• Journal of radiological science and technology
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• v.43 no.6
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• pp.481-487
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• 2020

Radiation measurement technology has steadily improved and its usage is expanding in various industries such as nuclear medicine, security search, satellite, nondestructive testing, environmental industries and the domain of nuclear power plants (NPPs). Especially, the simultaneous measurements of gamma rays and neutrons can be even more critical for nuclear safety management of spent nuclear fuel and monitoring of the nuclear material. A semiconductor detector comprising cadmium, zinc, and tellurium (CZT) enables to detect gamma-rays due to the significant atomic weight of the elements via immediate neutron and gamma-ray detection. Semiconductor sensors might be used for nuclear safety management by monitoring nuclear materials and spent nuclear fuel with high spatial resolution as well as providing real-time measurements. We aim to introduce a portable nuclide-analysis device that enables the simultaneous measurements of neutrons and gamma rays using a CZT sensor. The detector has a high density and wide energy band gap, and thus exhibits highly sensitive physical characteristics and characteristics are required for performing neutron and gamma-ray detection. Portable nuclide-analysis device is used on NPP-decommissioning sites or the purpose of nuclear nonproliferation, it will rapidly detect the nuclear material and provide radioactive-material information. Eventually, portable nuclide-analysis device can reduce measurement time and economic costs by providing a basis for rational decision making.

• Korean Journal of Optics and Photonics
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• v.34 no.3
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• pp.106-116
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• 2023

In this paper, we designed a coaxial dual camera incorporating two optical systems-one for the visible rays and the other for far-infrared ones-with the aim of capturing images in both wavelength ranges. The far-infrared system, which uses an uncooled detector, has a sensor array of 640×480 pixels. The visible ray system has 1,945×1,097 pixels. The coaxial dual optical system was designed using a hot mirror beam splitter to minimize heat transfer caused by infrared rays in the visible ray optical system. The optimization process revealed that the final version of the dual camera system reached more than 90% of the fusion performance between two separate images from dual systems. Multiple rigorous testing processes confirmed that the coaxial dual camera we designed demonstrates meaningful design efficiency and improved image conformity degree compared to existing dual cameras.

• Journal of the Korean Society for Nondestructive Testing
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• v.19 no.5
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• pp.369-377
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• 1999

Recently, it is gradually raised necessity that thickness of thin film is measured accuracy and managed in industrial circles and medical world. Ultrasonic signal processing method is likely to become a very powerful method for NDE method of detection of microdefects and thickness measurement of thin film below the limit of ultrasonic distance resolution in the opaque materials, provides useful information that cannot be obtained by a conventional measuring system. In the present research. considering a thin film below the limit of ultrasonic distance resolution sandwiched between three substances as acoustical analysis model, demonstrated the usefulness of ultrasonic signal processing technique using information of ultrasonic frequency for NDE of measurements of thin film thickness. Accordingly, for the detection of delamination between the junction condition of boundary microdefect of thin film sandwiched between three substances the results from digital image processing.

• Journal of Biomedical Engineering Research
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• v.16 no.4
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• pp.555-561
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• 1995

In this paper, the O-Ring Measurement System (O-R MS) has been designed to supplement such subectivity and apply to the diagnosis by constitution. A single chip microprocessor of Intel MCS-51 family has been used to control the O-R MS and process data with real time, and the O-R MS could measure the minute muscular strength, expanded width between fingers, and time of the measurement. Therefore the objective constitutional diagnosis is possible by the O-R MS. As a clinical testing for estimating credibility of O-R MS, the acupuncture points representing the constitution has been stimulated using a semiconductor laser stimulator and measure the muscular strength by the O-R MS. The result of clinical testing has been shown that the constitutional diagnosis with the O-R MS is proved highly precision of 96% and it is expected that the O-R MS can be used practically for the objective constitutional diagnosis.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.3
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• pp.661-669
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• 1999

A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.1
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• pp.75-80
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• 2009

