검사기법에 비하여 측정시간 및 검사방법이 용이하며, 결함의 정량검출이 가능하다는 장점이 있다. 검사결과에서 대부분의 결함이 열 방출이 많은 칩 주위에서 박리결함으로 나타났으며, 원인은 층간 접착강도의 약화와 열분배 설계에서 문제점인 것으로 사료된다.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.44-48
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• 2021

Semiconductor inspection equipment makes components using materials with insulating properties for functional inspection including current and voltage of semiconductor parts. A representative insulating material is plastic, and plastic is made of a component through an injection process using plastic pellet. When plastic pellets contain excessive moisture, problems such as performance degradation and product surface defects occur. To prevent this, pre-drying is essential, and the heat convective type is the most applied. However, the heat convective type has a problem of low consumption efficiency and a long drying time. Recently, many studies have been conducted on a drying method using microwaves due to high energy efficiency. In this paper, drying was performed using a microwave for drying PC pellets. Energy consumption and drying efficiency analyzed by set up an experimental apparatus of heat convective, microwave, and hybrid(heat convective + microwave) types. It was confirmed that energy consumption and drying efficiency were high when drying using microwaves, and it was confirmed that the hybrid method improved drying performance compared to the heat convective method. It is expected that the research results of this paper can be used as basic data for drying plastic pellets using microwave.

• 반도체디스플레이기술학회지
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• 제3권4호
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• 반도체디스플레이기술학회지
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• 제14권1호
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• pp.7-11
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• 2015

In this paper, an automatic focusing method has been proposed for speedy and reliable measurement and inspection in industry. It is very difficult to determine focusing step size and moving direction in one camera autofocusing. The proposed method can improve speed and accuracy of focusing by using the optical axis interval of two cameras, which is automatically set up as focusing step size. Also, it can determine moving direction from focus value comparisons of two cameras, and then solve ambiguity of one camera focusing. Its performance is verified by experiments. It is expected that it can apply to optical system for measurement and inspection in industry fields.

• 한국기계가공학회지
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• 제12권3호
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• pp.36-40
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• 2013

Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

• 반도체디스플레이기술학회지
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• 제12권1호
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• pp.1-7
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• 2013

Grey-level statistical models have been widely used in many applications for object location and identification. However, conventional models yield some problems in model refinement when training images are not properly aligned, and have difficulties for real-time recognition of arbitrarily rotated models. This paper presents improved grey-level statistical models that align training images using image or feature matching to overcome problems in model refinement of conventional models, and that enable real-time recognition of arbitrarily rotated objects using efficient hierarchical search methods. Edges or features extracted from a mean training image are used for accurate alignment of models in the search image. On the aligned position and orientation, fitness measure based on grey-level statistical models is computed for object recognition. It is demonstrated in various experiments in PCB inspection that proposed methods are superior to conventional methods in recognition accuracy and speed.

• 반도체디스플레이기술학회지
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• 제5권1호
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• pp.1-4
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• 2006

Recently, Ball Grid Arrays(BGAs) are getting used more frequently for a package type. The connectors on a BGA consist of a large number of small solder balls in a grid shape on its bottom side. However, since balls of BGAs mounted on PCBs are not visible, inspection before mounting them is indispensable. High speed non-contact 3D measurement technologies are necessary far real-time measurement of ball height, the most important inspection item. In this paper, an accurate 3D data acquisition system for BGAs is proposed that can acquire 3D profile at high speed using a 3D smart camera and laser slit ray projection. Some clipping and morphological filtering operations are employed to remove spiky error data, which occur due to reflections from some ball area to camera direction.

• 전기학회논문지P
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• 제55권4호
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• pp.167-175
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• 2006

This paper presents a method to segment semiconductor wafer ID on poor quality images. The method is based on multiple templates and normalized gray-level correlation (NGC) method. If the lighting condition is not so good and hence, we can not control the image quality, target image to be inspected presents poor quality ID and it is not easy to identify and then recognize the ID characters. Conventional several method to segment the interesting ID regions fails on the bad quality images. In this paper, we propose a multiple template method, which uses combinational relation of multiple templates from model templates to match several characters of the inspection images. To find out the optimal solution of multiple template model in ID regions, we introduce newly-developed snake algorithm. Experimental results using images from real FA environment are presented.

• 반도체디스플레이기술학회지
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• 제3권4호
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• pp.51-55
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• 2004

In the design stage of high precision manufacturing/inspection FAB facilities, it is necessary to investigate the allowable vibration limits of high precision equipments and to study structural dynamic characteristics of C/R and Sub-structure in order to provide structural vibration criteria to satisfy these allowable limits. The goal of this study is to investigate the dynamic characteristics of PC-Type mock-up structures designed for next generation TFT-LCD FAB through experiments and analysis procedures. Therefore, in order to provide a proper dynamic structural design for high precision manufacturing/inspection work process, these allowable limits must be satisfied.