• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.617-618
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• 2012

• 반도체디스플레이기술학회지
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• 제23권1호
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• pp.52-55
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• 2024

In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

• Journal of Korea Trade
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• 제25권6호
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• pp.78-104
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• 2021

Purpose - Semiconductors are a significant export item for Korea that is expected to continue to contribute significantly to the Korean economy in the future. Thus, the semiconductor industry is a critical component in the 4th Industrial Revolution and is expected to continue growing as the non-face-to-face economy expands as a result of the COVID-19 pandemic. In this context, this paper aims to empirically investigate how semiconductors are imported and exported in Korea from a global supply chain perspective by analysing import and export data at the micro-level. Design/methodology - This study conducts a multifaceted analysis of the global supply chain for semiconductors and related equipment in Korea by examining semiconductor imports and exports by semiconductor type, year, target country, mode of transportation, airport/port, and domestic region, using import/export micro-data. The visualisation, flow analysis, and Bayesian Network methodologies were used to compensate for the limitations of each method. Findings - Korea is a major exporter of semiconductor memory and has the world's highest competitiveness but is relatively weak in the field of system semiconductors. The trade deficit in 'semiconductor equipment and parts' is clearly growing. As a result, continued investment in 'system semiconductors' and 'semiconductor equipment and parts' technology development is necessary to boost exports and ensure a stable supply chain. Originality/value - Few papers on semiconductor trade in Korea have been published from the perspective of the global supply chain or value chain. This study contributes to the literature in this area by focusing on import and export data for the global supply chain of the Korean semiconductor industry using a variety of approaches. It is our hope that the insights gained from this study will aid in the advancement of SCM research.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권2호
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• pp.252-261
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• 2014

A Bayesian network (BN) based fault diagnosis framework for semiconductor etching equipment is presented. Suggested framework contains data preprocessing, data synchronization, time series modeling, and BN inference, and the established BNs show the cause and effect relationship in the equipment module level. Statistically significant state variable identification (SVID) data of etch equipment are preselected using principal component analysis (PCA) and derivative dynamic time warping (DDTW) is employed for data synchronization. Elman's recurrent neural networks (ERNNs) for individual SVID parameters are constructed, and the predicted errors of ERNNs are then used for assigning prior conditional probability in BN inference of the fault diagnosis. For the demonstration of the proposed methodology, 300 mm etch equipment model is reconstructed in subsystem levels, and several fault diagnosis scenarios are considered. BNs for the equipment fault diagnosis consists of three layers of nodes, such as root cause (RC), module (M), and data parameter (DP), and the constructed BN illustrates how the observed fault is related with possible root causes. Four out of five different types of fault scenarios are successfully diagnosed with the proposed inference methodology.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.121-126
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• 2017

EES System support to maximize equipment efficiency by providing real-time information of main equipment which has a significant effect on product quality and productivity, and to prevent equipment failure by detecting equipment abnormality in advance. Smart Equipment Engineering System(S-EES) integrates the activities performed at equipment that are the core of production activities and manages them by system so as to maximize the efficiency of equipment and raise the quality level of products to one level. In other words, when the product is put into the equipment, the recipe is downloaded through the RMS, the recipe is set to the optimal condition through R2R(process control), and the system detects and controls the abnormality of the equipment during operation through the FDC function in real time it means. In this way, we are working with the suitable recipe that matches the lot of product, detecting the abnormality of the equipment during operation, preventing the product from being defective, and establishing a system to maximize the efficiency through real-time equipment management. In this study, we review the present status and problems of equipment management in actual production lines, collect the requirements of the manufacturing line for the PCB line, design and develop the system, The measurement model was studied.

