• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1018-1021
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2010년도 춘계학술대회 논문집
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• pp.498-506
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• 2010

The neutral section was installed in order to prevent conflict with different phase angle source in electric railway catenary system. The speed of electric train reduced due to coasting operation by notch off when it passed the neutral section. And, the catenary wire was damaged and the accident might be happened because of the arc generation when the electric train passed the neutral section with notch on condition. This project has a goal to develop the automatic changeover system using by noncontactless semiconductor device in neutral section of catenary system so that the train pass as notch-on condition. In this first year, we obtain as following results such as domestic and international systems applications and completion requirements, development and analysis of stability for automatic changeover system, design of static switching device on automatic changeover system in neutral section and drawing up interface design and specifications according to equipment.

• 한국소음진동공학회논문집
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• 제12권1호
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• pp.65-72
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• 2002

Generally, there are laser operating equipments( aligner, stepper) and electronic microscope( SEM, TEM) as a high precision manufacturing and inspection equipment in semiconductor production companies, precision examination and measuring laboratories. Mostly, these equipments are characterized by projection and target part. The relative displacements between projection and target part are dominant roles in vibrational problem in these precision equipments. These relative displacements are determined by the position of incoming vibration and the difference of vibration response in projection and target part. In this study, the allowable vibrational limits are suggested and the vibrational reduction plans are proposed by measurement and analysis of vibration phenomenon in the Clean Room in PDP(plasma display panel) production building. The vibration performance is evaluated by comparison relative displacements between projection and target part before/after the vibration isolation plan.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.621-628
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• 2000

A kinematic ball bar measuring system can analyze the various errors of a machine tool easil rapidly with only one measurement, But it cannot be used to measure the errors of the equipment the semiconductor manufacturing (e.g. chip mounter, PCB router etc.) not to use a cir interpolation. This paper presents the method to apply a kinematic ball bar measuring system tc machines which use merely a linear interpolation Also, the work of measuring and calibratir various errors of a chip mounter with a kinematic bal1 bar measurement system is accomplished

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권2호
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• pp.202-207
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• 2015

A CMOS relaxation oscillator, with high robustness over process, voltage and temperature (PVT) variations, is designed in $0.18{\mu}m$ CMOS. The proposed oscillator, consisting of full-differential charge-discharge timing circuit and switched-capacitor based voltage-to-current conversion, could be expanded to a simple open-loop frequency synthesizer (FS) with output frequency digitally tuned. Experimental results show that the proposed oscillator conducts subcarrier generation for frequency-modulated ultra-wideband (FM-UWB) transmitters with triangular amplitude distortion less than 1%, and achieves frequency deviation less than 8% under PVT and phase noise of -112 dBc/Hz at 1 MHz offset frequency. Under oscillation frequency of 10.5 MHz, the presented design has the relative FS error less than 2% for subcarrier generation and the power dissipation of 0.6 mW from a 1.8 V supply.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권2호
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• pp.194-201
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• 2015

A frequency modulated ultra-wideband (FM-UWB) transmitter with a high-robust relaxation oscillator for subcarrier generation and a dual-path Ring VCO for RF FM is proposed, featuring low power and low complexity. A prototype 3.65-4.25 GHz FM-UWB transceiver employing the presented transmitter is fabricated in $0.18{\mu}m$ CMOS for short-range wireless data transmission. Experimental results show a bit error rate (BER) of $10^{-6}$ at a data rate of 12.5 kb/s with a communication distance of 60 cm is achieved and the power dissipation of 4.3 mW for the proposed transmitter is observed from a 1.8 V supply.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.90-92
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• 2005

Lightning surge damages of low voltage equipments in building are increasing due to increase in electrical and communication networks in the information-oriented society. And electronic equipments contained electrical circuits with semiconductor are very weak against lightning surge. The surge protective devices for electronic circuit in electronic equipments and AC power lines are becoming more widely. To achieve effective method of surge protection, there are needs for correlation between lightning surge protective effect of electronic equipment and installation method of surge protective device. This paper describes as a result of experiments for correlation between lightning surge protective effect and installation of surge protective device and Earth Leakage Breaker.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• 대한기계학회논문집B
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• 제22권11호
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• pp.1564-1570
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• 1998

In-situ particle monitors(ISPMs) are widely used for monitoring contaminant particles in vacuum-based semiconductor manufacturing equipment. In the present research, the performance of a Particle Measuring Systems(PMS) Vaculaz-2 ISPM at subatmospheric pressures has been studied. We created uniform upstream conditions of particle concentration and measured the detection efficiency, the lower detection limit, and the size response of the ISPM using uniform sized methylene blue aerosol particles. The effect of particle size, particle velocity, particle concentration, and system pressure on the detection efficiency was examined. Results show that the detection efficiency of the ISPM decreases with decreasing chamber pressure, and with increasing mass flow rate. The lower detection limit of the ISPM, determined at 50 % of the measured maximum detection efficiency, was found to be about $0.15{\sim}0.2{\mu}m$, which is similar to the minimum detectable size of $0.17{\mu}$ given by the manufacturer.

• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.