• 한국CDE학회논문집
• /
• 제19권3호
• /
• pp.214-223
• /
• 2014

This paper presents a bottleneck detection framework using simulation approach in a wafer FAB (Fabrication). In a semiconductor manufacturing industry, wafer FAB facility contains various equipment and dozens kinds of wafer products. The wafer FAB has many characteristics, such as re-entrant processing flow, batch tools. The performance of a complex manufacturing system (i.e. semiconductor wafer FAB) is mainly decided by a bottleneck. This paper defines the problem of a bottleneck process and propose a simulation based framework for bottleneck detection. The bottleneck is not the viewpoint of a machine, but the viewpoint of a step with the highest WIP in its upstream buffer and severe fluctuation. In this paper, focus on the classification of bottleneck steps and then verify the steps are not in a starvation state in last, regardless of dispatching rules. By the proposed framework of this paper, the performance of a wafer FAB is improved in on-time delivery and the mean of minimum of cycle time.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
• /
• pp.76.1-76.1
• /
• 2013

Atomic Layer Deposition (ALD) has remarkably developed in semiconductor and nano-structure applications since early 1990. Now, the advantages of ALD process are well-known as controlling atomic-level-thickness, manipulating atomic-level-composition control, and depositing impurity-free films uniformly. These unique properties may accelerate ALD related industries and applications in various functional thin film markets. On the other hand, one of big markets, Display industry, just starts to look at the potential to adopt ALD functional films in emerging display applications, such as transparent and flexible displays. Unlike conventional ALD process strategies (good quality films and stable precursors at high deposition processes), recently major display industries have suggested the following requirements: large area equipment, reasonable throughput, low temperature process, and cost-effective functional precursors. In this talk, it will be mentioned some demands of display industries for applying ALD processes and/or functional films, in terms of emerging display technologies. In fact, the AMOLED (active matrix organic light emitting diode) Television markets are just starting at early 2013. There are a few possibilities and needs to be developing for AMOLED, Flexible and transparent Display markets. Moreover, some basic results will be shown to specify ALD display applications, including transparent conduction oxide, oxide semiconductor, passivation and barrier films.

• 반도체디스플레이기술학회지
• /
• 제21권2호
• /
• pp.74-84
• /
• 2022

As the semiconductor industry develops, the difficulty of newly required process technology becomes difficult, and the importance of production yield and product reliability increases. As an effort to minimize yield loss in the manufacturing process, interests in the process defect process for facility diagnosis and defect identification are continuously increasing. This research observed the plasma condition changes in the multi oxide/nitride layer deposition (MOLD) process, which is one of the 3D-NAND manufacturing processes through optical emission spectroscopy (OES) and monitored the result of whether the change in plasma characteristics generated in repeated deposition of oxide film and nitride film could directly affect the film. Based on these results, it was confirmed that if a change over a certain period occurs, a change in the plasma characteristics was detected. The change may affect the quality of oxide film, such as the film thickness as well as the interfacial surface roughness when the oxide and nitride thin film deposited by plasma enhenced chemical vapor deposition (PECVD) method.

• 한국분말재료학회지
• /
• 제30권2호
• /
• pp.156-168
• /
• 2023

The semiconductor industry faces physical limitations due to its top-down manufacturing processes. High cost of EUV equipment, time loss during tens or hundreds of photolithography steps, overlay, etch process errors, and contamination issues owing to photolithography still exist and may become more serious with the miniaturization of semiconductor devices. Therefore, a bottom-up approach is required to overcome these issues. The key technology that enables bottom-up semiconductor manufacturing is area-selective atomic layer deposition (ASALD). Here, various ASALD processes for elemental metals, such as Co, Cu, Ir, Ni, Pt, and Ru, are reviewed. Surface treatments using chemical species, such as self-assembled monolayers and small-molecule inhibitors, to control the hydrophilicity of the surface have been introduced. Finally, we discuss the future applications of metal ASALD processes.

• 반도체디스플레이기술학회지
• /
• 제22권3호
• /
• pp.8-13
• /
• 2023

High bandwidth memory a core technology of the future memory semiconductor industry, is attracting attention. Temporary bonding and debonding process technology, which plays an important role in high bandwidth memory process technology, is also being studied. In this process, total thickness variation is a major factor determining wafer performance. In this study, the reliability of the equipment measuring total thickness variation is identified, and the servo motor settling, and wafer total thickness variation measurement accuracy are analyzed. As for the experimental variables, vacuum, acceleration time, and speed are changed to find the most efficient value by comparing the stabilization time. The smaller the vacuum and the larger the radius, the longer the settling time. If the radius is small, high-speed rotation performance is good, and if the radius is large, low-speed rotation performance is good. In the future, we plan to conduct an experiment to measure the entire of the wafer.

