• Title/Summary/Keyword: Semiconductor Process

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Direct Writing Lithography Technique for Semiconductor Fabrication Process Using Proton Beam

  • Kim, Kwan Do
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.38-41
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    • 2019
  • Proton beam writing is a direct writing lithography technique for semiconductor fabrication process. The advantage of this technique is that the proton beam does not scatter as they travel through the matter and therefore maintain a straight path as they penetrate into the resist. The experiment has been carried out at Accelerator Mass Spectrometry facility. The focused proton beam with the fluence of $100nC/mm^2$ was exposed on the PMMA coated silicon sample to make a pattern on a photo resist. The results show the potential of proton beam writing as an effective way to produce semiconductor fabrication process.

Status Change Monitoring of Semiconductor Plasma Process Equipment (주파수 도메인 반사파 측정법을 이용한 플라즈마 공정장비 상태변화 연구)

  • Yunsang Lee;Sang Jeen Hong
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.1
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    • pp.52-55
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    • 2024
  • In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

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Defect Prediction Using Machine Learning Algorithm in Semiconductor Test Process (기계학습 알고리즘을 이용한 반도체 테스트공정의 불량 예측)

  • Jang, Suyeol;Jo, Mansik;Cho, Seulki;Moon, Byungmoo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.7
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    • pp.450-454
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    • 2018
  • Because of the rapidly changing environment and high uncertainties, the semiconductor industry is in need of appropriate forecasting technology. In particular, both the cost and time in the test process are increasing because the process becomes complicated and there are more factors to consider. In this paper, we propose a prediction model that predicts a final "good" or "bad" on the basis of preconditioning test data generated in the semiconductor test process. The proposed prediction model solves the classification and regression problems that are often dealt with in the semiconductor process and constructs a reliable prediction model. We also implemented a prediction model through various machine learning algorithms. We compared the performance of the prediction models constructed through each algorithm. Actual data of the semiconductor test process was used for accurate prediction model construction and effective test verification.

The Failure Mode and Effects Analysis Implementation for Laser Marking Process Improvement: A Case Study

  • Deng, Wei-Jaw;Chiu, Chung-Ching;Tsai, Chih-Hung
    • International Journal of Quality Innovation
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    • v.8 no.1
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    • pp.137-153
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    • 2007
  • Failure mode and effects analysis (FMEA) is a preventive technique in reliability management field. The successful implementation of FMEA technique can avoid or reduce the probability of system failure and achieve good product quality. The FMEA technique had applied in vest scopes which include aerospace, automatic, electronic, mechanic and service industry. The marking process is one of the back ends testing process that is the final process in semiconductor process. The marking process failure can cause bad final product quality and return although is not a primary process. So, how to improve the quality of marking process is one of important production job for semiconductor testing factory. This research firstly implements FMEA technique in laser marking process improvement on semiconductor testing factory and finds out which subsystem has priority failure risk. Secondly, a CCD position solution for priority failure risk subsystem is provided and evaluated. According analysis result, FMEA and CCD position implementation solution for laser marking process improvement can increase yield rate and reduce production cost. Implementation method of this research can provide semiconductor testing factory for reference in laser marking process improvement.

APC Technique and Fault Detection and Classification System in Semiconductor Manufacturing Process (반도체 공정에서의 APC 기법 및 이상감지 및 분류 시스템)

  • Ha, Dae-Geun;Koo, Jun-Mo;Park, Dam-Dae;Han, Chong-Hun
    • Journal of Institute of Control, Robotics and Systems
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    • v.21 no.9
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    • pp.875-880
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    • 2015
  • Traditional semiconductor process control has been performed through statistical process control techniques in a constant process-recipe conditions. However, the complexity of the interior of the etching apparatus plasma physics, quantitative modeling of process conditions due to the many difficult features constraints apply simple SISO control scheme. The introduction of the Advanced Process Control (APC) as a way to overcome the limits has been using the APC process control methodology run-to-run, wafer-to-wafer, or the yield of the semiconductor manufacturing process to the real-time process control, performance, it is possible to improve production. In addition, it is possible to establish a hierarchical structure of the process control made by the process control unit and associated algorithms and etching apparatus, the process unit, the overall process. In this study, the research focused on the methodology and monitoring improvements in performance needed to consider the process management of future developments in the semiconductor manufacturing process in accordance with the age of the APC analysis in real applications of the semiconductor manufacturing process and process fault diagnosis and control techniques in progress.