• 한국컴퓨터정보학회논문지
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• 제12권2호
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• pp.151-159
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• 2007

반도체 제조 과정에서 생산과 관련된 모든 현상 데이터를 수집하는 것은 매우 중요한 작업이다. 수집된 자료의 분석을 통해 장비의 가동률, 고장 진단, 공정 제어 및 예측되는 장애 요소 제거 등에 활용할 수 있으며, 이는 궁극적으로 생산 효율 향상에 기여할 수 있기 때문이다. 많은 장비제조업체들이 이러한 목적으로 EES (Equipment Engineering System)을 도입했으며, 최근에는 웹 사용이 일상화되면서 HTTP/SOAP 프로토콜을 활용하여 장비 모니터링의 범위를 확대하는 방안이 제안되고 있다. 이러한 웹 기반 EES를 실현하기 위해서는 여러 반도체 장비에서 생성되는 다양한 메시지의 형식을 통합, 표준화함으로써 EDA(Equipment Data Aquisition)를 용이하게 하는 작업이 선행되어야 한다. 본 논문에서는 반도체 장비 간 통신에 사용되는 다양한 프로토콜의 분석을 통하여 상이한 형식의 정보를 통합하기 위한 방안을 제안하고 이를 지원하기 위한 소프트웨어 구조를 설계한다.

• 한국산학기술학회논문지
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• 제15권10호
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• pp.5906-5911
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• 2014

요즈음 생산되는 반도체의 제품이 제대로 작동하는지, 낮은 습도 또는 높은 온도에서 잘 견디는가를 검사하는 패키지 조립 및 검사 공정이 현장에 많이 있다. 또한 검사공정에서 사용되고 있는 반도체 테스트 핸들러 픽커 검사장비가 있는데, 본 연구에서는 CATIA 프로그램을 이용하여 3D 모델링하였으며, ANSYS 프로그램을 이용하여 반도체 테스트 핸들러 픽커 검사장비 프레임의 모델에 대하여 3가지 피로하중에 대한 해석을 하였다. 해석 결과로서 Case 1과 Case 2 모두 프레임의 가운데에서 최대 변형량이 발생하고 불규칙 피로 하중들 중에서 가장 하중의 변동이 심한 'SAE bracket history'가 가장 불안정하고 'Sample history'가 가장 안정함을 보이고 있다. 본 연구의 피로 해석 결과는 반도체 테스트 핸들러 픽커 검사장비 프레임의 파손방지 및 내구성을 검토함으로서 그 프레임의 설계에 효율적으로 활용이 될 수 있다.

• 반도체디스플레이기술학회지
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• 제20권2호
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• 반도체디스플레이기술학회지
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• 제22권2호
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• pp.96-103
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• 2023

This paper presents a robust position tracking controller for a motor used in semiconductor equipment, utilizing the motor angle measurement. Precise position control is challenging due to the presence of uncertainties in various motor applications. The proposed controller consists of a PD (Proportional-Derivative) controller and a PIO (Proportional-Integral Observer) to estimate the system's state and equivalent disturbance compensating for the uncertainties. Since the stability alternates as the observer gain increases, we have investigated it through the closedloop root locus under the system parameters change. The analysis has showed that the inertia of the motor is the main parameter that affects it, and by adjusting the control gain appropriately, the system can be rendered to be stable even when the inertia of the motor changes. The effectiveness of the proposed control algorithm is validated through computer simulations, followed by a comparison of its performance with the results of a previous study.

• 산업경영시스템학회지
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• 제39권1호
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• pp.153-161
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• 2016

Semiconductor manufacturing has suffered from the complex process behavior of the technology oriented control in the production line. While the technological processes are in charge of the quality and the yield of the product, the operational management is also critical for the productivity of the manufacturing line. The fabrication line in the semiconductor manufacturing is considered as the most complex part because of various kinds of the equipment, re-entrant process routing and various product devices. The efficiency and the productivity of the fabrication line may give a significant impact on the subsequent processes such as the probe line, the assembly line and final test line. In the management of the re-entrant process such as semiconductor fabrication, it is important to keep balanced fabrication line. The Performance measures in the fabrication line are throughput, cycle time, inventory, shortage, etc. In the fabrication, throughput and cycle time are the conflicting performance measures. It is very difficult to achieve two conflicting goal simultaneously in the manufacturing line. The capacity of equipment is important factor in the production planning and scheduling. The production planning consideration of capacity can make the scheduling more realistic. In this paper, an input and scheduling rule are to achieve the balanced operation in semiconductor fabrication line through equipment capacity and workload are proposed and evaluated. New backward projection and scheduling rule consideration of facility capacity are suggested. Scheduling wafers on the appropriate facilities are controlled by available capacity, which are determined by the workload in terms of the meet the production target.