• 한국표면공학회지
• /
• 제57권3호
• /
• pp.165-178
• /
• 2024

In semiconductor memory device manufacturing, the capability for high aspect ratio contact (HARC) etching determines the density of memory device. Given that there is no standardized definition of "high" in high aspect ratio, it is crucial to continuously monitor recent technology trends to address technological gaps. Not only semiconductor memory manufacturing companies such as Samsung Electronics, SK Hynix, and Micron but also semiconductor manufacturing equipment companies such as Lam Research, Applied Materials, Tokyo Electron, and SEMES release annual reports on HARC etching technology. Although there is a gap in technological focus between semiconductor mass production environments and various research institutes, the results from these institutes significantly contribute by demonstrating fundamental mechanisms with empirical evidence, often in collaboration with industry researchers. This paper reviews recent studies on HARC etching and the study of dielectric etching in various technologies.

• 반도체디스플레이기술학회지
• /
• 제23권2호
• /
• pp.1-5
• /
• 2024

In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.

• 한국정보시스템학회지:정보시스템연구
• /
• 제26권2호
• /
• pp.105-121
• /
• 2017

Purpose It is a major goal to improve the product yields during production operations in the manufacturing industry. Therefore, factory is trying to keep the good quality materials and proper production resources, also find the proper condition of facilities and manufacturing environment for yields improvement. Design/methodology/approach We propose the hybrid framework to analyze to dataset extracted from MES. Those data is about the alarm information generated from equipment, both measurement and equipment process value from production and cycle/pitch time measured from production data these covered products during production. We adapt a data warehousing techniques for organizing dataset, a logistic regression for finding out the significant factors, and a association analysis for drawing the rules which affect the product yields. And then we validate the framework by applying the real data generated from the discrete process in secondary cell battery manufacturing. Findings This paper deals with challenges to apply the full potential of modeling and simulation within CPPS(Cyber-Physical Production System) and Smart Factory implementation. The framework is being applied in one of the most advanced and complex industrial sectors like semiconductor, display, and automotive industry.

• 청정기술
• /
• 제4권1호
• /
• pp.6-23
• /
• 1998

반도체 산업은 각종 전자지기의 발달로 급격히 성장하였으며 현재는 우리 나라에서도 반도체 산업이 경제에서 큰 비중을 차지하고 있다. 국내외의 환경규제와 환경에 대한 대중의 관심이 높아지면서, 반도체 공정의 안전한 관리와 환경유해성 물질의 배출억제를 위하여 반도체 산업에서의 청정기술의 개발이 시급한 과제가 되고 있다. 청정기술이란 근본적으로 환경유해성 오염물질을 배출하지 않는 기술을 의미하나 이는 지금까지 개발된 기술로는 거의 불가능하다. 따라서 공정 내에서부터 환경유해물질의 배출을 최소화하는 기술도 청정기술의 범위에 포함시킨다. 반도체 공정은 연속적인 화학공정들로 구성되어 있으며 그 과정에서 많은 종류의 환경유해성 오염물질이 배출될 수 있다. 반도체 공정에서 발생하는 오염물질들은 기상 형태의 배가스, 액상 형태의 폐수, 폐기물의 세 가지 형태로 나누어 볼 수 있다. 기상의 오염물질을 억제하기 위한 기술로는 오염물질만을 선택적으로 파괴하거나 오염물질만을 농축하여 공정 내에서 재활용하는 방법, 또는 오염을 유발하는 물질 대신 이를 대체할 수 있는 환경에 안전한 물질을 개발하는 방법 등이 있다. 액상의 오염물질을 저감시키는 기술로는 공정의 최적화를 통하여 오염물질의 양을 최소화하는 방법과 유독한 물질로 구성된 원료를 대체하는 방법 등이 있다. 또한 근본적인 오염원을 제거하기 위하여 화학물질의 사용량 자체를 줄이거나 기상을 이용한 세정 시스템 등의 방법을 사용하는 것도 연구중이다.

• 한국전자통신학회논문지
• /
• 제15권3호
• /
• pp.389-396
• /
• 2020

좋은 품질의 제품을 얻기 위해서는 제품 자체에 대한 품질 적합성 검사 이전에 생산 및 시험 관련 설비에 대한 적절한 검증이 반드시 선행되어야 한다. 다양한 생산 및 시험 관련 설비 중에서도 ATE는 오늘날 자동차산업, 항공·우주산업, 반도체산업과 같은 민간분야 뿐만 아니라, 방위산업의 군수품 생산 및 성능시험에도 활발히 사용되고 있다. 본 논문은 다양한 방법을 활용하여 군용 FM 무전기 세트의 자동시험장비 인 ATS에 대해 체계적으로 설계 적합성 검증을 실시 한 결과를 다루고 있으며, 군수품 ATE에 대한 설계 적합성 검증 절차가 명문화 되어있지 않은 현 시점에 좋은 참고자료가 될 것으로 기대된다.