Bum-in test is one for eliminating semiconductor devices that are subject to early failures and other operational problems; it is usually carried out on the devices by imposing severe test conditions such as elevated voltages, temperatures, and time. In order for such a test to be performed, each burn-in board having devices to be tested, needs to be inserted into a corresponding slot. A set of such slots is called a zone. The slots comprising a zone can only have the burn-in boards with the devices of the same type. In order to test many different types of semiconductor devices, it is desirable to build a burn-in test system to have as many zones as possible. A zone controller controlling a zone, is a device that performs a burn-in test and collects test results. In case of existing systems, each zone controller takes care of a zone that consists of a fixed number of slots. Since a zone controller is, in most cases, embedded into a workstation that controls the overall testing process, adding new zone controllers is restricted by the spaces for them. As a way to solve or alleviate these problems, a dynamic zone system in which the number of slots in a zone can be dynamically allocated, is presented. This system maximizes the efficiency of system utilization, by altering the number of slots and hence minimizing the idle slots of a zone. In addition, all the test operations being performed must be aborted for maintenance in existing systems. In dynamic zone systems, however, a separate and independent maintenance is allowed for each slot, as long as the main power supply system has no problem.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.5
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• pp.649-657
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• 2014

In this study, the effects of the frequency-dependent characteristics of through-silicon vias (TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection structure, which is composed of 32-nm CMOS inverter drivers and receivers connected through TSVs. The frequency-domain model of TSVs is extracted in S-parameter from a 3D electromagnetic (EM) method, where the dimensional variation effect of TSVs can be accurately considered for a comprehensive parameter sweep simulation. A parametric analysis shows that the propagation delay increases with the diameter and height of the TSVs but decreases with the pitch and liner thickness. We also investigate the crosstalk effect between TSVs by testing different signaling conditions. From the simulations, the worst signal integrity is observed when the signal experiences a simultaneously coupled transition in the opposite direction from the aggressor lines. Simulation results for nine-TSV bundles having regular and staggered patterns reveal that the proposed method can characterize TSV-based 3D interconnections of any dimensions and patterns.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.997-1002
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• 2007

A guideway vehicle is used in automobile, semiconductor and LCD manufacturing industries to transport products efficiently. Since the operating speed of the guideway vehicle should be increased for maximum productivity, the weight of the vehicle has to be reduced. This may cause parts in the system to fail before the life of the system. Therefore estimation of the fatigue life of the parts becomes an important problem. In this study, the fatigue life of the driving wheel in the guideway vehicle is estimated using a S-N curve. To obtain the fatigue life of a part, the S-N curve, load time history applied on a driving wheel and material property are required. The S-N curve of the driving wheel is obtained using the fatigue experiment on wheels. Load time history of the wheel is obtained from multibody dynamics analysis. To obtain the material properties of the driving wheel, which is composed of aluminum with urethane coating, a compression hardware testing has been done with the static analysis of the FE model. The fatigue life prediction using computational analysis model guarantees the safety of the vehicle at the design stage of the product.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1730-1733
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• 2007

As semiconductor and MEMS devices become smaller, testing process during their production should follow such a high density trend. A circuit inspection tool "probe card" makes contact with electrode pads of the device under test (DUT). Nowadays, electrode pads are irregularly arranged and have height difference. In order to absorb variations in the heights of electrode pads and to generate contact loads, contact probes must have some levels of mechanical spring properties. Contact probes must also yield a force to break the surface native oxide layer or contamination layer on the electrodes to make electric contact. In this research, new vertical micro contact probe with bellows shape is developed to overcome shortage of prior work. Especially, novel bellows shape is used to reduce stress concentration in this design and stopper is used to change the stiffness of micro contact probe. Variable stiffness can be one solution to overcome the height difference of electrode pads.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.36 no.1
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• pp.1-8
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• 2004

One of the most frequently used method for measurement of the degree of sizing (viz., hydrophobicity) is the Stockigt test. However, the Stockigt test was influenced by various factors such as dropping height, dropping amount, dropping speed and viewing angle. The resultant data of the sizing degree on the same specimen also varied according to different testers. Thus, the Stockigt test should be modified to be regarded as a highly reliable and reproducible standard method. For modifying the Stockigt test, it was required to quantify red coloration by reaction between 1％ ferric chloride and 2％ ammonium thiocyante during Stockigt testing. The cameras capturing the serial images during the red coloration process were the CMOS (Complementary Metal Oxide Semiconductor)-type and CCD (Charge Coupled Device)-type cameras. For measurement based on KS M 7025, the CCD-type camera must be used due to its high resolution, and on the other hand, for measurement based on Tappi Useful Method 429, the CMOS-type camera may be used owing to its low resolution. It was needed to covert the RGB values of a droplet image into HSV(Hue, Saturation, and Value) values because the human eyes are much closer to HSV than RGB. Among HSV values, the Hue value was accepted as the most reliable index consistent with the red coloration process by excluding the surrounding conditions such as light, tester's movement etc.