Intelligent Decision System for Purging a Residual Gas inside Tubing in Semiconductor Process (반도체공정의 Tubing 내 잔여가스제거 지적결정시스템)

  • Lee, Sa-Hwan;Huh, Yong-Jeong;Choi, Seong-Joo;Lee, Jong-Rark
    • Journal of the Semiconductor & Display Technology
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    • v.5 no.4 s.17
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    • pp.23-27
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    • 2006
  • Semiconductor industry has been dramatically developed with the information era of 21C, and the trend now is to consider that the technology of management system of the computer utility that has a high efficiency is important. This study investigated the intelligent decision system for residual gas purge process to effectively remove the residual gas in the tube after replacing the cylinder that is used for the gas cabinet or BSGS(Bulk Specialty Gas Supply System) of the semiconductor process. It was suggest from this study that it is possible to decide the type, frequency and volume of purge gas using various toxic gases which is necessary for each process. Also, this result will be utilized for operating the system, increasing the efficiency of management and saving energy.

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Research for Adaptive DeadBand Control in Semiconductor Manufacturing (Adaptive DeadBand를 애용한 반도체공정 제어)

  • Kim Jun-Seok;Ko Hyo-Heon;Kim Sung-Shick
    • Journal of the Korea Safety Management & Science
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    • v.7 no.5
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    • pp.255-273
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    • 2005
  • Overlay parameter control of the semiconductor photolithography process is researched in this paper. Overlay parameters denote the error in superposing the current pattern to the pattern previously created. The reduction of the overlay deviation is one of the key factors in improving the quality of the semiconductor products. The semiconductor process is affected by numerous environment and equipment factors. Through process condition prediction and control, the overlay inaccuracy can be reduced. Generally, three types of process condition change exist; uncontrollable white noise, slowly changing drift, and abrupt condition shift. To effectively control the aforementioned process changes, control scheme using adaptive deadband is proposed. The suggested approach and existing control method are cross evaluated through simulation.

Molecular Dynamics study of Aluminum growth using Aluminum Cluster Deposition (알루미늄 덩어리를 사용한 알루미늄 성장에 관한 분자동력학 연구)

  • J.W. Kang;K.R. Byun;W.H. Mun;E.S. Kang;H.J. Hwang
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.306-309
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    • 2000
  • In this work, we investigated A1 cluster deposition on Al (100) surface using molecular dynamics simulation. A result of simulations showed that large cluster with low energy was proper for good surfaced-films without craters at the low temperatures. We investigated the maximum substrate temperature and the time taken for substrate temperature to reach its maximum as a function of cluster size in the case of the same total energy and in the case of the same energy Per atom. The correlated collisions play an important role in interaction between energetic cluster and surface, and as cluster size and cluster energy increases, the correlated collisions effect affects interaction between energetic cluster and surface.

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Exposure Characteristics for Chemical Substances and Work Environmental Management in the Semiconductor Assembly Process (반도체 조립공정의 화학물질 노출특성 및 작업환경관리)

  • Park, Seung-Hyun;Park, Hae Dong;Shin, In Jae
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.24 no.3
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    • pp.272-280
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    • 2014
  • Objectives: The purpose of this study was to evaluate the characteristics of worker exposure to hazardous chemical substances and propose the direction of work environment management for protecting worker's health in the semiconductor assembly process. Methods: Four assembly lines at two semiconductor manufacturing companies were selected for this study. We investigated the types of chemicals that were used and generated during the assembly process, and evaluated the workers' exposure levels to hazardous chemicals such as benzene and formaldehyde and the current work environment management in the semiconductor assembly process. Results: Most of the chemicals used at the assembly process are complex mixtures with high molecular weight such as adhesives and epoxy molding compounds(EMCs). These complex mixtures are stable when they are used at room temperature. However workers can be exposed to volatile organic compounds(VOCs) such as benzene and formaldehyde when they are used at high temperature over $100^{\circ}C$. The concentration levels of benzene and formaldehyde in chip molding process were higher than other processes. The reason was that by-products were generated during the mold process due to thermal decomposition of EMC and machine cleaner at the process temperature($180^{\circ}C$). Conclusions: Most of the employees working at semiconductor assembly process are exposed directly or indirectly to various chemicals. Although the concentration levels are very lower than occupational exposure limits, workers can be exposed to carcinogens such as benzene and formaldehyde. Therefore, workers employed in the semiconductor assembly process should be informed of these exposure characteristics.

A Design of Integrated Manufacturing System for Compound Semiconductor Fabrication (화합물 반도체 공장의 통합생산시스템 설계에 관한 연구)

  • 이승우;박지훈;이화기
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.26 no.3
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    • pp.67-73
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    • 2003
  • Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study we design the integrated manufacturing system for compound semiconductor fabrication t hat has monitoring of process, reduction of lead-time, obedience of due-dates and so on. This study presents integrated manufacturing system having database system that based on web and data acquisition system. And we will implement them in the actual compound semiconductor fabrication.