• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.726-729
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• 2010

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.11
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• pp.84-91
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• 2009

A high speed serial link transmitter using multi-level signaling is proposed. To achieve high data rate m high speed serial link, 4-pulse amplitude modulation (PAM) is used. By transmitting 2 bit data in each symbol time, high speed data transmission, two times than binary signaling, is achieved. The transmitter transmits current-mode output instead of voltage-mode output Current-mode output is much faster than voltage-mode output, so higher data transmission is available by increasing switching speed of driver. $2^5-1$ pseudo-random bit sequence (PRBS) generator is contained to perform built-in self test (BIST). The 4-PAM transmitter is designed in Dongbu HiTek $0.18{\mu}m$ CMOS technology and achieves 8 Gb/s, 160 mV of eye height with 1.8 V supply voltage. The transmitter consumes only 98 mW for 8 Gb/s transmission.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.44 no.3
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• pp.23-30
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• 2007

RFID it reads information which is it writes, the semiconductor chip for and the radio frequency system which uses the hazard antenna it has built-in transmission of information it talks. Formation which is transmitted like this collection and America which it filtrates wey the RFID search service back to inform the location of the server which has commodity information which relates with an object past record server. The hazard where measurement analysis result the leader for electronic interference does not occur consequently together from with verification test the power level which is received from the antenna grade where it stands must maintain minimum -55dBm and the electronic interference will not occur with the fact that, antenna and reel his recognition distance the maximum 7m until the recognition which is possible but smooth hazard it must stand and and with the fact that it will do from within and and and 3-4m it must be used Jig it is thought.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.1
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• pp.70-79
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• 2016

This paper proposes a low-power range-scaled 14b 30 MS/s pipeline-SAR composite ADC for high-performance CIS applications. The SAR ADC is employed in the first stage to alleviate a sampling-time mismatch as observed in the conventional SHA-free architecture. A range-scaling technique processes a wide input range of 3.0VP-P without thick-gate-oxide transistors under a 1.8 V supply voltage. The first- and second-stage MDACs share a single amplifier to reduce power consumption and chip area. Moreover, two separate reference voltage drivers for the first-stage SAR ADC and the remaining pipeline stages reduce a reference voltage disturbance caused by the high-speed switching noise from the SAR ADC. The measured DNL and INL of the prototype ADC in a $0.18{\mu}m$ CMOS are within 0.88 LSB and 3.28 LSB, respectively. The ADC shows a maximum SNDR of 65.4 dB and SFDR of 78.9 dB at 30 MS/s, respectively. The ADC with an active die area of $1.43mm^2$ consumes 20.5 mW at a 1.8 V supply voltage and 30 MS/s, which corresponds to a figure-of-merit (FOM) of 0.45 pJ/conversion-step.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.20-25
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• 2010

An integrated Mach-Zehnder interferometric sensor operating at 632.8 nm was designed and fabricated by the technology of planar rib waveguides. Rib waveguide based on silica system ($SiO_2-SiO_xN_y-SiO_2$) was geometrically designed to have single mode operation and high sensitivity. It was structured by semiconductor fabrication processes such as thin film deposition, photolithography, and RIE (Reactive Ion Etching). With the power observation, propagation loss measurement by cut-back method showed about 4.82 dB/cm for rib waveguides. Additionally the chromium mask process for an etch stop was employed to solve the core damaging problem in patterning the sensing zone on the chip. Refractive index measurement of water/ethanol mixture with this device finally showed a sensitivity of about $\pi$/($4.04{\times}10^{-3}$).

• Journal of Sensor Science and Technology
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• v.6 no.2
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• pp.115-122
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• 1997

In this paper, on-chp atomatic tuning circuit, using proposed integration level approximation technique, is designed to tuning of the variation of RC time-constant due to aging or temperature variation, etc. This circuit reduces the error, the difference between code values and real outputs of integrator, which is drawback of presented dual-slope tuning circuit and eliminates modulations of processing signals in integrated circuit due to fixed tuning codes during ordinary operation. This system is made up of simple integrator, A/D converter and digital control circuit and all capacitors are replaced by programed capacitor arrays in this system. This tuning circuit with 4 bit resolution achieves $-9.74{\sim}+9.68%$ of RC time constant error for 50% resistance variation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.1
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• pp.69-78
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• 2010

To implement the high performance SoC, we propose the flying master bus architecture that a specially defined master named as the flying master directly accesses the selected slaves with no regard to the bus protocol. The proposed bus architecture was implemented through Verilog and mapped the design into Hynix 0.18um technology. As master and slave wrappers have around 150 logic gate counts, the area overhead is still small considering the typical area of modules in SoC designs. In TLM performance simulation about proposed architecture, 25~40% of transaction cycle and 43~60% of bus efficiency are increased and 43~77% of request cycle is decreased, compared with conventional bus architecture. Conclusively, we assume that the proposed flying master bus architecture is promising as the leading candidate of the bus architecture in the aspect of performance and efficiency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.366-369
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• 2003

The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.11
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• pp.3087-3093
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• 2009

Digital filters are indispensible element in digital signal processing area. The performance of digital filter based on adding and multiplying operation, such as computational speed and power consuming is determined by the orders and coefficients of filter which has on effect area of semiconductor chip when it is implemented by VLSI technology. In this research, in order to performance improvement of digital filter, we proposed the algorithm to speed-up the operation of digital filter associated with the minimum signed digit representation of binary number system and method to simplify the digital filter design associated with common subexpression elimination. The performance of proposed method is evaluated by the computational speed and design-simplicity by experimental implemented digital filter on FPGA.

• Journal of Biomedical Engineering Research
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• v.16 no.4
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• pp.555-561
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• 1995

In this paper, the O-Ring Measurement System (O-R MS) has been designed to supplement such subectivity and apply to the diagnosis by constitution. A single chip microprocessor of Intel MCS-51 family has been used to control the O-R MS and process data with real time, and the O-R MS could measure the minute muscular strength, expanded width between fingers, and time of the measurement. Therefore the objective constitutional diagnosis is possible by the O-R MS. As a clinical testing for estimating credibility of O-R MS, the acupuncture points representing the constitution has been stimulated using a semiconductor laser stimulator and measure the muscular strength by the O-R MS. The result of clinical testing has been shown that the constitutional diagnosis with the O-R MS is proved highly precision of 96% and it is expected that the O-R MS can be used practically for the objective constitutional diagnosis.